GoldenEye™ Snapshot Hyperspectral Imager
Product number:
SW11754
Manufacturer:
BaySpec
Product information "GoldenEye™ Snapshot Hyperspectral Imager"
400-1100 nm; 140 Spectral Bands; Snapshot Operation Mode; Spectral Resolution 8-60 nm FWHM; Frame Rate 1 fps; Standard Lens 50 mm (40° FOV)
BaySpec’s GoldenEye™ is the ultimate snapshot hyperspectral imager, capturing all in one shot for wavelengths from visible to near infrared (NIR) – from 400 nm to 1100 nm. Using BaySpec’s FT-PI proprietary technology, this novel imager features high sensitivity and is most suitable for low light level applications, such as fluorescence imaging.
Key Features:
- Extremely Compact and Lightweight
- Operation Mode: Snapshot
- Snapshot Imager With One-shot Operation
- Extended Wavelength Range: 400 nm to 1100 nm
- Number of Spectral bands: Approx. 140
- Spectral Resolution: 8 nm to 60 nm FWHM
- Spatial Pixels: Approx. 648 x 488
- Standard Lens: 50 mm (40° FOV)
- Objective Lens Interface: C-Mount
- Frame Rate: 1 fps
- Wavelength Calibration: Factory Calibrated
- High Sensitivity for Low-light Applications
- Effortless System Integration
Applications: Machine Vision; Fluorescence Imaging; Medical Diagnosis; Biomedical
Manufacturer "BaySpec"
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OCI™ Series Hyperspectral Imagers
400-1700 nm; 12-240 Spectral Bands; Push-broom, Snapshot Operation Mode; Spectral Resolution 3-15 nm FWHM; Max. Frame Rate 8-120 fps; Standard Lens 16, 35, 45 mm (21°, 18°, 17° FOV)
Within its OCI™ Series of hyperspectral imagers (OCI is a phonetic spelling of "all seeing eye"), BaySpec offers systems ranging from miniaturized push-broom cameras for visible to near-infrared (NIR) to handheld snapshot hyperspectral imagers, hyperspectral cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), all the way to ready-to-fly UAV systems for aerial hyperspectral imaging.
OCI™ F Series cameras are miniaturized (14 x 7 x 7 cm) and lightweight (~570 g) push-broom hyperspectral cameras covering the full visible (VIS) to near-infrared (NIR) wavelength range from 400 to 1000 nm, or short-wave infrared (SWIR) wavelength range from 900 to 1700 nm. The cameras feature a super-speed USB 3.0 interface for fast data transfer rates up to 60 fps. Not dependent on a constant scanning speed, the OCI F Series offers versatility on various platforms such as UAVs with perfect hyperspectral image stitching. Three models with 60, 120 or 240 spectral bands are available.
The OCI™-2000 snapshot handheld hyperspectral imager brings high-performance hyperspectral imaging in a handheld form factor weighing only approximately 450 g. The OCI™-2000 imager acquires full, continuous VIS to NIR hyperspectral/multispectral data with simple point-and-shoot operation.
Compact OCI™-OEM hyperspectral cameras are the optical engines of the handheld OCI-1000™ (push-broom) and OCI-2000™ (snapshot) hyperspectral imager, featuring extreme compactness and fast data transfer rate. The high-performance hyperspectral/multispectral cameras work in push-broom mode (OCI™-U-1000) or snapshot mode (OCI™-U-2000) with high spectral resolution and fast speed in a compact form factor weighing less than 180 g. Continuous hyperspectral data capturing can happen at video rates. Compactness, simple operation and optional SDK makes the OCI™-OEM integration an effortless task.
OCI™-UAV airborne hyperspectral cameras are push-broom (OCI™-UAV-1000) or snapshot (OCI™-UAV-2000) cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), or remotely operated vehicles (ROV). Packed with a high-performance, miniature single-board-computer, they acquire VIS to NIR hyperspectral data with continuous spectral and spatial coverage. Ready-to-fly hyperspectral total solutions are also available. Operating of the OCI-UAV cameras is automatic and requires minimal human intervention.
The OCI™-M+, a push-broom multispectral imager is specifically designed for aerial imaging, featuring a lightweight camera with compact size. It comes with 12 selective bands including three RGB bands, and nine spectral bands from red edge to NIR – most commonly used for precision agriculture. This imager is fully integrated with DJI Inspire 2 UAV allowing the maximum field coverage with high spatial resolution (4000 spatial pixels). Fully integrated and easy to operate, the OCI-M+ UAV ready-to-fly package has made aerial imaging process very straightforward, and is ideal for applications such as precision agriculture, remote sensing, and geological survey.
BaySpec’s OCI™-D airborne VIS-NIR hyperspectral imager with extended wavelength range covers full VIS-NIR wavelength range from 475 to 975 nm. Being a snapshot hyperspectral imager, OCI-D2000 fundamentally eliminates artifacts caused by motions during flight. These innovations significantly reduce the requirements on UAV system, so that integration is almost effortless for many UAV/ROVs. Included with BaySpec’s SpecGrabber™ for camera control and data acquisition, and CubeCreator™ for hyperspectral data processing, the OCI™-D imager offes up to 40 spectral bands with 500x250 pixels and 12 to 15 nm resolution with video rate speed.
Key Features:
Full Visible (VIS) to Near-infrared (NIR) Coverage: 400 (450, 600) to 1000 nm
Full Short-wave Infrared (SWIR) Coverage: 900 to 1700 nm (OCI™-F-SWIR Hyperspectral Camera)
Operation Mode: Push-broom, Snapshot
Number of Spectral Bands: 12 to 240
Spectral Resolution: 3 nm to 15 nm FWHM
Spatial Pixels: 250 to 3956 Pixels x Scan Length (Push-broom Models), Up to 400 x 200 Pixels (Snapshot Models)
Standard Lens: 16 mm (21° FOV, OCI™ F Series), 35 mm (18° FOV, OCI™-UAV, OCI™-OEM Series), 45 mm (17° FOV, OCI™-M+)
Objective Lens Interface: C-Mount
Faster Scanning With Wide-angle Lens (OCI™-M+)
Exposure Time: 20 µs to 1 s (OCI™ F Series, OCI™-M+), 0(1) to 300 ms (OCI™-UAV, OCI™-OEM Series)
Max. Frame Rate: 8 to 120 fps
Camera Interface: USB 3.0, USB 2.0
Real‐time Sample Preview (OCI™ F, OCI™-M+, OCI™-UAV, OCI™-OEM Series)
Extremely Compact and Lightweight
Imagers With No Moving Parts, High Reliability
“True Push‐broom” Scanning With Random Speed (Push-broom Models Only)
Innovative Non-slit Design Significantly Reduces System Complexity (OCI™-M+, OCI™-UAV, OCI™-OEM)
Extremely Easy-to-use Point-and-shoot Hyperspectral Imager; Self-contained System With Touchscreen Computer Integrated in a Handheld Form; Choice of Lenses for Different FOV (OCI™-2000)
Easy Integration in a Variety of Platforms (OCI™ F, OCI™-UAV, OCI™-OEM, OCI™-D Series)
Effortless System Integration (OCI™-M+, OCI™-OEM Series)
Eliminate Costly GPS/INS Orthorectification Post Processing
Yields Distortion-free Hyperspectral Band Images
Ready-to-fly System (OCI™-M+, OCI™-UAV)
UAV (OCI™-M+): DJI Inspire 2; 22 min Flying Time; Remote Controller, Battery, Charger, CineSSD & Station Included
UAV (OCI™-UAV Series): 700 mm Multi-rotor, Shock-resistant Light Polymer Frame; Up to 20 min Flying Time; Automatic Flight Control Via Mission Planner; Autopilot, 2 x 4500 mAH LiPo Battery, Gimbal for Imager Included
Applications: Precision Agriculture; Food Quality Sorting; Sorting; Airborne (Mini) UAV/ROV; Remote Sensing; Chemical Detection; Process Control; Counterfeit Detection & Anti‐Counterfeiting; (Bio)medical Diagnostics; Forensics; Pharmaceuticals; Security; Defense; Oceanography; Ocean Monitoring; Forestry; Estuary Monitoring; Bathymetry; Mineral Discovery; Mining; Oil & Gas Exploration; Geological Survey; Ground Survey; Environmental Studies; Law Enforcement; Handheld Spectroscopy; Tissue Diagnostics; OEM Systems
Product number:
SW11753
Manufacturer:
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OCI™ Series Hyperspectral Imagers
400-1700 nm; 12-240 Spectral Bands; Push-broom, Snapshot Operation Mode; Spectral Resolution 3-15 nm FWHM; Max. Frame Rate 8-120 fps; Standard Lens 16, 35, 45 mm (21°, 18°, 17° FOV)
Within its OCI™ Series of hyperspectral imagers (OCI is a phonetic spelling of "all seeing eye"), BaySpec offers systems ranging from miniaturized push-broom cameras for visible to near-infrared (NIR) to handheld snapshot hyperspectral imagers, hyperspectral cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), all the way to ready-to-fly UAV systems for aerial hyperspectral imaging.
OCI™ F Series cameras are miniaturized (14 x 7 x 7 cm) and lightweight (~570 g) push-broom hyperspectral cameras covering the full visible (VIS) to near-infrared (NIR) wavelength range from 400 to 1000 nm, or short-wave infrared (SWIR) wavelength range from 900 to 1700 nm. The cameras feature a super-speed USB 3.0 interface for fast data transfer rates up to 60 fps. Not dependent on a constant scanning speed, the OCI F Series offers versatility on various platforms such as UAVs with perfect hyperspectral image stitching. Three models with 60, 120 or 240 spectral bands are available.
The OCI™-2000 snapshot handheld hyperspectral imager brings high-performance hyperspectral imaging in a handheld form factor weighing only approximately 450 g. The OCI™-2000 imager acquires full, continuous VIS to NIR hyperspectral/multispectral data with simple point-and-shoot operation.
Compact OCI™-OEM hyperspectral cameras are the optical engines of the handheld OCI-1000™ (push-broom) and OCI-2000™ (snapshot) hyperspectral imager, featuring extreme compactness and fast data transfer rate. The high-performance hyperspectral/multispectral cameras work in push-broom mode (OCI™-U-1000) or snapshot mode (OCI™-U-2000) with high spectral resolution and fast speed in a compact form factor weighing less than 180 g. Continuous hyperspectral data capturing can happen at video rates. Compactness, simple operation and optional SDK makes the OCI™-OEM integration an effortless task.
OCI™-UAV airborne hyperspectral cameras are push-broom (OCI™-UAV-1000) or snapshot (OCI™-UAV-2000) cameras designed specifically for use on unmanned aerial vehicles/systems (UAV/UAS), or remotely operated vehicles (ROV). Packed with a high-performance, miniature single-board-computer, they acquire VIS to NIR hyperspectral data with continuous spectral and spatial coverage. Ready-to-fly hyperspectral total solutions are also available. Operating of the OCI-UAV cameras is automatic and requires minimal human intervention.
The OCI™-M+, a push-broom multispectral imager is specifically designed for aerial imaging, featuring a lightweight camera with compact size. It comes with 12 selective bands including three RGB bands, and nine spectral bands from red edge to NIR – most commonly used for precision agriculture. This imager is fully integrated with DJI Inspire 2 UAV allowing the maximum field coverage with high spatial resolution (4000 spatial pixels). Fully integrated and easy to operate, the OCI-M+ UAV ready-to-fly package has made aerial imaging process very straightforward, and is ideal for applications such as precision agriculture, remote sensing, and geological survey.
BaySpec’s OCI™-D airborne VIS-NIR hyperspectral imager with extended wavelength range covers full VIS-NIR wavelength range from 475 to 975 nm. Being a snapshot hyperspectral imager, OCI-D2000 fundamentally eliminates artifacts caused by motions during flight. These innovations significantly reduce the requirements on UAV system, so that integration is almost effortless for many UAV/ROVs. Included with BaySpec’s SpecGrabber™ for camera control and data acquisition, and CubeCreator™ for hyperspectral data processing, the OCI™-D imager offes up to 40 spectral bands with 500x250 pixels and 12 to 15 nm resolution with video rate speed.
Key Features:
Full Visible (VIS) to Near-infrared (NIR) Coverage: 400 (450, 600) to 1000 nm
Full Short-wave Infrared (SWIR) Coverage: 900 to 1700 nm (OCI™-F-SWIR Hyperspectral Camera)
Operation Mode: Push-broom, Snapshot
Number of Spectral Bands: 12 to 240
Spectral Resolution: 3 nm to 15 nm FWHM
Spatial Pixels: 250 to 3956 Pixels x Scan Length (Push-broom Models), Up to 400 x 200 Pixels (Snapshot Models)
Standard Lens: 16 mm (21° FOV, OCI™ F Series), 35 mm (18° FOV, OCI™-UAV, OCI™-OEM Series), 45 mm (17° FOV, OCI™-M+)
Objective Lens Interface: C-Mount
Faster Scanning With Wide-angle Lens (OCI™-M+)
Exposure Time: 20 µs to 1 s (OCI™ F Series, OCI™-M+), 0(1) to 300 ms (OCI™-UAV, OCI™-OEM Series)
Max. Frame Rate: 8 to 120 fps
Camera Interface: USB 3.0, USB 2.0
Real‐time Sample Preview (OCI™ F, OCI™-M+, OCI™-UAV, OCI™-OEM Series)
Extremely Compact and Lightweight
Imagers With No Moving Parts, High Reliability
“True Push‐broom” Scanning With Random Speed (Push-broom Models Only)
Innovative Non-slit Design Significantly Reduces System Complexity (OCI™-M+, OCI™-UAV, OCI™-OEM)
Extremely Easy-to-use Point-and-shoot Hyperspectral Imager; Self-contained System With Touchscreen Computer Integrated in a Handheld Form; Choice of Lenses for Different FOV (OCI™-2000)
Easy Integration in a Variety of Platforms (OCI™ F, OCI™-UAV, OCI™-OEM, OCI™-D Series)
Effortless System Integration (OCI™-M+, OCI™-OEM Series)
Eliminate Costly GPS/INS Orthorectification Post Processing
Yields Distortion-free Hyperspectral Band Images
Ready-to-fly System (OCI™-M+, OCI™-UAV)
UAV (OCI™-M+): DJI Inspire 2; 22 min Flying Time; Remote Controller, Battery, Charger, CineSSD & Station Included
UAV (OCI™-UAV Series): 700 mm Multi-rotor, Shock-resistant Light Polymer Frame; Up to 20 min Flying Time; Automatic Flight Control Via Mission Planner; Autopilot, 2 x 4500 mAH LiPo Battery, Gimbal for Imager Included
Applications: Precision Agriculture; Food Quality Sorting; Sorting; Airborne (Mini) UAV/ROV; Remote Sensing; Chemical Detection; Process Control; Counterfeit Detection & Anti‐Counterfeiting; (Bio)medical Diagnostics; Forensics; Pharmaceuticals; Security; Defense; Oceanography; Ocean Monitoring; Forestry; Estuary Monitoring; Bathymetry; Mineral Discovery; Mining; Oil & Gas Exploration; Geological Survey; Ground Survey; Environmental Studies; Law Enforcement; Handheld Spectroscopy; Tissue Diagnostics; OEM Systems
Product number:
SW11753
Manufacturer:
B-Series CMOS Cameras
0.36-5 MP; Pixel Size 2.2x2.2-6.0x6.0 µm; Sensor Size 1/3”-1/2” Diagonal; Colour or B/W; 3-310 fps; Resolution 8-12 bit; USB 2.0; Buffered; Progressive Scan; Dynamic Range >55-70 dB; Board-level or Enclosed
Mightex’s B-Series USB 2.0 CMOS cameras with frame buffers are optimized for machine-vision applications, and they can also be used for a wide variety of other applications such as digital microscopy and medical imaging, where quality, ease of use, and cost-effectiveness are crucial.
B-Series cameras are available as colour or B/W versions, with resolutions from Wide VGA (WVGA, 752x480) up to 5 MP (2592x1944) and 8, 10 or 12 bit, and they can be ordered as “naked” board-level device or pre-mounted in an enclosure. Monochrome cameras often exhibit a 20% higher spatial resolution than their colour counterparts because no pixel interpolation is necessary. Without a Bayer colour filter on the sensor, monochrome cameras are also more sensitive than colour sensors, especially in near IR and UV regions.
Mightex’s B-Series cameras feature built-in frame buffers, global shutter (Wide VGA versions), external trigger-in, strobe-out, and a powerful camera engine that supports multiple cameras. The frame rate can be as high as 60 fps in full resolution and up to 600 fps using ROI mode (depending on colour or B/W and sensor resolution).
In addition, a user-friendly GUI based application software and an SDK are provided for custom software development. A DirectShow driver and a TWAIN driver are included (except for 5 MP B/W versions), and a USB command set protocol is provided for non-Windows based applications. A Linux driver is also either included (5 MP and Wide VGA B/W versions) or available upon request.
Available models are:
BCN-C050-U/BCN-C050-US: 5 MP, colour, lens mount C/CS, board-level
BCE-C050-U/BCE-C050-US: 5 MP, colour, lens mount C/CS, enclosed
BCN-B050-U/BTN-B050-U: 5 MP, B/W, 8/12 bit, lens mount C or CS, board-level
BCE-B050-U/BTE-B050-U: 5 MP, B/W, 8/12 bit, lens mount C or CS, enclosed
BCN-C030-U/BCN-C030-US: 3 MP, colour, lens mount C/CS, board-level
BCE-C030-U/BCE-C030-US: 3 MP, colour, lens mount C/CS, enclosed
BCN-B013-U/BCN-B013-US: 1.3 MP, B/W, 8 bit, lens mount C/CS, board-level
BCE-B013-U/BCE-B013-US: 1.3 MP, B/W, 8 bit, lens mount C/CS, enclosed
BTN-B013-U/BTN-B013-US: 1.3 MP, B/W, 10 bit, lens mount C/CS, board-level
BTE-B013-U/BTE-B013-US: 1.3 MP, B/W, 10 bit, lens mount C/CS, enclosed
BCN-CG04-U/BCN-CG04-US: WVGA, colour, lens mount C/CS, board-level
BCE-CG04-U/BCE-CG04-US: WVGA, colour, lens mount C/CS, enclosed
BCN-BG04-U/BCN-BG04-US: WVGA, B/W, 8 bit, lens mount C/CS, board-level
BCE-BG04-U/BCE-BG04-US: WVGA, B/W, 8 bit, lens mount C/CS, enclosed
BTN-BG04-U/BTN-BG04-US: WVGA, B/W, 10 bit, lens mount C/CS, board-level
BTE-BG04-U/BTE-BG04-US: WVGA, B/W, 10 bit, lens mount C/CS, enclosed
Note: Board-level cameras are designed for OEM applications, when a system-level enclosure is usually provided. In order to avoid electro-static discharge (ESD) related damages, workforce handling a board-level camera should be properly grounded. ESD related damages are considered as mishandling and are not covered by product warranty. For lab use, it is strongly recommended to choose an enclosed camera instead of a board-level one.
Key Features:
Colour or Black&White (B/W, Monochrome)
Board-level or Enclosed Versions Available
Ultra-compact
Active Imaging Pixels: 0.36 to 5 MP, 752x480 to 2592x1944
Pixel Size: 2.2 x 2.2 to 6.0 x 6.0 µm
Sensor Size (Diagonal): 1/3” to 1/2”
Dynamic Range: >55 to 70 dB
Buffered, 32 MByte On-board Memory (3 to 23 Frames at Full Resolution, Depending on Sensor)
8, 10 or 12 bit Gray Level
Progressive Scanning System
Frame Rate: 3 to 310 fps
True Global Shutter (Wide VGA Versions)
Supports Simultaneous Image Capturing From Multiple Cameras
4-pin GPIOs
Arbitrary ROI Supported (Wide VGA Versions)
Interface: High-speed USB 2.0 (480 Mbit/s), No Need for External Power Supply
Digital Output, No Need for Frame Grabber
Custom Programmable With SDK Provided
DirectShow & TWAIN Drivers
Linux Driver (5 MP and Wide VGA B/W Versions)
USB Command Set Protocol for Non-Windows-based Applications
External and Software Trigger
Strobe Output for External Flash
Precise Frame Rate Setting (Wide VGA Versions)
ROI (Not Wide VGA Versions) and Pixel Skipping/Binning
OEM Versions Available
Applications: Machine Vision and Stereo Vision; Medical Imaging; Semiconductor Equipment; Test Instruments; High-quality ID Photo Capture; Document Scanners; Digital Microscopy; Web Camera and Security Video
Product number:
SW11205
Manufacturer:
Chromacity 1280 Femtosecond Laser
1280 nm; Pulse Energy 300 pJ; Repetition Rate 100 MHz; Pulse Duration 80 fs; Output Power ≤30 mW
The Chromacity 1280 femtosecond laser generates femtosecond pulses, with a fiber delivery output, to drive advances in test and measurement applications within the semiconductor industry.
While operating at 1280 nm, Chromacity’s ultrafast laser can also generate 80 fs pulses across the 1250 nm to 1310 nm wavelength range, and combined with excellent beam quality, the Chromacity 1280 has scope to broaden fundamental research and material characterization capabilities.
The 1280 nm laser inherits Chromacity’s novel laser design architecture and patented manufacturing expertise to develop a high-performance and truly stable light source, which is operationally ready with minimal set-up time.
Within the range of typical applications for this laser, laser scanning and optoelectronic imaging of integrated circuits is crucial towards optimal semiconductor failure analysis, at a time when the industry faces global chip shortages. With seamless integration into Laser Assisted Device Alteration (LADA) platforms, Chromacity’s robust 1280 nm laser source can help determine soft defect localization, using near-IR microscopy techniques including (2P-LADA).
Further applications include Two-Photon Laser Assisted Device Alteration (2P-LADA), a high-resolution imaging technique which exploits two-photon absorption (TPA) to deliver precise three-dimensional localization of the photocarriers, injected by the TPA process, to accurately locate and characterize failures, with optimum spatial and temporal performance.
Similarly, the Two-Photon Optical Beam Induced Current (TOBIC) technique is another laser-scanning method for imaging integrated circuits. This technique uses ultrashort-pulse lasers to induce a photocurrent which is subsequently mapped to generate an image. TOBIC imaging occurs around 1250 nm to 1550 nm, where the beam is easily transmitted through the silicon band gap.
Key Features:
Fiber Output
Compact Laser Housing
Air-cooled Operation
Intuitive Web Browser Interface
Remote Installation Capability
Output Power: Up to 30 mW From Fiber-coupled Output
Peak Power: 4kW
Wavelength: 1280 nm
Spectral Bandwidth: 80 nm
Pulse Duration: 80 fs
Pulse Energy: 300 pJ
Repetition Rate: Locked to 100 MHz
Control Interface: Web Browser Interface, Ethernet and Serial Port (RS232) Also Available
Cooling: Air-cooled
Electrical: 110-240 VAC, 50-60 Hz, 80 W
Dimensions 1280 Module: 614 mm x 304 mm x 96 mm (LxWxH)
Applications: Two-photon Laser-assisted Device Alteration (2p LADA) in Silicon Integrated Circuits; Two-photon Optical Beam Induced Current (TOBIC); Material Characterization; Fundamental Research; Interrogating Photonics Integrated Circuits (PIC)
Product number:
SW11929
Manufacturer:
TACHYON Series High-speed Imaging MWIR Cameras
Detector Type VPD PbSe FPA; Spectral Range 1.0-5.0 µm; Pixel Size 50x50, 130x130 µm; 1,024, 16,384 Pixels; Resolution 32x32, 128x128; Max. Frame Rate 1,00-10,000 fps; Interface USB 2.0, GigE VISION 2.0
New Infrared Technologies’ (NIT) TACHYON Series of high-speed imaging MWIR (midwave infrared) cameras provide frame rates of up to 10,000 fps (frames per second) at the full resolution of up to 128×128 pixels – in uncooled operation.
While the TACHYON 16k CAMERA features 2,000 fps at full resolution, the TACHYON 16K CAMERA PLUS model allows up to 4,000 fps at full resolution as well as software-configurable ROI windowing modes, hardware NUC correction and selectable data transmission modes. Uncooled and affordable, fast and robust, the compact size TACHYON 16K CAMERA models are optimal for volume requirements and targeted for full integration in Industry 4.0 applications.
Both TACHYON 16K CAMERA and CAMERA PLUS models are based on NIT’s TACHYON 16K FPA (Focal Plane Array), sensitive in the 1 µm to 5 µm spectral range. This FPA utilizes VPD PbSe, entirely developed and manufactured by NIT, providing the first quantum infrared technology monolithically compatible with Si-CMOS circuitry. With on-chip A/D readout electronics as well as on-chip dark current cancellation circuit and a digital interface for control and data, the TACHYON 16K FPA features global shutter snapshot readout of 14 Bit raw data and a programmable integration time between 20 µs and 1,000 µs.
NIT’s TACHYON 1024 microCAMERA is an uncooled MWIR camera with an IP67-rated enclosure for industrial environments. The camera is powered through a USB 2.0 (high speed) interface with industrial M12 USB connector and capable to reach a frame rate of 1,000 fps. Its miniaturized size, based in a SWaP-C concept, ensures perfect integration into the production process.
The TACHYON 1024 microCAMERA is based on NIT’s TACHYON 1024 FPA, an uncooled 32x32 VPD PbSe focal plane array with digital interface and high-speed capabilities up to 10,000 images per second, sensitive in the 1 µm to 5 µm spectral range. With on-chip A/D readout electronics as well as on-chip dark current cancellation circuit and a digital interface for control and data, the TACHYON 1024 FPA features snapshot readout of 10 Bit raw data and a programmable integration time between 100 µs and 1,000 µs.
Based on the TYCHYON 1024 FPA, NIT also provides the TACHYON 1024 microCORE uncooled MWIR module with USB connection. The module is USB-powered and capable to reach an acquisition frame rate of 1,000 fps. Optimized size and affordable cost ensure perfect integration in the production process, also in cost-sensitive machine vision applications.
For linear array cameras from New Infrared Technologies, please refer to the LUXELL series of linear array MWIR cameras. And for applications requiring single-pixel MWIR detection, have a look at NIT’s LEPTON series of single-pixel VPD PbS MWIR detectors.
Key Features:
Detector Type: VPD PbSe FPA With Digital Interface
Uncooled Operation
Array Format: 128x128 (16,384 Pixels), 32x32 (1,024 Pixels)
Pixel Size: 50 µm x 50 µm, 130 µm x 130 µm
ROI Windowing Function (64x64, 32x32, 1x128) for TACHYON 16K CAMERA Models; Window Position & Dimensions SW-configurable (PLUS Model)
Maximum Frame Rate: 1,000 fps to 10,000 fps
Spectral Range: MWIR, 1.0 µm to 5.0 µm
Peak Wavelength of Detection: 3.7 µm
Integration Time: 10 µs to 1,000 µs, Selectable
Data Transmission Modes: Raw Data 10 Bit, 14 Bit; NUC Corrected 16 Bit and High-speed RAW/NUC 12 Bit (TACHYON 16K CAMERA PLUS)
Minimum Temperature of Detection: +100 °C
Interfaces: USB 2.0 High-speed (480 Mbps); GigE VISION 2.0 With PoE, Multi-purpose DI/DO Connector (Trigger In/out) for TACHYON 16K CAMERA PLUS
Mechanical Shutter for 1-pt Offset Correction
Start-up Time: <10 s (TACHYON 16K CAMERA Models)
Power Supply: PoE, 8 W (TACHYON 16K CAMERA Models), 5 VDC Through USB Connection
Metal Housing With Rear Connectors and M3 & M4 Tripod Screw Holes (TACHYON 16K CAMERA Models)
Dimensions TACHYON 16K CAMERA Models: 66 x 62 x 62 mm
Weight TACHYON 16K CAMERA Models: 400 g
Optics TACHYON 16K CAMERA Models (Standard Option): f = 35 mm, F# 1.1, FoV 10.5° x 10.5 °, AR Coating, Manual Focus, CS-Mount
Dimensions TACHYON 1024 microCAMERA: 98.0 x 49.5 x 61.0 mm
Weight TACHYON 1024 microCAMERA: 250 g
Optics TACHYON 1024 microCAMERA: f = 24 mm, F#1.2, FoV 10.25° x 10.25° (Standard), f = 48 mm, F#1.6, FoV 5.1° x 5.1° (Additional Lens Option)
Software Included: NIT Software Suite, SDK Available for Custom Software Programming
Dimensions TACHYON 1024 microCORE Module: 43 x 36 x 17 mm
Biasing Voltage TACHYON 1024 microCORE Module: 1.00 V to 2.00 V, Selectable
Metal Housing (46.5 x 39.5 x 29.5 mm) With CS-mount Optics Interface Available for TACHYON 1024 microCORE Module
Applications: Machine Vision; Additive Manufacturing Monitoring; Industrial Automation; Laser Process Monitoring; Industrial Process Monitoring & Control (welding, Cutting, etc.); Gas Detection; Spectroscopy; Fire Detection; Glass Manufacturing Quality Assurance; Research & Development; OEM Integration
Product number:
SW11623
Manufacturer: