XL8800 L-Shaped X-Ray Line Scan Cameras

CMOS Photodiode Detector Array; Pixel Size 0.04x0.075 to 1.565x2.4 mm; Resolution 0.05-1.6 mm; 32-6,144 Pixels; Length 51.2-307.2 mm; Scintillator GOS:Tb, CsI:Tl, CdWO4, Other; Data Rate 1 MHz Max.; Dynamic Range >4000 X-Scan Imaging’s XB series are single-chip, buttable silicon CMOS line scan detector boards with on-chip, fully integrated signal processing circuits designed for visible wavelength and x-ray imaging applications. A scintillator layer is attached to the surface of the photodiode detector array, which converts X-ray photons into visible light. A variety of standard x-ray sensitive scintillator materials are available for applications in industrial inspection, airport security and cargo screening. Each XB series detector board is configured as a contiguous linear array of photodiodes including a timing generator, digital scanning shift register, an array of charge integrating amplifiers, sample-and-hold circuits and signal amplification chain. XB series detector boards are designed to permit end-to-end butting on a printed circuit board to form a single longer detector array for extended length scanning applications. Key Features: Element Pitch (Resolution) 0.05 to 1.6 mm Pixel Size: 40 x 75 µm to 1.565 x 2.4 mm Active Area Length: 51.2 to 307.2 mm Number of Elements: 32 to 6,144 5 V Power Supply Operation Simultaneous Integration by Using an Array of Charge Integrating Amplifiers Sequential Readout With a Digital Scanning Shift Register Maximum Data Rate: 1 MHz Integrated CDS Circuits Allow Low Noise and Wide Dynamic Range up to >4000 User-specified Scintillator Material: GOS:Tb, CsI:Tl, CdWO4, etc. Extended Radiation Hardness Lifetimes (88xxR Series) Applications: Linear X-Ray Imaging for Industrial and Food Inspection, Homeland Security, Contraband and Cargo Screening, Biological and Industrial CT

CMOS Photodiode Detector Array; Pixel Pitch 0.05-1.6 mm; X-Ray Tube Voltage 15-160 kV; Length ≥205 mm; Line Rate ≤0.55-≤23 kHz X-Scan Imaging’s XI8800 Falcon single-energy linear diode array (LDA) camera module series offers high performance for x-ray scanning applications at extra-long lengths. The XI8800 line scan cameras incorporate X-Scan Imaging’s buttable CMOS silicon imaging detector array chips and an integrated computer interface module. Multiple chips can be tiled together in a virtually seamless fashion for imaging applications requiring longer active detector lengths. A variety of resolutions and selection of lengths ranging from 152 to 1,829 cm are available as standard sizes. Other custom lengths can be provided as required. A wide selection of scintillation material converts x-rays into visible light for detection by the imaging array and optimizes both sensitivity and resolution. The close proximity of the analog-to-digital converters (ADC) to the detector chips helps minimize noise and maximize bandwidth. Interfacing options include Gigabit Ethernet (GigE), USB 3.0 and Camera Link. The XI8800 camera module includes a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available. Standard housings are compatible and interchangeable with the XID8800 Hawk dual-energy and XTI12848 Harrier TDI series. Systems utilizing standard housings can be easily interchanged between single-energy, dual-energy and high-resolution TDI. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API) and example code software expedite developments of x-ray scanning systems. Key Features: Wide Range of Resolutions & Selection of Lengths Compact Form Factor Incorporates X-Scan Imaging’s Proprietary XB8800 Photodiode Detectors Selectable Resolution: 0.1/0.2 mm and 0.4/0.8 mm Low Noise Wide Dynamic Range High Sensitivity Hight MTF 16-bit Analog-to-Digital Conversion Supports Variable Scan Speed With Position Synchronization Maximum Line Rate: 0.55 to 23 kHz Software Development Kit, Including Device Drivers, Libraries and Standard API X-Ray Tube Voltages: 15 to 160 kV Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Food and Industrial Inspection; Package Content Inspection; Security and Cargo Screening; Industrial Non-destructive testing (NDT)

CMOS Photodiode Detector Array; Pixel Pitch 0.4, 0.8 mm; X-Ray Energy 25-100, 45-160 keV; Length 307-1,229 mm; Interface GigE, USB3.0, Camera Link X-Scan Imaging’s XID8800 Hawk series of linear diode array (LDA) x-ray line-scan camera modules offers dual-energy imaging capability to differentiate materials in a variety of inspection applications by simultaneously capturing high-energy and low-energy images. Interfacing options include Gigabit-Ethernet, USB 3.0 and Camera Link. The XID8800 Hawk camera module includes a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available. X-Scan Imaging housings are available in two form factors: The DR housing is a low-profile, wider detector to fit under conveyor systems or other tight spaces, while the DS housing is a taller, narrower profile. The standard X-Scan Imaging single energy, dual energy and CMOS TDI detectors all share the same mounting hole pattern. The X-Scan Imaging XID8800 Hawk series of dual-energy linear diode array x-ray cameras offers high performance and capability to differentiate materials in a variety of applications. Key Features: Extract Material of a Target From Dual-energy Image Data Incorporates X-Scan Imaging’s Proprietary XB8800 Photodiode Detectors High Resolution With Varieties of Filters and Scintillators Low Noise Wide Dynamic Range High Sensitivity High X-Ray Energy Contrast X-Ray Energy Range Options for Low (25 to 100 KeV) and High (45 to 160 KeV) Energy Imaging Variable Scan Speed With Position Synchronization 16-bit Analog-to-Digital Conversion Software Development Kit, Including Device Drivers, Libraries and Standard API Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Food and Industrial Inspection Requiring High Contrast; Composite Material Sorting and Inspection; Security and Cargo Screening; Waste Sorting and Recycling; Rare Metal or Mineral Detection; Drug Detection and Control

Photodiode Detector Array; Pixel Pitch 0.05-1.6 mm; X-Ray Energy 0.05-15 MeV; Scintillator GOS:Tb, CsI:Tl, CWO; Length ≥308 mm; Interface GigE, USB3.0, Camera Link X-Scan’s XIH8800 Crane series of line scan cameras are designed for high-energy x-ray and gamma-ray scanning applications ranging from 100 keV to 15 MeV energy levels. High-energy accelerators, collimators and detectors such as the XIH8800 are required to image large, dense objects such as metal castings and steel objects whose thickness can range from 25.4 to 305 mm. Fan-beam collimation minimize the scattering that limits image contrast. A clever compact design combines scintillation (for conversion of high-energy photons to visible light) and fiber optics for conveying the visible light to a shielded off-axis linear imaging photodiode array. A tungsten housing shields the diode array and camera electronics against scatter and ensures long-life reliability under extreme radiation conditions. The GigE interface option featuring long cable lengths is recommended for high-energy applications. The XIH8800 Crane high-energy x-ray line scan camera modules include a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available. Key Features: Off-axis, Fiber Optic Design for High-energy Reliability in a Compact Form Factor Energy Range: 50 keV to 15 MeV Choice of Scintillators: GOS:Tb, CsI:Tl, CWO Wide Range of Resolutions & Selection of Lengths Incorporates X-Scan Imaging’s Proprietary Photodiode Arrays Selectable Resolution Low Noise Wide Dynamic Range High Sensitivity High MTF 16-bit Analog-to-Digital Conversion Supports Variable Scan Speed With Position Synchronization Software Development Kit, Including Device Drivers, Libraries and Standard API Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Industrial Non-destructive Testing (NDT); Weld and Corrosion Inspection; Fan-beam Computed Tomography (CT)

CCD Detector Array; Pixel Size 48x48 µm; X-Ray Energy 15 kV-15 MeV; Length 98-295 mm; Scintillator GOS, CsI(Tl), CdWO4, Other; Line Rate ≤10 kHz; Interface GigE,Camera Link X-Scan Imaging’s XTI12848 Harrier time delay integration (TDI) CCD series of x-ray line scan cameras are designed for high-resolution (48 µm) radiographic in-line imaging applications at energy levels ranging from 15 kV to 15 MeV. A compact camera design combines scintillation for conversion of x-ray and gamma-ray photons to visible light, and fiber optics for conveying the visible light to a shielded, off-axis linear imaging diode array. Time delay integration (TDI) imaging is based on the concept of accumulating multiple line scans which provides significantly increased responsivity, higher resolution, greater scanning speeds, decreased noise and increased SNRs/CNRs when compared to other technologies, including single-scan linear diode array (LDA) imagers. With these features, XTI12848 Harrier TDI CCD x-ray line scan cameras are aiming at those non-destructive testing (NDT) imaging applications that require higher inspection rates and higher quality imaging. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API), example code software, and standard inspection application expedite developments of x-ray scanning systems. Key Features: High Speed High Resolution High Sensitivity Imaging With Off-axis, Fiber Optic Design User-selectable X-Ray Scintillating Material: GOS, CsI(Tl), CdWO4, etc. X-Ray Sensitive Area Length: 98 (2,048 Pixels), 221 (4,608 Pixels), 295 mm (6,144 Pixels) TDI Stages: 128 Selectable Number of Stages: 32, 64, 96, 128 TDI Line Rate: Up to 10 KHz Pixel Size :48 × 48 μm Maximum X-Ray Energy: 15 MeV CCD Pixel Clock: 3 MHz Highly Extended Lifetimes Vision Interfaces: Camera Link (Base Configuration) and Gigabit Ethernet (GigE) Camera Link Data Rate: 48 to 84 MHz Readout Direction: Bidirectional 16-bit Digitization and Data Output Software Development Kit (SDK) With Application Programming Interface (API) Applications: PCB/SMT Inspection; Battery Inspection; In-line Non-Destructive Testing (NDT); High-energy X-Ray, Gamma-Ray, Betatron and Neutron Imaging

CMOS Photodiode Detector Array; 8 Rows of Pixels; Resolution 0.2-0.8 mm; X-Ray Energy 15-160 kV; Interface GigE, USB3.0, Camera Link The XTI90802 Harrier TDI CMOS series of x-ray line scan cameras are designed for high-resolution (200 µm) radiographic in-line imaging applications. Signal levels are comparable with a 0.4 mm LDA (linear diode array). Use the XTI90802 Harrier cameras to double your resolution compared to 0.4 mm LDAs while retaining a similar signal level. Time delay integration (TDI) imaging is based on the concept of accumulating multiple line scans (8 rows of pixels) which provides significantly increased responsivity, higher resolution, greater scanning speeds, decreased noise and increased SNRs/CNRs when compared to other technologies, including single-scan linear diode array (LDA) imagers. With these features, XTI90802 Harrier TDI CMOS x-ray line scan cameras are aiming at those non-destructive testing (NDT) imaging applications that require higher inspection rates and higher quality imaging. X-Scan Imaging housings are available in two form factors: The DR housing is a low-profile, wider detector to fit under conveyor systems or other tight spaces, while the DS housing is a taller, narrower profile. The standard X-Scan Imaging single energy, dual energy and CMOS TDI detectors all share the same mounting hole pattern. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API), example code software, and standard inspection application expedite developments of x-ray scanning systems. Key Features: Wide Range of Resolutions & Selection of Lengths Compact Form Factor Rows of Pixels: 8 Resolution: 0.2 mm for All Applications, 0.4 and 0.8 mm for All Non-food-related Applications Low Noise Wide Dynamic Range High Sensitivity High MTF 16-bit Analog-to-Digital Conversion Supports Variable Scan Speed With Position Synchronization Software Development Kit Including Device Drivers, Libraries, Standard API X-Ray Tube Voltages: 15 to 160 kV Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Security Screening; Cargo Screening; Inspection of Food, Electronics, PCB, Batteries; Package Content Inspection; Chip Counting; Continuous Weld Inspection; Other Industrial Non-Destructive Testing (NDT)

U-Shaped CMOS Photodiode Detector Array; Pixel Pitch 0.4, 0.8 mm; X-Ray Energy 40-160 kV; Length 1,491-4,626 mm; Line Period ≥0.44-≥1.8 ms; Scan Velocity ≤13-≤109 m/min The XU8800 Series “U” shaped Line-scan Camera utilizes the same detector chip technology as the XI8800 Falcon series and provides an ideal solution for tire inspection applications. At the heart of a XU8800 camera are X-Scan Imaging’s CMOS silicon imaging detector array chips providing wide dynamic range and solid-state reliability. The Gigabit Ethernet (GigE) vision interface option provides long cable lengths for convenience. Each XU8800 U-shaped camera system includes a unique camera body, software development kit, power adapter and cabling. A recommended frame-grabber which can be installed in the computer is offered as an option. In a typical tire inspection application, the treads and sidewalls of a rotating tire intersect the x-rays radiating from the x-ray source and directed to the camera body. A wide selection of scintillation materials is available for converting x-ray radiation into visible light for detection by the imaging array, which optimizes both sensitivity and image resolution. Key Features: U-Shape Optimized for Tire Inspection Rounded Corners for Reduced Corner Distortions Integrated X-Scan Imaging Proprietary Detectors Standard Energy Range: 40 to 160 kV, High-energy Versions Available Wide Selection of Resolutions: 0.05 to 1.6 mm Software-selectable Resolution Low Noise Wide Dynamic Range High X-Ray Sensitivity High MTF 16-bit Analog-to-Digital Conversion Scan Rates: >2,000 lines/s Variable Scan Speeds With Position Synchronization Software Development Kit, Including Device Drivers, Libraries and Standard API X-Ray Inspection Software With Standard Features Compact & Rugged Housing With Minimal Cabling Modular Design for Expeditious Customization of Length and Shape Total Detector Length: 1,491 to 4,626 mm Maximum Scan Velocity: 13 to 109 m/min Minimum Line Period: 0.44 to 1.8 ms Applications: Tire Inspection; X-Ray Inspection Using Panoramic X-Ray Sources