Brazed Fins Heat Sinks

Name: Brazed Fins Heat Sinks
Brand: MeccAl
SKU: SW10272
Availability: OutOfStock

Product number: SW10272

Manufacturer: MeccAl

Product information "Brazed Fins Heat Sinks"

Basic carrier profile fitted with cooling fins using brazing technology; Width 200 mm to 1000 mm; Height 85 mm to 132 mm; max Length 1,000 mm; Rth 0.011 °C/W to 0.06 °C/W; Weight 17.85 kg/m to 78.51 kg/m

Not always does one of the many extruded, monolithic standard aluminium profiles meet the requirements of a very special heat dissipation project. Therefore, a production technique in which a basic carrier profile is fitted with cooling fins using brazing technology offers particularly flexible possibilities for manufacturing a customer-specific heat sink. Depending on the requirements of the project, different alloys can even be used without the limitations typical of extruded profiles. There is no need to design and manufacture new extrusion dies, nor are there any restrictions on size, overlong delivery times or minimum order quantities. This technology offers maximum flexibility and short response times in prototype and series production. Contact us or send us a request for a comprehensive consultancy for your custom brazed fins heat sink solution.

Manufacturer "MeccAl"

Maiman Electronics' product portfolio includes a wide range of high-current CW laser diode drivers with various output current values as well as a selection of high-voltage laser drivers for multiple emitters and a series of highly stable current sources for Butterfly laser diodes with integrated TEC (thermoelectric cooler) driver - both in OEM module format and as a benchtop device. Maiman Electronics is an important partner for companies across various industries, including laser marking, welding, soldering, and cutting applications, medical equipment, laser measurement equipment, spectrometers, lidar, range finders and laboratory test set-ups.

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Clip System Heat Sinks

Ideal for cooling TO-220, TO-247 or similar package types; Width 36 mm to 75 mm; Height 19 mm to 40 mm; Rth 0.673 °C/W to 2.448 °C/W; Weight 0.76 kg/m to 2.61 kg/m Heat sinks that are designed for being mounted with a clamp clip are mainly used for cooling power semiconductors in TO-220 or TO-247 packages or similar package types, mounted on a printed circuit board (PCB). Compared to a conventional screw-based assembly system, the clip system can provide similar thermal resistance values between the component and the heat sink. At the same time, however, it offers clear technical advantages, especially for the assembly process. Clip systems not only ensure a central, even contact pressure on the semiconductor component, but also simplify initial assembly as well as disassembly and re-assembly for maintenance purposes. Contact us now to find out more about our line of heat sinks allowing mounting electronic devices with a clamping clip.

Product number: SW10270

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