Hertzstück™ PbS Bare Chip & TO-Package NIR Detectors
Downloads
- Hertzstueck PbS Bare Chip Multi-Pixel NIR Detectors trinamiX Datasheet
- Hertzstueck PbS Bare Chip Single-Pixel NIR Detectors trinamiX Datasheet
- Hertzstueck PbS TO-Package Single-Pixel NIR Detectors trinamiX Datasheet
- Hertzstueck PbS Bare Chip Multi-Single-Pixel NIR Detectors trinamiX Datasheet
- Hertzstueck PbS_PbSe TE-Cooled TO-8 Package Single-Pixel NIR Detectors trinamiX Datasheet
- Measuring Infrared Radiation Using trinamiX PbS & PbSe NIR Detectors trinamiX White Paper
- Hertzstueck PbS030030BC_PCB PbS Bare Chip on PCB Single-Pixel NIR Detector trinamiX Example Datasheet
Product information "Hertzstück™ PbS Bare Chip & TO-Package NIR Detectors"
Wavelength Range 1-3 µm; Active Area per Pixel 0.5x0.5-10x10 mm; Time Constant 200 µs Typ.; No. of Pixels 1-16; No. of Lines 1-4; Min. Pixel Width/Height 20, 1,000 µm; Dark Resistance 0.3-15 MΩ; Peak Wavelength 2.7 µm
Hertzstück™ PbS lead salt near-infrared (NIR) detectors by trinamiX are available as single-pixel, multi-single-pixel and multi-pixel versions. For PbS NIR detector line arrays, please refer to the Hertzstück™ PbS Bare Chip & Module Line Array NIR Detectors series.
The detectors cover a wide spectral range, which is highly relevant for applications in inline or mobile process analytics, quality control and gas sensing. The bare chips of trinamiX’ Hertzstück™ series PbS lead salt near-infrared (NIR) detectors and detector arrays are protected by a unique thin-film encapsulation for longer lifetime and highest detectivity at room temperature.
Bare-chip solutions enable small, flexible and very efficient devices and can be directly wire-bonded to printed circuit boards. Single- and multi-single-pixel versions are also available on small, pre-bonded, solderable adapter PCBs, allowing customers without wire-bonding expertise or capabilities to benefit from the detectors’ patented thin-film encapsulation, pick and place compatibility, small footprint and large field of view.
Direct access to the thin-film encapsulated sensor surface without lossy entrance windows is crucial for compact solutions, applications with low signal levels, or optimal coupling with optical fibers. The adapter PCBs come in various sizes starting at 5 x 6 mm and a module height of 1 mm. Four castellated holes on the outer PCB edges serve as solder pads and make it possible to mount these detector modules directly onto any system PCB.
Beyond bare chip versions, the Hertzstück™ PbS series single-pixel NIR detectors are also available housed in TO-packages with double encapsulation – not only protected by a standard TO package, but also by the thin-film encapsulation directly on the chip.
TO-packaged PbS single-pixel NIR detectors are as well offered with an integrated thermoelectric cooler (TEC). All TEC-based trinamiX detectors incorporate a thermistor which allows for a precise temperature stabilization of the active element. The single- and two-stage TECs provide for operation at extremely low temperatures for increased detectivity and sensitivity at larger wavelengths independent of the ambient conditions.
Hertzstück™ PbS multi-single-pixel bare chip NIR detectors consist of 2 to 16 single pixels in line or matrix design, wire-bonded on PCB. The usage of single pixel detectors enables high flexibility regarding setup and filters.
Hertzstück™ PbS multi-pixel bare chip NIR detectors consist of 2 to 16 pixels in line or matrix design, realized directly on the substrate. This technology provides high durability for rugged operation as well as bondable electrodes for COB mounting and is suitable for automated wire-bonding.
Three different evaluation kits enable users to easily compare different varieties of the Hertzstück™ PbS NIR detectors and to quickly develop circuit designs for their applications.
Key Features:
- Single Pixel, Multi-Single-Pixel and Multi-Pixel Versions available
- Small Footprint, High Stability and Long Lifetime Through New Thin-film Encapsulation
- Double Encapsulation & Sapphire Window (TO-Package Versions)
- Minimum Pixel Width/Height: 0.5 mm (Single-pixel), 1 mm (Multi-single-pixel), 20 µm (Multi-pixel)
- Multi-pixel Minimum Chip Length/Height: 3 mm
- Active Area per Pixel: 0.5 x 0.5 mm to 10 x 10 mm
- Number of Pixels: 2-8 (Multi-single-pixel), 2-16 (Multi-pixel)
- Number of Lines: 1-3 (Multi-single-pixel), 1-4 (Multi-pixel)
- Bondable Contacts or Solder Pads for PCB Mounting
- Compatible With Industry-standard Production Methods
- Wavelength Range: 1-3 µm
- Peak Wavelength: 2.7 µm
- 20% Cut-off Wavelength λC: 2.9 µm
- Dark Resistance: 0.3-15 MΩ
- Room Temperature Operation
- Very High Sensitivity
- Peak Detectivity at Room Temperature (620 Hz, 1 Hz): 1 x 1011 cm·Hz½/W Typical
- Peak Responsivity (Single- & Multi-single-pixel): 0.6x105 to 16x105 V/W Typical
- Time Constant: 200 µs Typical
- Extensive Quality Control
Applications: Gas Sensing; Gas Detection & Analysis; Moisture Monitoring; Flame & Spark Detection; Flame Monitoring; NIR Spectroscopy; Temperature Measurement; Rapid Prototyping