B-Series CMOS Cameras

Automated, Mid-span; Window Strip Length 2-150 mm; Fiber Coating Diameter ≤1,000 µm; Fiber Cladding 125-400 µm; Pulling Speed 20-100 mm/min The AutoStrip II is designed for fast, chemical free window stripping of optical fibers. Utilizing SAE Technologies’ patented “Burst Technology™”, this system accomplishes the often difficult task of window stripping fibers with acrylate coating diameters up to 1,000 µm. The AutoStrip II automated, mid-span window stripping unit meets the need for variable window strip lengths at high strength and ultra cleanliness. The proven Burst Technology™ method instantly vaporizes the fiber coating. The result is a clean, stripped fiber at substantially higher strength than any mechanical stripping method. The fiber is free of debris at 400x magnification. Equipped with a built-in, high-force fiber tensile tester, the AutoStrip II system can pull the fiber up to 20 N (235 kpsi). To ensure high quality, repeatability and high production yield, all critical processes and parameters such as stripping distance, burst temperature, burst speed, and strength test are controlled automatically by a built-in microprocessor. The AutoStrip II can be used as a stand-alone unit or integrated into different sub-systems. The use of chemicals for high-strength fiber stripping is now a thing of the past! Key Features: Chemical-Free (No Cleaning or Stripping Chemicals Required) Easy, Low-maintenance Bench-top Design Fast Cycle Time & High First-pass Yield Accommodates Acrylate Coating Fiber Diameters up to 600 μm (Custom Nozzles up to 1,000 μm) Variable Window Strip Lengths From 2 up to 150 mm Fiber Cladding: 125 to 400 μm Fiber Strength: Typical >35 N on 125 μm Fiber Fiber Cleanliness: Free of Debris at 400x Magnification Built-in High-force Linear Tensile Tester, Tensile Strength: 0 to 20 N Pulling Speed: 20 to 100 mm/min, Hold Time: 0 to 5 s Power Supply: 115 to 230 V AC Compressed Air: External Compressor, 95 psi - 5 SCFM Flow PC Interface: RS232C Software-adjustable Parameters Automated Fiber Clamps Built-in Graphical LCD Control Storage of up to 10 Programs Dimensions: 465 x 315 x 225 mm Application: Automated, Mid-span Window Stripping of Optical Fibers With Acrylate Coating Diameters up to 1,000 µm

1.3, 3 MP; Pixel Size 3.2x3.2, 5.2x5.2 µm; Sensor Size 6.66x5.32 mm; Colour or B/W; 8-600 fps; Resolution 8 bit; USB 2.0; Unbuffered; Progressive Scan; Dynamic Range 61, 68 dB; Board-level or Enclosed Mightex’s M-Series USB 2.0 CMOS cameras are designed for a wide variety of applications such as machine vision, digital microscopy and medical imaging, where quality, ease of use, and cost-effectiveness are crucial. With a USB2.0 interface and powerful PC software, the unbuffered M-Series cameras deliver excellent quality images, and the frame rate can be as high as 24 fps (8 fps for colour cameras) in full resolution and up to 600 fps using ROI mode. In addition, a user-friendly GUI based application software and an SDK are provided for custom software development. The cameras have 4-pin GPIOs and optional built-in LED drivers. A DirectShow driver and a TWAIN driver are also provided in order to easily link the cameras with users’ applications. M-Series cameras are available as 3 MP (2048x1536) colour or 1.3 MP (1280x1024) B/W versions and can be ordered as “naked” board-level device or pre-mounted in an enclosure. Monochrome cameras often exhibit a higher spatial resolution than their colour counterparts because no pixel interpolation is necessary. Without a Bayer colour filter on the sensor, monochrome cameras are also more sensitive than colour sensors, especially in infrared (IR). Available models are: MCN-B013-U/MCN-B013-US: B/W, lens mount C/CS, board-level, no built-in LED drivers GLN-B013-U/GLN-B013-US: B/W, lens mount C/CS, board-level, built-in LED drivers MCE-B013-U/MCE-B013-US: B/W, lens mount C/CS, enclosed, no built-in LED drivers MLE-B013-U/MLE-B013-US: B/W, lens mount C/CS, board-level, built-in LED drivers MCN-C030-U: colour, lens mount C or CS, board-level, no built-in LED drivers GLN-C030-U: colour, lens mount C or CS, board-level, built-in LED drivers MCE-C030-U: colour, lens mount C or CS, enclosed, no built-in LED drivers MLE-C030-U: colour, lens mount C or CS, enclosed, built-in LED drivers Note: Board-level cameras are designed for OEM applications, when a system-level enclosure is usually provided. In order to avoid electro-static discharge (ESD) related damages, workforce handling a board-level camera should be properly grounded. ESD related damages are considered as mishandling and are not covered by product warranty. For lab use, it is strongly recommended to choose an enclosed camera instead of a board-level one. Key Features: Colour or Black&White (B/W, Monochrome) B/W Cameras Feature Higher Resolution & Sensitivity (Especially in IR) and Low Noise Board-level or Enclosed Versions Available Unbuffered Built-in LED Drivers Active Imaging Pixels: 1.3 MP (B/W, 1280x1024), 3 MP (Colour, 2048x1536) Pixel Size: 3.2 x 3.2 µm (Colour), 5.2 x 5.2 µm (B/W) Sensor Size: 6.66 x 5.32 mm Dynamic Range: 61 dB (Colour), 68 dB (B/W) 8 bit Gray Level Progressive Scanning System Frame Rate: 8 to 600 fps 4-pin GPIOs Simpler Data Processing Interface: High-speed USB 2.0 (480 Mbit/s), No Need for External Power Supply Digital Output, No Need for Frame Grabber Custom Programmable With SDK Provided DirectShow & TWAIN Drivers External and Software Trigger Strobe Output for External Flash ROI and Pixel Skipping/Binning OEM Versions Available Applications: Digital Microscopy; Machine Vision; Medical Imaging; Semiconductor Equipment; Test Instruments; Document Scanners; 2D Barcode Readers; Web Camera and Security Video

Cooling Capacities 350 - >600W @ 20°C; Noise @ 1 m < 48 dBA ;Tank Volume 300 ml; Gear or Centrifugal Pump; Process Wetted Materials Aluminium; Facility Wetted Materials Stainless SteelThe ThermoCube II Liquid-to-Liquid Recirculating Chiller by Solid State Cooling Systems is a high-performance thermoelectric solution designed for environments where facility water or process chilled water (PCW) is available. This next-generation chiller offers precise temperature control, whisper-quiet operation, and exceptional configurability, making it ideal for demanding laboratory, semiconductor, and OEM applications.Unlike conventional air-cooled systems, the ThermoCube II Liquid-to-Liquid removes heat using PCW, eliminating the need for fans and heat sinks. This design significantly reduces noise and vibration while enhancing thermal efficiency. With a cooling capacity of up to 600 watts at 20°C and a temperature stability of ±0.05°C, the unit ensures consistent performance even near ambient conditions. Its compact footprint—13 x 11 x 13 inches (32 x 28 x 32 cm)—and lightweight build (28 lbs / 13 kg) allow easy integration into space-constrained setups.Key FeaturesLiquid-to-Liquid Heat Removal: Uses facility water or PCW to dissipate heat, ideal for installations with existing chilled water infrastructure.Thermoelectric Technology: Solid-state cooling with no refrigerants or compressors, ensuring long life and low maintenance.High Precision Control: Digital PID controller maintains ±0.05°C stability across a standard operating range of 5°C to 50°C (extendable to -10°C or 65°C).Quiet and Vibration-Free: Operates below 48 dBA, making it suitable for sensitive environments.Flexible Configuration: Offers 6 pump types (centrifugal or gear) and 8 fitting options including John Guest, CPC, and Swagelok.Universal Power Input: 100–240 VAC, 50/60 Hz, plug-and-play compatibility worldwide.Advanced Communication: RS232, RS485, Ethernet, and TTL interfaces for seamless system integration.Robust Construction: Stainless steel cold plate and facility wetted materials for corrosion resistance and long-term reliability.Safety and Compliance: Equipped with alarms for temperature, fluid level, and system faults; certified to UL, CE, CAN/CSA, and RoHS standards.ApplicationsSemiconductor Equipment: Maintains precise thermal conditions for wafer processing and lithography systems.Life Sciences and Biotech: Supports temperature-sensitive assays, microfluidics, and sample preparation.Laser Cooling: Provides stable cooling for diode lasers and photonics systems requiring high-pressure fluid delivery.Electron Microscopy: Ensures consistent thermal control for scanning electron microscopes and imaging platforms.OEM Integration: Easily embedded into diagnostic, analytical, and industrial systems with existing PCW infrastructure.What's Next?If your facility has access to process chilled water and requires compact, reliable, and precise thermal control, the ThermoCube II Liquid-to-Liquid Recirculating Chiller is the ideal solution. With its modular design, solid-state reliability, and global compatibility, it delivers performance tailored to your application.Contact our sales team today to discuss your configuration needs, request a quote, or explore integration options for your system. 

400-1700 nm; 12-240 Spectral Bands; Push-broom, Snapshot Operation Mode; Spectral Resolution 3-15 nm FWHM; Max. Frame Rate 8-120 fps; Standard Lens 16, 35, 45 mm (21°, 18°, 17° FOV) Within its OCI™ Series of hyperspectral imagers (OCI is a phonetic spelling of "all seeing eye"), BaySpec offers systems ranging from miniaturized push-broom cameras for visible to near-infrared (NIR) to handheld snapshot hyperspectral imagers, hyperspectral cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), all the way to ready-to-fly UAV systems for aerial hyperspectral imaging. OCI™­ F Series cameras are miniaturized (14 x 7 x 7 cm) and lightweight (~570 g) push-broom hyperspectral cameras covering the full visible (VIS) to near-infrared (NIR) wavelength range from 400 to 1000 nm, or short-wave infrared (SWIR) wavelength range from 900 to 1700 nm. The cameras feature a super-speed USB 3.0 interface for fast data transfer rates up to 60 fps. Not dependent on a constant scanning speed, the OCI ­F Series offers versatility on various platforms such as UAVs with perfect hyperspectral image stitching. Three models with 60, 120 or 240 spectral bands are available. The OCI™-2000 snapshot handheld hyperspectral imager brings high-performance hyperspectral imaging in a handheld form factor weighing only approximately 450 g. The OCI™-2000 imager acquires full, continuous VIS to NIR hyperspectral/multispectral data with simple point-and-shoot operation. Compact OCI™-OEM hyperspectral cameras are the optical engines of the handheld OCI-1000™ (push-broom) and OCI-2000™ (snapshot) hyperspectral imager, featuring extreme compactness and fast data transfer rate. The high-performance hyperspectral/multispectral cameras work in push-broom mode (OCI™-U-1000) or snapshot mode (OCI™-U-2000) with high spectral resolution and fast speed in a compact form factor weighing less than 180 g. Continuous hyperspectral data capturing can happen at video rates. Compactness, simple operation and optional SDK makes the OCI™-OEM integration an effortless task. OCI™-UAV airborne hyperspectral cameras are push-broom (OCI™-UAV-1000) or snapshot (OCI™-UAV-2000) cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), or remotely operated vehicles (ROV). Packed with a high-performance, miniature single-board-computer, they acquire VIS to NIR hyperspectral data with continuous spectral and spatial coverage. Ready-to-fly hyperspectral total solutions are also available. Operating of the OCI-UAV cameras is automatic and requires minimal human intervention. The OCI™-M+, a push-broom multispectral imager is specifically designed for aerial imaging, featuring a lightweight camera with compact size. It comes with 12 selective bands including three RGB bands, and nine spectral bands from red edge to NIR – most commonly used for precision agriculture. This imager is fully integrated with DJI Inspire 2 UAV allowing the maximum field coverage with high spatial resolution (4000 spatial pixels). Fully integrated and easy to operate, the OCI-M+ UAV ready-to-fly package has made aerial imaging process very straightforward, and is ideal for applications such as precision agriculture, remote sensing, and geological survey. BaySpec’s OCI™-D airborne VIS-NIR hyperspectral imager with extended wavelength range covers full VIS-NIR wavelength range from 475 to 975 nm. Being a snapshot hyperspectral imager, OCI-D2000 fundamentally eliminates artifacts caused by motions during flight. These innovations significantly reduce the requirements on UAV system, so that integration is almost effortless for many UAV/ROVs. Included with BaySpec’s SpecGrabber™ for camera control and data acquisition, and CubeCreator™ for hyperspectral data processing, the OCI™-D imager offes up to 40 spectral bands with 500x250 pixels and 12 to 15 nm resolution with video rate speed. Key Features: Full Visible (VIS) to Near-infrared (NIR) Coverage: 400 (450, 600) to 1000 nm Full Short-wave Infrared (SWIR) Coverage: 900 to 1700 nm (OCI™-F-SWIR Hyperspectral Camera) Operation Mode: Push-broom, Snapshot Number of Spectral Bands: 12 to 240 Spectral Resolution: 3 nm to 15 nm FWHM Spatial Pixels: 250 to 3956 Pixels x Scan Length (Push-broom Models), Up to 400 x 200 Pixels (Snapshot Models) Standard Lens: 16 mm (21° FOV, OCI™­ F Series), 35 mm (18° FOV, OCI™-UAV, OCI™-OEM Series), 45 mm (17° FOV, OCI™-M+) Objective Lens Interface: C-Mount Faster Scanning With Wide-angle Lens (OCI™-M+) Exposure Time: 20 µs to 1 s (OCI™­ F Series, OCI™-M+), 0(1) to 300 ms (OCI™-UAV, OCI™-OEM Series) Max. Frame Rate: 8 to 120 fps Camera Interface: USB 3.0, USB 2.0 Real‐time Sample Preview (OCI™­ F, OCI™-M+, OCI™-UAV, OCI™-OEM Series) Extremely Compact and Lightweight Imagers With No Moving Parts, High Reliability “True Push‐broom” Scanning With Random Speed (Push-broom Models Only) Innovative Non-slit Design Significantly Reduces System Complexity (OCI™-M+, OCI™-UAV, OCI™-OEM) Extremely Easy-to-use Point-and-shoot Hyperspectral Imager; Self-contained System With Touchscreen Computer Integrated in a Handheld Form; Choice of Lenses for Different FOV (OCI™-2000) Easy Integration in a Variety of Platforms (OCI™­ F, OCI™-UAV, OCI™-OEM, OCI™-D Series) Effortless System Integration (OCI™-M+, OCI™-OEM Series) Eliminate Costly GPS/INS Orthorectification Post Processing Yields Distortion-free Hyperspectral Band Images Ready-to-fly System (OCI™-M+, OCI™-UAV) UAV (OCI™-M+): DJI Inspire 2; 22 min Flying Time; Remote Controller, Battery, Charger, CineSSD & Station Included UAV (OCI™-UAV Series): 700 mm Multi-rotor, Shock-resistant Light Polymer Frame; Up to 20 min Flying Time; Automatic Flight Control Via Mission Planner; Autopilot, 2 x 4500 mAH LiPo Battery, Gimbal for Imager Included Applications: Precision Agriculture; Food Quality Sorting; Sorting; Airborne (Mini) UAV/ROV; Remote Sensing; Chemical Detection; Process Control; Counterfeit Detection & Anti‐Counterfeiting; (Bio)medical Diagnostics; Forensics; Pharmaceuticals; Security; Defense; Oceanography; Ocean Monitoring; Forestry; Estuary Monitoring; Bathymetry; Mineral Discovery; Mining; Oil & Gas Exploration; Geological Survey; Ground Survey; Environmental Studies; Law Enforcement; Handheld Spectroscopy; Tissue Diagnostics; OEM Systems

Proof test: 100 kpsi. Bend insensitive, high index single mode specialty optical fibers. Key optical specifications Operating Wavelength (nm)  > 780 Cutoff Wavelength (nm)  720 ± 50 Maximum Attenuation (dB/km)  4.3 @ 780 nm    3.0 @ 850 nm  Mode-field Diameter (µm)  4.6 ± 0.5 @ 780 nm    5.0 ± 0.5 @ 850 nm             Key geometric, mechanical and environmental specifications Cladding Outside Diameter (µm)  125 ± 0.5 Coating Outside Diameter (µm)  245 ± 10 Core-to-Cladding Offset (µm)  ≤ 0.3 Standard Lengths  500 m, 1 km, 2 km, 5 km, 10 km Proof Test (kpsi)  100 Operating Temperature (°C)  -60 to 85           Performance characterizations* Nominal Delta (%)  0.45 Numerical Aperture  0.14 Refractive Index Value-Core  1.463 @ 651 nm Bendloss (20 mm O.D.; 850 nm) (dB/turn)  < 0.05  Dispersion (ps/nm/km)  -132 @ 780 nm    -99 @ 850 nm Core Diameter (µm)  4.0             * Values in this table are nominal or calculated values