UV CHAMBER™ UV LED Curing Oven

Product number: SW11665

Manufacturer: UWave

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Product information "UV CHAMBER™ UV LED Curing Oven"

Easy to Use; Irradiance ≤250/≤1000 mW/cm² (1 UCUBE™); Wavelength 275-465 nm (UCUBE™); Power Supply 100-240 VAC; Active Air Cooling With Fans, Water Cooling Optional

The UV CHAMBER™ is an easy-to-use UV LED irradiation oven designed and manufactured by UWAVE and suitable for a wide range of applications like curing, bonding, photolithography or photoaging. Thanks to its ergonomic design, the UV CHAMBER™ gives full control over UV insolation processes and a great repeatability. Users can tune the time, the power of the illumination as well as the working distance.

These combined features make the UV CHAMBER™ the ideal UV LED irradiation oven for semi-automatic UV curing processes or R&D lab work. Thanks to its design and the technology included, the UV CHAMBER™ provides homogeneous irradiance and an efficient UV curing for any position of the 300 mm x 300 mm tray.

Multiple parameters can be easily selected and changed to fit your UV curing process such as the insolation time, the irradiance or the cured area:

Time setting range from 1 s to 100 min with a 1 s resolution
Power setting range from 20% to 99% with a 1% resolution
Working distances from the emitting window of the UV LED curing lamp selectable with tray position: 35, 85, 135, 185 & 235 mm

An intelligent security system between the lamp and the door avoids unwanted UV light exposure by cutting off the illumination if the door is open. Thanks to the security window, users can watch the interior of the UV CHAMBER™ during exposure without any risk.

The UV CHAMBER™ is delivered with the UCUBE™ version that fits your optical power and homogeneity needs, or with another product on request. UCUBE™ UV LED flood curing lamps, suitable for the UV CHAMBER™, are optionally available with dispersive or collimated optics, air- or water-cooled, in two different power versions (25 LEDs, 250 mW/cm² or 100 LEDs, 1,000 mW/cm²) and with wavelengths of 275 nm, 305 nm, 365 nm, 385 nm, 395 nm, 405 nm and 465 nm.

To meet actual concerns on contamination and spread of virus and bacteria, UWAVE has developed a UV-C version with the best 275 nm LED in the market. Equipped with this UCUBE™ model, the UV CHAMBER™ allows a quick & efficient disinfection process of objects and surfaces for targeted objects or R&D tests – ensuring a safe process thanks to its secured design. Any other wavelength (UV-C, UV-B, Visible and IR) is available upon request, please contact AMS Technologies for further details.

The UV CHAMBER™ UV LED irradiation oven can be tailored depending on your needs:

Number of light sources variable from 1 to 4 UCUBE™ systems for a larger insolated area
Instead of UCUBE™, other UV LED flood curing systems such as the USPOT™ or UBAR™ can be installed
Mechanical customization is available, e.g. holes for various measurement sensors (UV radiometer, temperature probe), nitrogen atmosphere adaptation, etc.

Please contact AMS Technologies to discuss your customized UV LED curing oven, tailored to your requirements.

Key Features:

Easy to Use: Plug&Play Solution With Simplified Interface System
Safe: Secured Chamber With an Efficient & Smart UV Protection for the Operator
Homogeneity: >90%
Variable Insolation Time, Irradiation Power and Working Distance
Can Be Supplied With 1 to 4 UCUBE™ Systems or Other UV LED Flood Curing Systems such as USPOT™ or UBAR™
Max. Irradiance of UCUBE™ System: Up to 250/1,000 mW/cm²
Wavelength of UCUBE™ System: 275, 305, 365, 385, 395, 405 or 465 nm
Power Supply: 100 to 240 VAC, 400 W (Single UCUBE™ System)
Cooling System: Active Air Cooling With Fans, Water Cooling Option Available (UCUBE™ System)
Body Material: Aluminium Alloy
Dimensions: 306 mm x 382 mm x 605 mm
Interior Dimensions: 300 mm x 300 mm x 300 mm
Weight: 18 kg (With Single UCUBE™ System)

Applications: UV Curing and Bonding; UV Photolithography; UV Photoaging; Assembly of Components in the Opto-electronic Industry; UV Tests for Chemical Formulations

Manufacturer "UWave"

UWAVE designs and manufactures innovative, powerful, and easy-to-use UV curing LED lighting systems for photonics, cosmetics, electronics, medical, chemical or high-tech industries – also proposing new solutions for other markets such as fluorescence or UVC disinfection. UWAVE UV LED curing systems available from AMS Technologies include wireless and wired spot curing solutions, UV LED flood curing systems providing homogeneous and powerful light for larger curing areas, as well as an UV LED irradiation oven, ready to use for semi-automatic UV curing processes or R&D lab work.

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Adhesives for Optical Waveguides

Refractive Index 1.458-1.567; Viscosity 145-2,000 mPas; Optical Transmittance (@1 mm, 1.3 µm) 82%-94%; Bond Strength 99->247 kgf/cm²; UV Curing Conditions 10, 30 mW/cm², 5, 10 min You are looking for PLC and fiber array adhesion with high reliability? Try NTT-AT’s series of adhesives for optical waveguides! Within this series you find acrylate-based adhesives (AT6001, AT8224)with excellent durability that have cleared a large number of reliability tests. Epoxy adhesives are also part of this series, with a refractive index that can be accurately controlled within a range of 1.456 to 1.567 (±0.005, Na-D) – or with a fixed refractive index that is the same as quartz to deliver low reflectance (GA700L, GA700H). UV curing of the adhesives for optical waveguides allows for adhesion in a short time frame and makes alignment easy. The adhesives withstand a solder reflow process for Si Photonics (+260 °C). In order to achieve high reliability, a product must clear the tests conducted by the users themselves. If you have had even just a bit of dissatisfaction in reliability test results in the past, please put NTT-AT’s adhesives for optical waveguides to the test. In case you need any consulting regarding issues related to adhesion, please contact the AMS Technologies optical adhesives experts to discuss the detailed challenges of your application. Key Features: Optical Adhesive Used for PLC to Fiber Link-up Precision Refraction Index of 1.458 to 1.567 (±0.005, Na-D) Provides Controllability Ultraviolet (UV) Curing Conditions: 10, 30 mW/cm², 5, 10 min Very Little Adhesion Loss Due to Heat or Moisture, Providing High Durability Viscosity: 145 to 2,000 mPas Optical Transmittance: 82% to 94% (@1 mm Thickness, Wavelength 1.3 µm) Bond Strength: 99 to >247 kgf/cm² Applications: Gluing of Optical Waveguides; PLC to Fiber Link-up; Silicon Waveguide to Fiber Link-up

Product number: SW11650

Manufacturer:

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Viscosity 36,000, 180,000 mPas; Bending Adhesion Strength >114, >128 kgf/cm²; UV Curing Conditions 100 mW/cm², 2 min; Curing Shrinkage Rate 0.5%, 0.9%; Tg +195, +233 °C; Thermal Expansion Coefficient 18, 20 ppm/°C NTT-AT’s high-precision optical adhesives allow easy fixation of optical components with sub-micron accuracy. Based on epoxy, these high-precision optical adhesives are available with low viscosity of 36,000 mPas (AT3916P) or with high viscosity of 180,000 mPas (AT3862P). Both adhesives show minimal position changes due to curing time and temperature. Shrinkage rate during curing is very low for this series of high-precision optical adhesives, and the thermal expansion coefficient is small. Using ultraviolet (UV) ray curing makes alignment easy. NTT-AT’s series of high-precision adhesives show excellent durability: Even after a high-temperature process at +260 °C, the adhesives’ bonding strength does not change. And no peeling occurred after 200 cycles in a simplified heat cycle test. In order to achieve high reliability, a product must clear the tests conducted by the users themselves. If you have had even just a bit of dissatisfaction in precision or durability results in the past, please put NTT-AT’s high-precision adhesives to the test. In case you need any consulting regarding issues related to adhesion, please contact the AMS Technologies optical adhesives experts to discuss the detailed challenges of your application. Key Features: Low Shrinkage Rate During Curing: 0.5% (AT3862P), 0.9% (AT3916P) Low Thermal Expansion Coefficient: <20 ppm/°C Ultraviolet (UV) Curing for Easy Alignment Excellent Durability: No Change in Bonding Strength After +260 °C High-temperature Process, No Peeling After 200 Heat Test Cycles Viscosity: 36,000, 180,000 mPas Bending Adhesion Strength: >114, >128 kgf/cm² UV Curing Conditions: 100 mW/cm², 2 min Glass Transition Temperature Tg: +195, +233 °C Applications: High-precision Fixation of Optical Components With Sub-micron Accuracy

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