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SmarTThermoelectrics
M-Series Small TECs
Small Multi Stage Peltier Modules; 3 x 3 to 21 x 21 mm; Height 2.7 to 10.2 mm; Max. Cooling Capacity 0.12 to 14 W; Max. TEC Current 0.32 to 7.8 A
With SmarTThermoelectrics’ M-Series, AMS Technologies offers multi stage small thermoelectric coolers (TECs, Peltier Modules) from two to five cascades with maximum temperature differences between its cold and hot side of up to 130 K. Here you can find cascade TECs with standard pyramidal design, TECs with enlarged surface of the top cascade (cold side) to work with relatively big cooled objects as well as linear cascade TECs, especially designed for deep cooling of long objects like CCDs or detector arrays. The M-Series’ bottom dimensions range from 3 × 3 to 21 × 21 mm and heights from 2.7 to 10.2 mm, with maximum cooling capacities from 0.12 to 14 W.
The MS subseries of multi stage small thermoelectric coolers provides TECs with standard pyramidal design from 2 to 5 stage cascade, while the ME subseries features an enlarged surface of the top cascade (TEC cold side = TEC hot side). This technology enables the ME subseries to provide the same cooling capacities and temperature differences as traditional pyramidal TECs but at bigger surface area of the cold side. Increased area and mechanical strength of the top cascades gives a possibility to work with relatively big cooled objects.
Linear cascade multi stage small thermoelectric coolers are the domain of SmarTThermoelectrics’ ML subseries. This variation of the ME-subseries TECs is especially designed for deep cooling of oblong objects like CCDs, detector arrays etc. And last but not least, the MI series of multi stage small thermoelectric coolers provides cascade TECs implemented with increased TE pellet density technology and thus with increased cooling density for demanding applications.
Key Features:
Miniature Size- Multi Stage
Standard Pyramidal, Linear or Enlarged Cold Side Format
Ideal for Assembly into Various Sockets, Packages & Housings
High Temperature Difference
Applications: Cooling and Temperature Control of Semiconductor Lasers, LEDs, X-ray and IR Detectors, CCDs, CPUs
Product number:
SW10657
Manufacturer:
SmarTThermoelectrics
S-Series Small TECs
Small Peltier Module; 1.6 x 3.2 to 21 x 21 mm; Height 1.65 to 4.1 mm; Max. Cooling Capacity 0.27 to 11.5 W; Max. TEC Current 0.55 to 9.7 A
SmarTThermoelectrics’ S-Series is a line of standard rectangular single stage small thermoelectric coolers (Peltier modules) providing maximum temperature difference up to 76 K. This series includes models ranging from standard rectangular and linear TECs to special variants with increased cooling capacity.
Here you will find TECs with dimensions from really tiny 1.2 × 1.8 to somewhat larger 21 × 21 mm and heights from 1.1 to 4.1 mm. These TECs’ maximum cooling capacities range from 0.12 to 62 W.
Key Features:
Miniature Size
Rectangular or Linear Format
Single Stage
Ideal for Assembly into Various Sockets, Packages & Housings like TO-CANs, Butterfly, etc.
High Temperature Difference
Applications: Cooling and Temperature Control of Semiconductor Lasers, LEDs, X-ray and IR Detectors, CCDs, CPUs
Product number:
SW10570
Manufacturer:
SmarTThermoelectrics
SmarTThermoelectrics is a Russian manufacturer. Due to the political situation, we are no longer allowed to import their products. If you are interested in their products, please contact us, as we have connections with several manufacturers.
SmarTThermoelectrics is specialized in the design, development and manufacturing of small sized thermoelectric coolers (TECs) and completed thermal management systems based on these TECs. The thermoelectric products are often integral part to the electronic and optoelectronic components, assemblies and systems in variety of industrial sectors: telecommunications, medical, aerospace, automotive, military, consumer electronics, science and education etc.
The TECs are widely used for cooling and temperature control of semiconductor lasers, light emitting diodes (LEDs), X-Ray and IR detectors, Charged Coupled Devices (CCD), central processor units (CPUs) and many other objects where localized/spot heat rejection or heating is needed.