B-Series CMOS Cameras

1.4 MP; Pixel Size 6.45x6.45 µm; Sensor Size 2/3” Diagonal; Colour or B/W; 15-49 fps; Resolution 8, 12 bit; USB 2.0; Buffered; Progressive Scan; Board-level or Enclosed; Global Shutter Mightex’s C-Series USB 2.0 1.4 MP 2/3” CCD cameras with frame buffers are optimized for machine-vision applications, and they can be also used for a wide variety of applications such as digital microscopy and medical imaging, where quality, ease of use, and cost-effectiveness are crucial. C-Series high-sensitivity 2/3” CCD cameras are available as colour or B/W versions, with 1.4 MP (1392x1040) resolution and 8 or 12 bit, and can be ordered as “naked” board-level device or pre-mounted in an enclosure. Monochrome cameras often exhibit a 20% higher spatial resolution than their colour counterparts because no pixel interpolation is necessary. Without a Bayer colour filter on the sensor, monochrome cameras are also more sensitive than colour sensors, especially in near IR and UV regions. C-Series 2/3” CCD cameras have built-in frame buffers, global shutter, external trigger-in, strobe-out, and a powerful camera engine that supports multiple cameras. The frame rate can be as high as 15 fps in full resolution and up to 80 fps using ROI mode. In addition, a user-friendly GUI based application software and an SDK are provided for custom software development. A USB command set protocol is also provided for non-Windows based applications. Available models are: CXN-C013-U: colour, board-level CXE-C013-U: colour, enclosed CXN-B013-U: B/W, board-level CXE-B013-U: B/W, enclosed Note: Board-level cameras are designed for OEM applications, when a system-level enclosure is usually provided. In order to avoid electro-static discharge (ESD) related damages, workforce handling a board-level camera should be properly grounded. ESD related damages are considered as mishandling and are not covered by product warranty. For lab use, it is strongly recommended to choose an enclosed camera instead of a board-level one. Key Features: Colour or Black&White (B/W, Monochrome) Built-in Frame Buffer (8 Frames at Full Resolution) Support Multi-Camera Applications B/W Cameras Feature Higher Sensitivity (Especially in Near IR and UV) Board-level or Enclosed Versions Available Ultra-compact Active Imaging Pixels: 1.4 MP, 1392x1040 Pixel Size: 6.45 x 6.45 µm Sensor Size: 11.0 mm Diagonal (2/3”) 8 or 12 bit Progressive Scanning System Frame Rate: 15 to 49 fps Global Shutter 4-pin GPIOs Interface: High-speed USB 2.0 (480 Mbit/s), No Need for External Power Supply Digital Output, No Need for Frame Grabber Full-featured SDK Compatible With Windows 2000, XP, Vista, Windows 7 and 8 TWAIN Driver USB Protocol for Non-Windows-based Applications External and Software Trigger Strobe Output for External Flash ROI and Pixel Skipping/Binning OEM Versions Available Applications: Digital Microscopy; Machine Vision; Fluorescence Imaging; Medical Imaging; Semiconductor Equipment; Test Instruments; Document Scanners; 2D Barcode Readers; High-quality ID Photos; Security Camera; Astrophotography

Interchangeable Fixtures for Connectors, Waveguides, Bare Fibers, Other; Film Size 4 Inch Diameter; Capacity up to 8 Components; Connector Apex Offset <50 µm; Connector Radius of Curvature 5-25 mm; Connector Protrusion/Undercut: 50--120 nm KrellTech’s NOVA™ automated polishing system provides maximum flexibility for optical surface processing and supports a variety of polishing applications from connectors to waveguides, and bare fibers to custom components. NOVA™ is scalable for R&D projects, high-volume production and the rigors of harsh environments and field installation. NOVA™ workholders feature KrellTech’s patented independent suspension at each connector position for controlled pressure and uniform contact. Combined with NOVA’s Microfeed™ fixture advancement, connector “airpolishing” and epoxy removal can be performed directly in the machine. Each position is optically aligned for optimal polish geometry using KrellTech’s patented process and calibration mechanism. Connector types can also be mixed and matched in a single fixture. NOVA’s versatility provides the ability to support the polishing of many photonic components. A quick change-out of workholder fixtures provides processing capability for waveguides, optical chips, PLCs, lenses and fiber arrays. Workholders utilize a unique holding mechanism that can secure a wide range of component dimensions. The polishing angle is adjustable and custom fixtures can be fabricated for specialized applications. Bare fiber can be polished at variable angles using specialized workholders and adapters. A variety of fiber types from standard single mode (SM) to polarization maintaining (PM) and sapphire to PCF can be processed into wedge and chisel tip shapes. A quick swap-out of adapters allow the polishing of fiber diameters from 80 um to >3 mm. NOVA™ features an intuitive user interface for creating polishing programs. All parameters including cycle time, pressure and speed settings are easily inputted for all component types and desired surface geometries. A unique “manual mode” allows the adjustment of polishing parameters in real-time during NOVA™ operation. This feature streamlines process development efforts and facilitates easy and quick program creation and refinement. A new NOVA™ operation software kit is available that upgrades NOVA™ polishers with the enhanced microfeed feature. This polishing routine provides greater programming flexibility for advancing components to the polishing surface at slower and more controllable rates. While version 1 NOVA™ software was limited to 10 pre-programmed microfeed rates, with the slowest being 100 µm/s, version 2 software allows to customize rates as slow as 5 µm/min. This yields precise removal of material stock and continual component advancement. The enhanced microfeed is ideal for larger optical surfaces, delicate bare fibers, and connector air polishing. V2 also provides the ability to create "pop-up" window prompts in between each polishing step, very useful as reminder to technicians to clean fibers, inspect polishing lengths, confirm geometry, etc. before initiating the next process step. New folder management allows programs to be organized according to connector types, fiber diameters, component, etc. Bare Fiber Coning and Chisel Option The optional Orbit™ bare fiber coning and chisel system enhances NOVA™'s bare fiber processing with conical and chisel tip shaping. Unique fiber tip geometries can be formed for lensing, sensing and light guiding applications. The fiber rotation module can be mounted on standard NOVA™ variable angle and waveguide workholders. Fiber "spin" speed is user adjustable and can be set for continual rotation or the unique "360 auto-reverse" motion that prevent fiber twisting and torquing. All variables are entered and selected via a touchscreen on the Orbit™ controller. When combined with NOVA™ Auto-Angle Workholders, Orbit™ precisely positions the polishing fixture at the designed angle on a repeatable basis. Inspection Options Optional video inspection systems monitor the polishing process and inspect the polished surface directly in NOVA™.  NOVA™'s Profile Videoscope allows the real-time monitoring of component polishing. This videoscope aids with bare fiber/component positioning and confirms process completion. Teamed with measurement software, this system verifies the endface geometry of a broad range of photonics components. Teamed with measurement software, this system verifies the endface geometry of fibers, waveguides and arrays. NOVA™'s Surface Videoscope allows the in-line inspection of polished surfaces while the component is still loaded in the polisher. This minimizes material handling and streamlines photonic production compared to the traditional process of transferring components to off-line inspection stations. Polishing and specification compliance can be determined in a single workcell. Key Features: Precision Optical Polishing Wireless Tablet Control With Microfeed™ Telcordia Compliant Interchangeable Fixtures for Waveguides, Bare Fibers and More Air Polishing Machine Polishing Pressure: Programmable & Automated, Linear Displacement With Micron Positioning Control Polishing Speed and Cycling Time: Program Selectable Polishing Motion: Random Orbital Polishing Routines: Programmable (Step by Step Prompts), Microfeed™ Controlled Advancement, Manual Mode With Full Process Control Film Size: 4 Inch Diameter Connector Support: All Industry Standard Connectors, MIL-spec Termini and Ferrules, UPC & APC Geometries Connector Capacity: Up to 8 Components – Selections Can Be Mixed & Matched in Same Workholder Fixture Connector Apex Offset: <50 µm Maximum, <15 µm Typical Connector Radius of Curvature: 10 to 25 mm (2.5 mm Ferrules), 7 to 20 mm (1.25 mm Ferrules), 5 to 12 mm (APC Ferrules) Connector Protrusion/Undercut: 50 nm to -120 nm Connector Back Reflection: <-60 dB (UPC), <-65 dB (APC) Connector Insertion Loss: <0.25 dB Typical Connector Process Time: Approximately 15 s/Connector Waveguide Component Support: Waveguides, Planar Lightwave Circuits, Optical Chips, Fiber Arrays Waveguide Component Dimension Range: Width 5 to 30 mm, Thickness 0.5 to 5 mm, Length >5 mm Waveguide Angle Repeatability: ±0.3° (X/Y Axis Along Edge) Waveguide Adjustable Polish Angle Range: 0° (Flat) to 45° Fiber Type Range: Single Mode (SM), Multi Mode (MM), Polarization Maintaining (PM), Plastic, PCF, Chalcogenide, Sapphire, Specialty Fibers Fiber Diameter: 80 µm to >3 mm Fiber Angle Range: 0° (Flat) to 50° Fiber Angle Repeatability: ±0.5° Typical Equipment Footprint & Weight: 305 x 305 mm, 11.3 kg Applications: Automated Optical Polishing of Connectors, Waveguides, Bare Fibers and More; Research and Development Projects; High-volume Production; Harsh Environments and Field Installation

1.3 MP; Pixel Size 3.75x3.75 µm; Sensor Size 6.26x5.01 mm; Colour or B/W; 20-66 fps; Resolution 8, 12 bit; USB 2.0; Buffered; Progressive Scan; Board-level or Enclosed; Global Shutter Mightex’s C-Series compact USB 2.0 1.3 MP 1/3” CCD cameras with frame buffers are optimized for machine-vision applications, and they can be also used for a wide variety of applications (such as industrial inspections, digital microscopy and medical imaging) which require good quality cameras that are easy to use and cost-effective. C-Series compact 1/3” CCD cameras are available as colour or B/W versions, with 1.3 MP (1280x960) resolution and 8 or 12 bit, and can be ordered as “naked” board-level device or pre-mounted in an enclosure. Monochrome cameras often exhibit a 20% higher spatial resolution than their colour counterparts because no pixel interpolation is necessary. Without a Bayer colour filter on the sensor, monochrome cameras are also more sensitive than colour sensors, especially in near IR and UV regions. C-Series 1/3” CCD cameras have built-in frame buffers, global shutter, external trigger-in, strobe-out, and a powerful camera engine that supports multiple cameras. The frame rate can be as high as 20 fps in full resolution and up to 84 fps using ROI mode. A user-friendly GUI based application software and an SDK are provided for custom software development. In addition, a DirectShow driver and a TWAIN driver are available to easily link the cameras with users’ applications. A USB command set protocol and a Linux driver are also provided for non-Windows based applications. Available models are: CGN-C013-U: colour, board-level CGE-C013-U: colour, enclosed CGN-B013-U: B/W, board-level CGE-B013-U: B/W, enclosed Note: Board-level cameras are designed for OEM applications, when a system-level enclosure is usually provided. In order to avoid electro-static discharge (ESD) related damages, workforce handling a board-level camera should be properly grounded. ESD related damages are considered as mishandling and are not covered by product warranty. For lab use, it is strongly recommended to choose an enclosed camera instead of a board-level one. Key Features: Colour or Black&White (B/W, Monochrome) Built-in Frame Buffer 32 MByte (24 Frames at Full Resolution) Support Simultaneous Image Capturing From Multiple Cameras Higher Sensitivity Than CMOS Cameras B/W Cameras Feature Higher Sensitivity (Especially in Near IR and UV) Board-level or Enclosed Versions Available Ultra-compact Active Imaging Pixels: 1.3 MP, 1280x960 Pixel Size: 3.75 x 3.75 µm Sensor Size: 6.26 x 5.01 mm (1/3” Diagonal) 8 or 12 bit Progressive Scanning System Frame Rate: 20 to 66 fps Global Shutter 4-pin GPIOs Interface: High-speed USB 2.0 (480 Mbit/s), No Need for External Power Supply Digital Output, No Need for Frame Grabber Full-featured SDK DirectShow & TWAIN Drivers Linux Driver Available USB Command Set for Non-Windows-based Applications External and Software Trigger Strobe Output for External Flash ROI and Pixel Skipping OEM Versions Available Applications: Digital Microscopy; Machine Vision; Medical Imaging; Semiconductor Equipment; Test Instruments; Document Scanners; 2D Barcode Readers; Web Camera and Security Video; High-quality ID Photos

CMOS Photodiode Detector Array; Pixel Pitch 0.05-1.6 mm; X-Ray Tube Voltage 15-160 kV; Length ≥205 mm; Line Rate ≤0.55-≤23 kHz X-Scan Imaging’s XI8800 Falcon single-energy linear diode array (LDA) camera module series offers high performance for x-ray scanning applications at extra-long lengths. The XI8800 line scan cameras incorporate X-Scan Imaging’s buttable CMOS silicon imaging detector array chips and an integrated computer interface module. Multiple chips can be tiled together in a virtually seamless fashion for imaging applications requiring longer active detector lengths. A variety of resolutions and selection of lengths ranging from 152 to 1,829 cm are available as standard sizes. Other custom lengths can be provided as required. A wide selection of scintillation material converts x-rays into visible light for detection by the imaging array and optimizes both sensitivity and resolution. The close proximity of the analog-to-digital converters (ADC) to the detector chips helps minimize noise and maximize bandwidth. Interfacing options include Gigabit Ethernet (GigE), USB 3.0 and Camera Link. The XI8800 camera module includes a camera unit, software development kit, power adapter and cabling. An optional frame-grabber which can be installed in the computer is also available. Standard housings are compatible and interchangeable with the XID8800 Hawk dual-energy and XTI12848 Harrier TDI series. Systems utilizing standard housings can be easily interchanged between single-energy, dual-energy and high-resolution TDI. A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API) and example code software expedite developments of x-ray scanning systems. Key Features: Wide Range of Resolutions & Selection of Lengths Compact Form Factor Incorporates X-Scan Imaging’s Proprietary XB8800 Photodiode Detectors Selectable Resolution: 0.1/0.2 mm and 0.4/0.8 mm Low Noise Wide Dynamic Range High Sensitivity Hight MTF 16-bit Analog-to-Digital Conversion Supports Variable Scan Speed With Position Synchronization Maximum Line Rate: 0.55 to 23 kHz Software Development Kit, Including Device Drivers, Libraries and Standard API X-Ray Tube Voltages: 15 to 160 kV Interface: Gigabit Ethernet (GigE), Camera Link, USB 3.0 Applications: Food and Industrial Inspection; Package Content Inspection; Security and Cargo Screening; Industrial Non-destructive testing (NDT)

Super Hydrophobic Coating NTT-AT Super Hydrophobic; Water-based; Non-dangerous Goods for Shipment & Storage; Environmentally Friendly; Anti Stick Characteristics; Photocatalytic Self Cleaning Effect NTT-AT’s HIREC® 300-W is a brand-new water-based hydrophobic coating with the same performances as that of the supplier’s HIREC®100 product line. The HIREC® 300-W water-based super hydrophobic coating joins NTT-AT’s HIREC® series of super water-repellent materials that achieves super water-repellency with over 150° of initial contact angle, thus helping to protect your equipment from water film, snow, and ice. HIREC® 300-W contains almost no volatile organic compounds (VOC). Therefore, it is friendly to human health and the environment, and has no flash point which brings benefits with regards to easier and less expensive shipment and storage. HIREC® 300-W does not require thinner because it can be diluted with water. Furthermore, it has a self-cleaning function equivalent to that of HIREC 100, which enables to maintain super water repellency (with the contact angle staying at 140° or larger) for approximately three years outdoors, an unparalleled performance. Key Features: Super Hydrophobic: Prevents Water Film Formation Water-based, no Volatile Organic Compounds (VOC) Environmentally Friendly Non-dangerous Goods for Shipment and Storage >150° Contact Angle – Leads to Unparalleled Performance “Anti-stick” Characteristics – Reduces Accumulation of Snow and Ice Photocatalytic Self Cleaning Effect – Maintains Performance for Years Applications: HIREC® 300-W Super Water-repellent Material Contributes to the Maintenance of Customers' Various Facilities by Preventing Ice and Snow Accretion, Snow and Ice from Falling, and Unnecessary Electrical Conduction Caused by Wetness

Wavelength Range 1.0-5.0 µm MWIR; Detector Size 1x1, 2x2 mm; Time Constant <2 µs; Responsivity 9x103, 4.5x103 V/W; Element Resistance 0.1-2.0 MΩ New Infrared Technologies’ (NIT) LEPTON Series of single-pixel VPD PbSe MWIR detectors are available uncooled as well as with integrated TECs (thermoelectric cooling elements), with different geometries, packaging solutions and preamplifier boards. LEPTON Series single-pixel detectors come in two standard sizes: 1 mm × 1 mm or 2 mm × 2 mm. LEPTON Series uncooled single-pixel PbSe MWIR detectors can be ordered packaged in SMD or TO-5 housings (with cap, hermetic) with sapphire window. These detectors are operational at room temperature and don’t require any cooling devices. LEPTON Series cooled single-pixel PbSe MWIR detectors are hermetically packaged in a TO-8 can housing with cap and sapphire window and include one or two thermoelectric cooler (TEC) stages for higher sensitivity as well as a thermistor. A calibration curve for the thermistor is available. NIT’s LEPTON Series also includes two low-noise preamplifier boards that are 5-V-powered via mini-USB connector: The LEPTON ANALOG PREAMP provides rotary switches to manually select the detector biasing voltage (4 steps from 1.25 V to 10 V) as well as the transimpedance gain (4 steps from 104 to 107 V/A). This preamp outputs a ±10 V analog voltage on a BNC connector. The LEPTON PREAMP WITH USB OUTPUT allows to digitally select the values for detector biasing voltage and transimpedance gain via software. Here, the output is a digital 14 Bit signal with a maximum sampling rate of 20 ksps. This preamp also features an analog output for the preamplifier stage on SMB or BNC connector. For more pixels, linear and two-dimensional array MWIR cameras are available from New Infrared Technologies – please refer to the LUXELL series of linear array MWIR cameras and TACHYON series of high-speed imaging MWIR cameras respectively. Key Features: Detector Sensing Material: VPD Polycrystalline PbSe Uncooled and TEC-cooled (1-stage, 2-stages) Versions Available Square Pixels, Available Pixel Geometries: 1 x 1 mm, 2 x 2 mm Packaging: SMD (10x10 mm) Non-hermetic, TO-5 (9.14 mm Dia.) Hermetic With Cap, TO-8 (15.24 mm Dia.) Hermetic With Cap Sapphire Window IR Detection Band: MWIR, 1.0 µm to 5.0 µm Peak Wavelength of Detection: 3.7 µm D* (λpeak) Uncooled: 2x109 Jones Typical D* (λpeak, 1,000 Hz, 1.2 Hz) Cooled: 1x1010 Jones Time Constant: <2 µs Biasing Voltage: 5 V, 10 V Typical Element Resistance: 0.1 to 2.0 MΩ Responsivity (@Vb = 10 V): 9x103 V/W (1x1 mm), 4.5x103 V/W (2x2 mm) Power: 1 mW Read-out Electronics External (Not Included) Customizable Operating Temperature: +5 °C to +70 °C (SMD), -40 °C to +85 °C (TO-5, TO8) Amplifier Board Transimpedance Gain: 104 to 107 V/A, Adjustable Manually or per Software Amplifier Board Dark Current Cancellation: 1.24 µA to 1 mA, Adjustable Manually or per Software Amplifier Board Power Supply: 5 VDC, 60 mA (mini-USB Connector) Amplifier Board Output: Analog (±10 V), Digital (14 Bit) Amplifier Board Noise: 5 pA @1 kHz, 107 V/A Amplifier Board Dimensions: 75.90 x 35.10 x 28.70 mm (Analog), 89.30 x 35.10 x 26.30 mm (USB Output) Applications: Gas & Flame Detection; Laser Detection

Detector Type Linear Array PbSe FPA; Spectral Range 1.0-5.0 µm; Pixel Size 600x60 µm; 256 Pixels; Resolution 1x256; Max. Line Rate 500 lps; Interface USB 2.0 New Infrared Technologies’ (NIT) LUXELL Series of line array MWIR (midwave infrared) cameras provide line rates of up to 300 lps (lines per second) at 1×256 pixels resolution – in uncooled operation. The LUXELL CAMERA-S with IP67-rated housing is the plug-and-play industrial version featuring a USB 2.0 interface and industrial connector. The lens, with f/35 mm and CS-mount optical interface, is IP67-rated as well. The camera includes the LUXELL software suite and a development kit for LabVIEW. This ready-to-use system is well suited for the development of affordable solutions and integration in the customer’s production line. The LUXELL CAMERA-S is based on the linear scanning array LUXELL CORE-S, an electronic module based on a microcontroller architecture, which includes the linear, 1x256 pixels LUXELL FPA (Focal Plane Array), 2-channel readout electronics (300 lines per second max), USB 2.0 output, and a powerful software suite and SDK for LabVIEW. Though not housed in an industrial case, the LUXELL CORE-S module also is functionally plug and play, ready to read the FPA signal and ideal for the development of very cost-effective solutions based on the LUXELL FPA. With dimensions of 56 mm x 40 mm x 29.5 mm (without connector), the compact-size LUXELL CORE-S module enables full integration in Industry 4.0 applications and factories of future production lines. For larger and two-dimensional array cameras from New Infrared Technologies, please refer to the TACHYON series of high-speed imaging MWIR cameras. And for applications requiring single-pixel MWIR detection, have a look at NIT’s LEPTON series of single-pixel VPD PbS MWIR detectors. Key Features: Detector Type: Linear Array PbSe FPA Uncooled Operation Array Format: 1x256 (256 Pixels) Aspect Ratio: 1:10 Pixel Size: 600 µm x 60 µm Readout Method: x-y Addressed (Rolling Shutter) Number of ADC Readout Channels: 2 Maximum Line Rate: 500 lps (Lines per Second) Spectral Range: MWIR, 1.0 µm to 5.0 µm Peak Wavelength of Detection: 3.7 µm Integration Time: >4.10 µs to 20 µs, Selectable Data Format: Raw Data 14 Bit Optimum Temperature Detection Range: >+100 °C Interface: USB 2.0 High-speed ((480 Mbps )With Industrial Connector (LUXELL CAMERA S) Includes Shutter for 1-pt Offset Correction Software Included: NIT Software Suite (Acquisition & Visualization), LabVIEW SDK Start-up Time: <10 s (LUXELL CAMERA S) Power Supply: 5 VDC, 0.2 A Through USB Connection IP67-rated Metal Housing With CS-mount Optics Interface, M12x1 Industrial USB Connector, Tripod Screw Holes and Water Block for Thermal Stabilization of FPA With Water or Air (LUXELL CAMERA S) Dimensions LUXELL CAMERA S: 70 x 131.5 x 17 mm (With Housing, Water Block and Lens) Weight LUXELL CAMERA S: 400 g Optics LUXELL CAMERA S: Silicon Lens f = 35 mm, F# 1.1, FoV 25° x 1°, AR Coating, Manual Focus, CS-mount, IP67 Dimensions LUXELL CORE-S Module: 56 x 44.5 x 41.5 mm Weight LUXELL CORE-S Module: 60 g Dimensions 1x257 Pixels LUXELL FPA; 24 x 24 x 2.2 mm Applications: Industrial Process Control (Scanning); Glass Manufacturing Industry; Gas and Flame Detection; Industrial Welding Process Monitoring; Laser Manufacturing Process Monitoring; Machine Vision, Spectroscopy; OEM Integration