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XIH8800 Crane High Energy X-Ray Line Scan Cameras

Product information "XIH8800 Crane High Energy X-Ray Line Scan Cameras"

Photodiode Detector Array; Pixel Pitch 0.05-1.6 mm; X-Ray Energy 0.05-15 MeV; Scintillator GOS:Tb, CsI:Tl, CWO; Length ≥308 mm; Interface GigE, USB3.0, Camera Link

X-Scan’s XIH8800 Crane series of line scan cameras are designed for high-energy x-ray and gamma-ray scanning applications ranging from 100 keV to 15 MeV energy levels. High-energy accelerators, collimators and detectors such as the XIH8800 are required to image large, dense objects such as metal castings and steel objects whose thickness can range from 25.4 to 305 mm.

Fan-beam collimation minimize the scattering that limits image contrast. A clever compact design combines scintillation (for conversion of high-energy photons to visible light) and fiber optics for conveying the visible light to a shielded off-axis linear imaging photodiode array.

A tungsten housing shields the diode array and camera electronics against scatter and ensures long-life reliability under extreme radiation conditions.

The GigE interface option featuring long cable lengths is recommended for high-energy applications. The XIH8800 Crane high-energy x-ray line scan camera modules include a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available.

Key Features:

  • Off-axis, Fiber Optic Design for High-energy Reliability in a Compact Form Factor
  • Energy Range: 50 keV to 15 MeV
  • Choice of Scintillators: GOS:Tb, CsI:Tl, CWO
  • Wide Range of Resolutions & Selection of Lengths
  • Incorporates X-Scan Imaging’s Proprietary Photodiode Arrays
  • Selectable Resolution
  • Low Noise
  • Wide Dynamic Range
  • High Sensitivity
  • High MTF
  • 16-bit Analog-to-Digital Conversion
  • Supports Variable Scan Speed With Position Synchronization
  • Software Development Kit, Including Device Drivers, Libraries and Standard API
  • Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0

Applications: Industrial Non-destructive Testing (NDT); Weld and Corrosion Inspection; Fan-beam Computed Tomography (CT)

Manufacturer "X-Scan Imaging"
X-Scan Imaging Corporation headquartered in San Jose, California is a full service designer and leading domestic manufacturer of high-performance, buttable, linear photodiode arrays and camera systems using proprietary CMOS semiconductor technology. Designed for both visible and radiation imaging applications, their unique device structure and shielding design offers users reliable high-speed imaging and extended operating lifetime in a broad range of laboratory and on-line production and inspection environments. Typical applications include printed circuit board inspection, quality control, non-destructive testing (NDT), food/pharmaceutical inspection and security/cargo screening.
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