LCP ET 88,9x12,7x150/4Pass_Cu Cold Plate

Flat, Bent, Finned or Embedded; Thermal Conductivity 5,000-200,000 W/m•K; Heat Transfer Over Relatively Long Distances; Long Life; No Maintenance Noren’s unique technology and design process allow to create customized heat pipe systems with intricate bends, angles and flatness. Long life and no maintenance are added benefits of Noren’s heat pipe designs and assemblies Heat pipes can be implemented for a wide variety of applications and can be designed in any combination of bends, planes, angles and dimensions. Whether flat, bent, finned or embedded, Noren’s custom heat pipes and heat sinks are designed to optimize the thermal management capabilities of virtually any application. Heat pipes are the most common passive, capillary-driven of the two-phase systems. Two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. As the heat pipe technology industry leader, Noren products has specialized in the design and development and manufacturing of passive, two-phase heat transfer devices since 1968. Heat pipes have an extremely effective high thermal conductivity. While solid conductors such as aluminium, copper, graphite and diamond have thermal conductivities ranging from 250 W/m•K to 1,500 W/m•K, heat pipes have effective thermal conductivities that range from 5,000 W/m•K to 200,000 W/m•K. Heat pipes transfer heat from the heat source (evaporator) to the heat sink (condenser) over relatively long distances through the latent heat of vaporization of a working fluid. Heat pipes typically have 3 sections: an evaporator section (heat input/source), adiabatic (or transport) section and a condenser section (heat output/sink). To better solve your thermal removal requirements, Noren’s heat pipes offer the unique ability to achieve different bends, planes and dimensions within designs. Noren is able to create solutions with multiple angles and planes, all while maintaining the heat transfer needed for your custom application. Standard Bend Radiuses for Heat Pipes:   Round Bent Pipe Center-line Bending Radius [mm Round Bent-Flattened Pipe Center-line Bending Radius [mm] Flattened-Bent Pipe Inside Bending Radius [mm] Tube Diameter [mm] Standard Minimum Standard Minimum Standard Minimum Ø 3,18 9,53 4,78 9,53 4,78 6,35 3,18 Ø 4,75 11,13 5,54 11,13 5,54 6,35 3,18 Ø 6,35 14,30 9,53 14,30 9,53 9,53 4,75 Ø 7,92 17,48 13,49 17,48 13,49 9,53 4,75 Ø 9,53 23,83 14,27 23,83 14,27 12,70 6,35 Ø 12,70 38,10 22,23 38,10 22,23 19,05 9,53 Ø 15,88 38,10 30,18 38,10 30,18 25,40 12,70 Noren also offers and delivers custom bending solutions. Noren’s experienced engineers and production team consistently produce exceptional heat transfer in various configurations. Get in touch with the AMS Technologies thermal management experts today to discuss your customized heat pipe solution tailored to your project’s challenges. Key Features: Any Combination of Bends, Planes, Angles and Dimensions Flat, Bent, Finned or Embedded Extremely High Thermal Conductivity: 5,000 to 200,000 W/m•K Heat Transfer From Heat Source to Heat Sink Over Relatively Long Distances Long Life No Maintenance Flat, Bent, Finned or Embedded Applications: Optimize the Thermal Management Capabilities of Virtually Any Application

0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square Our high performance cold plates made from friction stir welded aluminium are the ideal solution for cooling demanding power semiconductors and modules. Within our range, a variety of models are available from a 1.4 kg cold plate dedicated to one press pack disk semiconductor all the way to a large and powerful 22.6 kg version capable of dissipating the heat of six 140 mm x 190 mm IGBT modules. In addition to various standard configurations, our thermal management experts are happy to customize solutions regarding thermodynamics and fluid dynamics as well as the configuration of power modules. The use of friction stir welding technology (FSW) makes the production of our cold plates both safe and economical. Friction stir welding technology permits particularly homogeneous joints without additional welding material. Due to this homogeneity of the material, FSW joints are particularly corrosion-resistant and can withstand high loads. With their high heat dissipation capacity, the cold plates are suitable for the following applications, among others: 62 mm Power Semiconductor Modules 150 x 166 mm Cold Plates 140 x 190 mm Power Semiconductor Modules PrimePACK 3 Power Semiconductor Modules EconoPack Power Semiconductor Modules Press-Pack Discs Aluminium water cold plates for IGBT modules are available in standard configurations, suitable for 130x140, 140x190, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Infineon PrimePACK2 and PrimePACK3, EconoDual3, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. When cooling press pack power semiconductor discs, even and uniform pressure distribution is very important. Our FSW cold plates, specially designed for cooling press packs, are suitable for 4", 5" and 6" discs, offering a solid construction, perfectly flat surfaces for an optimal contact to the power semiconductor as well as very good thermal performance. For optimum handling, we offer different options for centering the Press Pack discs as well as tools for replacement.