Hertzstück™ PbS Bare Chip & Module Line Array NIR Detectors
Product information "Hertzstück™ PbS Bare Chip & Module Line Array NIR Detectors"
Wavelength Range 1-3 µm; Time Constant 200 µs Typ.; No. of Pixels 1-512; No. of Lines 1; Min. Pixel Width/Height 20 µm; Dark Resistance 3-30 MΩ; Peak Wavelength 2.7 µm
Hertzstück™ PbS lead salt near-infrared (NIR) line array detectors by trinamiX are available as bare chips or encapsulated modules, with up to 512 pixels and a pitch starting from 50 µm. Further customization is possible. The detectors cover a wide spectral range (wavelength 1 µm to 3 µm), which is highly relevant for applications in inline or mobile process analytics, quality control and gas sensing.
For PbS NIR detectors as single-pixel, multi-single-pixel and multi-pixel versions, please refer to the Hertzstück™ PbS Bare Chip & TO-Package NIR Detectors series.
Due to their unique thin-film encapsulation for longer lifetime and highest detectivity at room temperature, Hertzstück™ PbS bare chip line array NIR detectors can be directly wire-bonded to printed circuit boards.
The Hertzstück™ PbS module line array NIR detectors comprise a 256-pixel PbS array and a corresponding read-out electronics in a hermetic PS28 package. These devices provide frame rates up to 1 kHz and feature thermo electric (TEC) temperature stabilization as well as an analog multiplex output. Optimum transmittance in the accepted wavelength range is ensured by an AR-coated sapphire window. Thanks to their low power consumption, Hertzstück™ PbS array modules are the ideal solution for mobile applications such as handheld spectrometers.
Three different evaluation kits enable users to easily compare different varieties of the Hertzstück™ PbS NIR detectors and to quickly develop circuit designs for their applications.
Key Features:
- High Stability and Long Lifetime Through Thin-film Encapsulation
- PbS Detector for Wavelengths From 1 to 3 µm
- Peak Detectivity at Room Temperature (620 Hz, 1 Hz): 1 x 1011 cm·Hz½/W Typical
- Readily Available in Large Scale
- Very High Sensitivity
- Suitable for Automated Wire-bonding (Bare Chip Version)
- Double Encapsulation: Thin-film and PS28 Housing With Sapphire Window (Module Version)
- 1-Stage Thermoelectric Cooler (TEC) Included (Module Version)
- Minimum Pixel Width/Height: 20 µm
- Minimum Pixel Pitch: 50 µm
- Minimum Chip Length/Height: 3 mm
- Number of Pixels: 1-512
- Peak Wavelength: 2.7 µm Typical
- 20% Cut-off Wavelength: 2.9 µm Typical
- Time Constant: 200 µs Typical
- Dark Resistance: 3-30 MΩ
Applications: NIR Spectroscopy; Fire & Spark Detection; Flame Monitoring; Moisture Monitoring