Bonded Fins Heat Sinks
Product number:
SW10273
Manufacturer:
MeccAl
Product information "Bonded Fins Heat Sinks"
Basic carrier profile fitted with cooling fins using bonding technology; Width 200 mm to 500 mm; Height 84 mm to 180 mm; max Length 700 mm; Rth 0.039 °C/W to 0.040 °C/W; Weight 25.55 kg/m to 46.55 kg/m
Bonded fins heat sinks are characterized by a special joining technique in which the fins are applied to the base of the heat sink using a highly thermally conductive epoxy resin. Designed for forced convection applications, this family of heat sinks offers high thermal performance with maximum dimensional flexibility. Bonded fins heat sinks do not require a special extrusion tool as they are made from standard metal sheets and plates. They also offer the possibility of combining different materials such as copper and aluminium. To find out more about the various options for bonded fins heat sinks, please contact us or send us your request for your customized solution.
Manufacturer "MeccAl"
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Brazed Fins Heat Sinks
Basic carrier profile fitted with cooling fins using brazing technology; Width 200 mm to 1000 mm; Height 85 mm to 132 mm; max Length 1,000 mm; Rth 0.011 °C/W to 0.06 °C/W; Weight 17.85 kg/m to 78.51 kg/m
Not always does one of the many extruded, monolithic standard aluminium profiles meet the requirements of a very special heat dissipation project. Therefore, a production technique in which a basic carrier profile is fitted with cooling fins using brazing technology offers particularly flexible possibilities for manufacturing a customer-specific heat sink. Depending on the requirements of the project, different alloys can even be used without the limitations typical of extruded profiles. There is no need to design and manufacture new extrusion dies, nor are there any restrictions on size, overlong delivery times or minimum order quantities. This technology offers maximum flexibility and short response times in prototype and series production. Contact us or send us a request for a comprehensive consultancy for your custom brazed fins heat sink solution.
Product number:
SW10272
Manufacturer:
Clip System Heat Sinks
Ideal for cooling TO-220, TO-247 or similar package types; Width 36 mm to 75 mm; Height 19 mm to 40 mm; Rth 0.673 °C/W to 2.448 °C/W; Weight 0.76 kg/m to 2.61 kg/m
Heat sinks that are designed for being mounted with a clamp clip are mainly used for cooling power semiconductors in TO-220 or TO-247 packages or similar package types, mounted on a printed circuit board (PCB). Compared to a conventional screw-based assembly system, the clip system can provide similar thermal resistance values between the component and the heat sink. At the same time, however, it offers clear technical advantages, especially for the assembly process. Clip systems not only ensure a central, even contact pressure on the semiconductor component, but also simplify initial assembly as well as disassembly and re-assembly for maintenance purposes. Contact us now to find out more about our line of heat sinks allowing mounting electronic devices with a clamping clip.
Product number:
SW10270
Manufacturer:
Extruded Heat Sinks
Broad variety of profile geometries; Width 15 mm to 473 mm; Height 11 mm to 135 mm; Rth 0.019 °C/W to 3.347 °C/W; Weight 0.249 kg/m to 30.80 kg/m
Extruded aluminium heat sink profiles are safe for a lifetime, as fins and base plate are a single piece extrusion. The aluminium extrusion process can be used to produce a large number of different profile shapes. With modifying the profile shape, the surface that comes into contact with the air is also changed, and thus the ability to dissipate heat. Extruded heat sinks are mainly used in systems with medium electrical power, both with natural and forced convection by fans. The heat sinks utilise different surface enlargement geometries to match pressure head and flow rate of fans and blowers. For detailed information on extruded heat sinks and the many options for defining a custom solution, please contact us.
Product number:
SW10267
Manufacturer:
Heat Sinks for Double-sided Mounting
Profiles can carry power semiconductors on two opposite sides; Width 64 mm to 180 mm; Height 45 mm to 105 mm; max Length 300 mm; Rth 0.020 °C/W to 0.2 °C/W; Weight 2.6 kg/pc. to 5.25 kg/pc.
Some extruded aluminum heat sink profiles are designed in a way that heat sources can be mounted on both heat sink bases while forced air from a fan or blower flows through the hollow heat sink with internal fins. A narrow fin spacing provides the necessary very large cooling surfaces. This kind of heat sink profiles for double-sided mounting is available in lengths up to 300 mm. For detailed information on heat sinks for double-sided mounting and the many options for defining a custom solution, please contact us.
Product number:
SW10290
Manufacturer:
Special Profile Heat Sinks
Highly configurable to meet custom specifications; Width 100 mm to 800 mm; Height 40 mm to 135 mm; max Length 3,000 mm; Rth 0.008 °C/W to 0.028 °C/W; Weight 5.21 kg/m to 144.42 kg/m
Selected manufacturers are able to offer fully customised heat sinks using special profiles, but with specifications of standard solutions. Both mechanical mounting of base plate and cooling fins as well as monolithic construction are available as manufacturing processes. In this way, good thermal conduction can be achieved with customer-specific mechanical dimensions. The achievable thermal resistances are at least comparable with those of the widely used standard profiles. Our thermal management specialists will be happy to help you design a tailor-made solution for your project. Contact us or send us your request for a customized solution.
Product number:
SW10271
Manufacturer:
Welded Heat Sinks
Ideal for cooling TO-220, TO-247 or similar package types; Width 36 mm to 75 mm; Height 19 mm to 40 mm; Rth 0.673 °C/W to 2.448 °C/W; Weight 0.76 kg/m to 2.61 kg/m
By joining two or more extruded standard profiles by friction stir welding, robust, stable finned heat sinks with widths of up to 1000 mm can be produced. This manufacturing process can be very flexibly adapted to custom dimensional requirements and can be used for many modifications to standard extruded profiles. While friction stir welding has the advantage that no additional welding material is required, we can also provide special profiles that are pre-bevelled during production and which thus allow an efficient TIG or MIG welding process. Please contact us for detailed information on the selection of profiles that can be joined together through welding process.
Product number:
SW10268
Manufacturer:
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ThermoCube Liquid-to-Liquid Recirculating Chiller
Cooling Capacities 350 - >600W @ 20°C; Noise @ 1 m < 48 dBA ;Tank Volume 300 ml; Gear or Centrifugal Pump; Process Wetted Materials Aluminium; Facility Wetted Materials Stainless Steel
The ThermoCube Liquid-Liquid system provides exceptionally quiet and vibration-free thermal control with precision down to ± 0.05 °C, even when operating close to ambient temperatures. Utilizing a foundation of thermoelectric modules renowned for their longevity exceeding 200,000 hours, it ensures compatibility with power sources worldwide. Its variable voltage power control feature ensures efficient power usage, drawing power only as necessary. ThermoCube Liquid-Liquid is versatile and can work seamlessly with either glycol/water solutions or industrial water. The standard pump included in the system is capable of delivering pressures of up to 50 psi, suitable for applications such as laser diodes and other high-pressure requirements. Additionally, low-pressure pumps are available for different application needs.
Key Features:
For applications where Facility Water or PCW (Process Chilled Water) is availableHeat is removed from chiller with PCW instead of heat sinks and a fan
Cooling capacities from 350 to >600 watts
±0.05°C Temperature Stability/repeatability
Utilizes highly reliable, refrigerant-free thermoelectric technology.
Responds quickly to change in load
Improved design with stainless steel PCW cold plate for improved corrosion resistance
Very low noise, low vibration
Designed to be configured to meet your specific needs
6 pump choices: Centrifugal or Gear pumps
8 fitting choices (3/8” PCW fittings)
14 other configurable options, such as RS232, extended temperature range, alternate fluids and stainless steel plumbing
Compact size: 13” x 11” x 13”
Energy efficient, only uses power when needed to maintain temperature
Universal power – plug in and go anywhere in the world
Easily customizable beyond the many standard configuration options
Applications: Semiconductors, Life Sciences, Other Applications With Available Facility Water or PCW
Product number:
SW11975
Manufacturer:
LCS Liquid-to-Liquid Cooling Systems
Cooling Capacity 20, 150 kW; Connections 3/4'' FNPT, 2” Copper Flange; Temperature Stability ±0.5, ±1.0 °C; Facility Water Temperature +10 to +35 °C, +4 to +12 °C; CE Certified
Lytron’s LCS series of liquid-to-liquid cooling systems is an excellent solution for high heat-load or high ambient temperature applications where chilled facility water is available. The LCS series offers precise temperature control of process water and transfers the waste heat to your facility water via a liquid-to-liquid heat exchanger. With 20 kW of cooling, Lytron’s LCS20 provides over three times the capacity of a comparably-sized recirculating chiller, providing a great solution for high heat loads where space is at a premium. Designed for data center cooling, Lytron’s LCS50 is a 150 kW liquid-to-liquid cooling system that supplies precisely temperature-controlled coolant to your liquid cooled racks and transfers the waste heat to facility water. Key Features:
Large Cooling Capacity (20, 150 kW) in a Compact Package
Tight Temperature Control: ±0.5, ±1.0 °C (Despite Fluctuations in the Facility Water Temperature and Flow Rate)
Contamination-free: Process Cooling Loop Isolated from the Facility Water
Reliable, Quiet and Energy-efficient
Fluid Connections: ¾” FNPT (LCS20), 2” Copper Flange (LCS50)
Coolant Temperature Range: +10 to +60 °C (LCS20), +5 to +35 °C (LCS50)
Facility Water Temperature Range: +10 to +35 °C (LCS20), +4 to +12 °C (LCS50)
Facility Flow Rate: 8 to 38 l/min (LCS20), 95 to 379 l/min (LCS50)
Maximum Facility Pressure: 7 bar
Ambient Temperature Range: +5 to +40 °C
Applications: Electronics Cooling; High Heat-load or High Ambient Temperature Applications Where Chilled Facility Water is Available
Product number:
SW10856
Manufacturer: