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Bonded Fins Heat Sinks

Product information "Bonded Fins Heat Sinks"

Basic carrier profile fitted with cooling fins using bonding technology; Width 200 mm to 500 mm; Height 84 mm to 180 mm; max Length 700 mm; Rth 0.039 °C/W to 0.040 °C/W; Weight 25.55 kg/m to 46.55 kg/m 

Bonded fins heat sinks are characterized by a special joining technique in which the fins are applied to the base of the heat sink using a highly thermally conductive epoxy resin. Designed for forced convection applications, this family of heat sinks offers high thermal performance with maximum dimensional flexibility. Bonded fins heat sinks do not require a special extrusion tool as they are made from standard metal sheets and plates. They also offer the possibility of combining different materials such as copper and aluminium. To find out more about the various options for bonded fins heat sinks, please contact us or send us your request for your customized solution.

Manufacturer "MeccAl"
Maiman Electronics' product portfolio includes a wide range of high-current CW laser diode drivers with various output current values as well as a selection of high-voltage laser drivers for multiple emitters and a series of highly stable current sources for Butterfly laser diodes with integrated TEC (thermoelectric cooler) driver - both in OEM module format and as a benchtop device. Maiman Electronics is an important partner for companies across various industries, including laser marking, welding, soldering, and cutting applications, medical equipment, laser measurement equipment, spectrometers, lidar, range finders and laboratory test set-ups.
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Product number: SW11231
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