XB Series CMOS X-Ray Line Scan Detector Boards

Name: XB Series CMOS X-Ray Line Scan Detector Boards
Brand: X-Scan Imaging
SKU: SW11332
Availability: OutOfStock

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Product number: SW11332

Manufacturer: X-Scan Imaging

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Product information "XB Series CMOS X-Ray Line Scan Detector Boards"

CMOS Photodiode Detector Array; Pixel Size 0.04x0.075 to 1.565x2.4 mm; Resolution 0.05-1.6 mm; 32-6,144 Pixels; Length 51.2-307.2 mm; Scintillator GOS:Tb, CsI:Tl, CdWO4, Other; Data Rate 1 MHz Max.; Dynamic Range >4000

X-Scan Imaging’s XB series are single-chip, buttable silicon CMOS line scan detector boards with on-chip, fully integrated signal processing circuits designed for visible wavelength and x-ray imaging applications.

A scintillator layer is attached to the surface of the photodiode detector array, which converts X-ray photons into visible light. A variety of standard x-ray sensitive scintillator materials are available for applications in industrial inspection, airport security and cargo screening.

Each XB series detector board is configured as a contiguous linear array of photodiodes including a timing generator, digital scanning shift register, an array of charge integrating amplifiers, sample-and-hold circuits and signal amplification chain.

XB series detector boards are designed to permit end-to-end butting on a printed circuit board to form a single longer detector array for extended length scanning applications.

Key Features:

Element Pitch (Resolution) 0.05 to 1.6 mm
Pixel Size: 40 x 75 µm to 1.565 x 2.4 mm
Active Area Length: 51.2 to 307.2 mm
Number of Elements: 32 to 6,144
5 V Power Supply Operation
Simultaneous Integration by Using an Array of Charge Integrating Amplifiers
Sequential Readout With a Digital Scanning Shift Register
Maximum Data Rate: 1 MHz
Integrated CDS Circuits Allow Low Noise and Wide Dynamic Range up to >4000
User-specified Scintillator Material: GOS:Tb, CsI:Tl, CdWO4, etc.
Extended Radiation Hardness Lifetimes (88xxR Series)

Applications: Linear X-Ray Imaging for Industrial and Food Inspection, Homeland Security, Contraband and Cargo Screening, Biological and Industrial CT

Manufacturer "X-Scan Imaging"

X-Scan Imaging Corporation headquartered in San Jose, California is a full service designer and leading domestic manufacturer of high-performance, buttable, linear photodiode arrays and camera systems using proprietary CMOS semiconductor technology. Designed for both visible and radiation imaging applications, their unique device structure and shielding design offers users reliable high-speed imaging and extended operating lifetime in a broad range of laboratory and on-line production and inspection environments. Typical applications include printed circuit board inspection, quality control, non-destructive testing (NDT), food/pharmaceutical inspection and security/cargo screening.

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XTI12848 Harrier TDI CCD X-Ray Line Scan Cameras

CCD Detector Array; Pixel Size 48x48 µm; X-Ray Energy 15 kV-15 MeV; Length 98-295 mm; Scintillator GOS, CsI(Tl), CdWO4, Other; Line Rate ≤10 kHz; Interface GigE,Camera Link X-Scan Imaging’s XTI12848 Harrier time delay integration (TDI) CCD series of x-ray line scan cameras are designed for high-resolution (48 µm) radiographic in-line imaging applications at energy levels ranging from 15 kV to 15 MeV. A compact camera design combines scintillation for conversion of x-ray and gamma-ray photons to visible light, and fiber optics for conveying the visible light to a shielded, off-axis linear imaging diode array. Time delay integration (TDI) imaging is based on the concept of accumulating multiple line scans which provides significantly increased responsivity, higher resolution, greater scanning speeds, decreased noise and increased SNRs/CNRs when compared to other technologies, including single-scan linear diode array (LDA) imagers. With these features, XTI12848 Harrier TDI CCD x-ray line scan cameras are aiming at those non-destructive testing (NDT) imaging applications that require higher inspection rates and higher quality imaging. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API), example code software, and standard inspection application expedite developments of x-ray scanning systems. Key Features: High Speed High Resolution High Sensitivity Imaging With Off-axis, Fiber Optic Design User-selectable X-Ray Scintillating Material: GOS, CsI(Tl), CdWO4, etc. X-Ray Sensitive Area Length: 98 (2,048 Pixels), 221 (4,608 Pixels), 295 mm (6,144 Pixels) TDI Stages: 128 Selectable Number of Stages: 32, 64, 96, 128 TDI Line Rate: Up to 10 KHz Pixel Size :48 × 48 μm Maximum X-Ray Energy: 15 MeV CCD Pixel Clock: 3 MHz Highly Extended Lifetimes Vision Interfaces: Camera Link (Base Configuration) and Gigabit Ethernet (GigE) Camera Link Data Rate: 48 to 84 MHz Readout Direction: Bidirectional 16-bit Digitization and Data Output Software Development Kit (SDK) With Application Programming Interface (API) Applications: PCB/SMT Inspection; Battery Inspection; In-line Non-Destructive Testing (NDT); High-energy X-Ray, Gamma-Ray, Betatron and Neutron Imaging

Product number: SW11330

Manufacturer:

REQUEST PRICING AND AVAILABILITY

- Get your individual quote.
- Technical compatibility review included.
- Volume discounts available.

No obligation. Direct access to our engineering team.