Liquid to Liquid Thermal Management Assemblies

Cooling Capacity 20, 150 kW; Connections 3/4'' FNPT, 2” Copper Flange; Temperature Stability ±0.5, ±1.0 °C; Facility Water Temperature +10 to +35 °C, +4 to +12 °C; CE Certified Lytron’s LCS series of liquid-to-liquid cooling systems is an excellent solution for high heat-load or high ambient temperature applications where chilled facility water is available. The LCS series offers precise temperature control of process water and transfers the waste heat to your facility water via a liquid-to-liquid heat exchanger. With 20 kW of cooling, Lytron’s LCS20 provides over three times the capacity of a comparably-sized recirculating chiller, providing a great solution for high heat loads where space is at a premium. Designed for data center cooling, Lytron’s LCS50 is a 150 kW liquid-to-liquid cooling system that supplies precisely temperature-controlled coolant to your liquid cooled racks and transfers the waste heat to facility water. Key Features: Large Cooling Capacity (20, 150 kW) in a Compact Package Tight Temperature Control: ±0.5, ±1.0 °C (Despite Fluctuations in the Facility Water Temperature and Flow Rate) Contamination-free: Process Cooling Loop Isolated from the Facility Water Reliable, Quiet and Energy-efficient Fluid Connections: ¾” FNPT (LCS20), 2” Copper Flange (LCS50) Coolant Temperature Range: +10 to +60 °C (LCS20), +5 to +35 °C (LCS50) Facility Water Temperature Range: +10 to +35 °C (LCS20), +4 to +12 °C (LCS50) Facility Flow Rate: 8 to 38 l/min (LCS20), 95 to 379 l/min (LCS50) Maximum Facility Pressure: 7 bar Ambient Temperature Range: +5 to +40 °C Applications: Electronics Cooling; High Heat-load or High Ambient Temperature Applications Where Chilled Facility Water is Available

Cooling Capacities 350 - >600W @ 20°C; Noise @ 1 m < 48 dBA ;Tank Volume 300 ml; Gear or Centrifugal Pump; Process Wetted Materials Aluminium; Facility Wetted Materials Stainless SteelThe ThermoCube II Liquid-to-Liquid Recirculating Chiller by Solid State Cooling Systems is a high-performance thermoelectric solution designed for environments where facility water or process chilled water (PCW) is available. This next-generation chiller offers precise temperature control, whisper-quiet operation, and exceptional configurability, making it ideal for demanding laboratory, semiconductor, and OEM applications.Unlike conventional air-cooled systems, the ThermoCube II Liquid-to-Liquid removes heat using PCW, eliminating the need for fans and heat sinks. This design significantly reduces noise and vibration while enhancing thermal efficiency. With a cooling capacity of up to 600 watts at 20°C and a temperature stability of ±0.05°C, the unit ensures consistent performance even near ambient conditions. Its compact footprint—13 x 11 x 13 inches (32 x 28 x 32 cm)—and lightweight build (28 lbs / 13 kg) allow easy integration into space-constrained setups.Key FeaturesLiquid-to-Liquid Heat Removal: Uses facility water or PCW to dissipate heat, ideal for installations with existing chilled water infrastructure.Thermoelectric Technology: Solid-state cooling with no refrigerants or compressors, ensuring long life and low maintenance.High Precision Control: Digital PID controller maintains ±0.05°C stability across a standard operating range of 5°C to 50°C (extendable to -10°C or 65°C).Quiet and Vibration-Free: Operates below 48 dBA, making it suitable for sensitive environments.Flexible Configuration: Offers 6 pump types (centrifugal or gear) and 8 fitting options including John Guest, CPC, and Swagelok.Universal Power Input: 100–240 VAC, 50/60 Hz, plug-and-play compatibility worldwide.Advanced Communication: RS232, RS485, Ethernet, and TTL interfaces for seamless system integration.Robust Construction: Stainless steel cold plate and facility wetted materials for corrosion resistance and long-term reliability.Safety and Compliance: Equipped with alarms for temperature, fluid level, and system faults; certified to UL, CE, CAN/CSA, and RoHS standards.ApplicationsSemiconductor Equipment: Maintains precise thermal conditions for wafer processing and lithography systems.Life Sciences and Biotech: Supports temperature-sensitive assays, microfluidics, and sample preparation.Laser Cooling: Provides stable cooling for diode lasers and photonics systems requiring high-pressure fluid delivery.Electron Microscopy: Ensures consistent thermal control for scanning electron microscopes and imaging platforms.OEM Integration: Easily embedded into diagnostic, analytical, and industrial systems with existing PCW infrastructure.What's Next?If your facility has access to process chilled water and requires compact, reliable, and precise thermal control, the ThermoCube II Liquid-to-Liquid Recirculating Chiller is the ideal solution. With its modular design, solid-state reliability, and global compatibility, it delivers performance tailored to your application.Contact our sales team today to discuss your configuration needs, request a quote, or explore integration options for your system.