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XIH8800 Crane High Energy X-Ray Line Scan Cameras

Product information "XIH8800 Crane High Energy X-Ray Line Scan Cameras"

Photodiode Detector Array; Pixel Pitch 0.05-1.6 mm; X-Ray Energy 0.05-15 MeV; Scintillator GOS:Tb, CsI:Tl, CWO; Length ≥308 mm; Interface GigE, USB3.0, Camera Link

X-Scan’s XIH8800 Crane series of line scan cameras are designed for high-energy x-ray and gamma-ray scanning applications ranging from 100 keV to 15 MeV energy levels. High-energy accelerators, collimators and detectors such as the XIH8800 are required to image large, dense objects such as metal castings and steel objects whose thickness can range from 25.4 to 305 mm.

Fan-beam collimation minimize the scattering that limits image contrast. A clever compact design combines scintillation (for conversion of high-energy photons to visible light) and fiber optics for conveying the visible light to a shielded off-axis linear imaging photodiode array.

A tungsten housing shields the diode array and camera electronics against scatter and ensures long-life reliability under extreme radiation conditions.

The GigE interface option featuring long cable lengths is recommended for high-energy applications. The XIH8800 Crane high-energy x-ray line scan camera modules include a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available.

Key Features:

  • Off-axis, Fiber Optic Design for High-energy Reliability in a Compact Form Factor
  • Energy Range: 50 keV to 15 MeV
  • Choice of Scintillators: GOS:Tb, CsI:Tl, CWO
  • Wide Range of Resolutions & Selection of Lengths
  • Incorporates X-Scan Imaging’s Proprietary Photodiode Arrays
  • Selectable Resolution
  • Low Noise
  • Wide Dynamic Range
  • High Sensitivity
  • High MTF
  • 16-bit Analog-to-Digital Conversion
  • Supports Variable Scan Speed With Position Synchronization
  • Software Development Kit, Including Device Drivers, Libraries and Standard API
  • Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0

Applications: Industrial Non-destructive Testing (NDT); Weld and Corrosion Inspection; Fan-beam Computed Tomography (CT)

Manufacturer "X-Scan Imaging"
X-Scan Imaging Corporation headquartered in San Jose, California is a full service designer and leading domestic manufacturer of high-performance, buttable, linear photodiode arrays and camera systems using proprietary CMOS semiconductor technology. Designed for both visible and radiation imaging applications, their unique device structure and shielding design offers users reliable high-speed imaging and extended operating lifetime in a broad range of laboratory and on-line production and inspection environments. Typical applications include printed circuit board inspection, quality control, non-destructive testing (NDT), food/pharmaceutical inspection and security/cargo screening.
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CMOS Photodiode Detector Array; 8 Rows of Pixels; Resolution 0.2-0.8 mm; X-Ray Energy 15-160 kV; Interface GigE, USB3.0, Camera Link The XTI90802 Harrier TDI CMOS series of x-ray line scan cameras are designed for high-resolution (200 µm) radiographic in-line imaging applications. Signal levels are comparable with a 0.4 mm LDA (linear diode array). Use the XTI90802 Harrier cameras to double your resolution compared to 0.4 mm LDAs while retaining a similar signal level. Time delay integration (TDI) imaging is based on the concept of accumulating multiple line scans (8 rows of pixels) which provides significantly increased responsivity, higher resolution, greater scanning speeds, decreased noise and increased SNRs/CNRs when compared to other technologies, including single-scan linear diode array (LDA) imagers. With these features, XTI90802 Harrier TDI CMOS x-ray line scan cameras are aiming at those non-destructive testing (NDT) imaging applications that require higher inspection rates and higher quality imaging. X-Scan Imaging housings are available in two form factors: The DR housing is a low-profile, wider detector to fit under conveyor systems or other tight spaces, while the DS housing is a taller, narrower profile. The standard X-Scan Imaging single energy, dual energy and CMOS TDI detectors all share the same mounting hole pattern. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API), example code software, and standard inspection application expedite developments of x-ray scanning systems. Key Features: Wide Range of Resolutions & Selection of Lengths Compact Form Factor Rows of Pixels: 8 Resolution: 0.2 mm for All Applications, 0.4 and 0.8 mm for All Non-food-related Applications Low Noise Wide Dynamic Range High Sensitivity High MTF 16-bit Analog-to-Digital Conversion Supports Variable Scan Speed With Position Synchronization Software Development Kit Including Device Drivers, Libraries, Standard API X-Ray Tube Voltages: 15 to 160 kV Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Security Screening; Cargo Screening; Inspection of Food, Electronics, PCB, Batteries; Package Content Inspection; Chip Counting; Continuous Weld Inspection; Other Industrial Non-Destructive Testing (NDT)
Product number: SW11331
Manufacturer:

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