XL8800 L-Shaped X-Ray Line Scan Cameras

CMOS Photodiode Detector Array; Pixel Size 0.04x0.075 to 1.565x2.4 mm; Resolution 0.05-1.6 mm; 32-6,144 Pixels; Length 51.2-307.2 mm; Scintillator GOS:Tb, CsI:Tl, CdWO4, Other; Data Rate 1 MHz Max.; Dynamic Range >4000 X-Scan Imaging’s XB series are single-chip, buttable silicon CMOS line scan detector boards with on-chip, fully integrated signal processing circuits designed for visible wavelength and x-ray imaging applications. A scintillator layer is attached to the surface of the photodiode detector array, which converts X-ray photons into visible light. A variety of standard x-ray sensitive scintillator materials are available for applications in industrial inspection, airport security and cargo screening. Each XB series detector board is configured as a contiguous linear array of photodiodes including a timing generator, digital scanning shift register, an array of charge integrating amplifiers, sample-and-hold circuits and signal amplification chain. XB series detector boards are designed to permit end-to-end butting on a printed circuit board to form a single longer detector array for extended length scanning applications. Key Features: Element Pitch (Resolution) 0.05 to 1.6 mm Pixel Size: 40 x 75 µm to 1.565 x 2.4 mm Active Area Length: 51.2 to 307.2 mm Number of Elements: 32 to 6,144 5 V Power Supply Operation Simultaneous Integration by Using an Array of Charge Integrating Amplifiers Sequential Readout With a Digital Scanning Shift Register Maximum Data Rate: 1 MHz Integrated CDS Circuits Allow Low Noise and Wide Dynamic Range up to >4000 User-specified Scintillator Material: GOS:Tb, CsI:Tl, CdWO4, etc. Extended Radiation Hardness Lifetimes (88xxR Series) Applications: Linear X-Ray Imaging for Industrial and Food Inspection, Homeland Security, Contraband and Cargo Screening, Biological and Industrial CT

Optical Fiber Splicing/Processing System; Heat Source <300->3,000 °C; Splicing of 125-2,000 µm Dia. Fibers; Automatic Bidirectional Tapering ≤175 mm Length; Semi-automatic Cleaving of Fibers ≤500 µm Dia. 3SAE Technologies’ CMS Combiner Manufacturing System is the supplier’s latest and most advanced optical fiber splicing/processing system. The CMS is specifically designed to maintain production level repeatability for multi-kilowatt class high-power fiber combiners and other fused optical components. The CMS system operates in partial vacuum and is utilizing the unique “Thermally Stabilized Plasma™” technology which generates an extremely repeatable and stabilized heat source with a wide dynamic range of operation from <300 °C to >3000 °C. This makes the CMS ideal for repeatable glass processing and high-volume optical component manufacturing. The main CMS functionalities are:SPLICING Splicing of 125 to 2000 µm fibers supported Automatic alignment with an exclusive <50 nm X and Y fiber positional resolution Automatic pitch and yaw alignment End cap splicing for cylindrical, chamfered and tapered end caps TAPERING Taper lengths of up to 175 mm supported in bidirectional mode Automatic taper creation via intuitive software interface or manual table editing Exclusive "Table Based Tapering™" software included for easy user level single direction or bidirectional taper program creation and nearly infinite engineer level process control CLEAVING Semi-automatic in-situ cleaving of fibers up to 500 µm Adjustable precision cleaving location via image feedback Key Features: Extremely Repeatable Glass Processing Heat Source Ideal for High-volume Optical Component Manufacturing With a Range of Operation From <300 °C to >3000 °C Unsurpassed Heat Source Circumferential Thermal Uniformity for Symmetrical Ultra-low Loss Tapering and Reduced Thermally Induced Component Stress Contamination-free Heat Source Capable of Producing Ultra-high-strength Multi-kilowatt Class Optical Components Fastest Cycle Times Based on Standard Splice, Taper and Cleave Cycle Times Averaged Together In-situ Cleaver Included for Fiber Diameters ≤500 µm Applications: Splicing/Processing of Optical Fibers; Repeatable Glass Processing; High-volume Optical Component Manufacturing; Maintaining Production Level Repeatability for Multi-kilowatt Class High-power Fiber Combiners and Other Fused Optical Components

1250-1650 nm; Responsivity 25 A/W; Breakdown Voltage 40-70 V; Dark Current 1 nA; Package 3-pin TO 46 Wooriro’s APD module for OTDR applications is based on an InGaAs/InP avalanche photodiode (APD) in TO-46 package. This module’s APD is pigtailed, and the module can be ordered either without connector or with a SC, LC or FC type optical connector in UPC or APC version. Designed for an optical wavelength range of 1250 nm to 1650 nm, the APD module for OTDR features a very low dark current of 1 nA typical at 98% breakdown voltage. Typical responsivity is 25 A/W at 1550 nm wavelength and 10 nW optical input power. Key Features: InGaAs/InP Avalanche Photodiode APD Low Dark Current: 1 nA (Typical, @0.98 x Breakdown Voltage) High Reliability Optical Wavelength Range: 1250 nm to 1650 nm Responsivity: 25 A/W Typ. (VAPD = 0.98 VBR, λ = 1550 nm, Pin = 10 nW) Breakdown Voltage VBR: 40 V to 70 V (Id = 10 µA) Temperature Coefficient of VBR: 90 mV/°C (-40 °C to +85 °C) Dimensions: Ø 6 mm x Length 20.2 mm Applications: OTDR; Optical Sensor; Optical Test Instruments