TCube Edge 2S (10-14072-2S-0-F3P3A7) TEC Chiller

Peltier Cooling Assembly Kit; Cooling Capacity 130 W @+25°C; with Detachable Carrier Plate; Power Supply 24 VDC Key Features: Ideal for Precise Cooling of Medical and Industrial Lasers Efficient Peltier System, no Liquids, no Moving Parts (Except Fans) Allows for Excellent Temperature Stability Low Vibration, Low Noise Lightweight, Very Compact Easy to Integrate The compact mDC-T-130-24-KIT thermoelectric plate-to-air cooling kit was developed for precise temperature control of laser diode modules and direct heat transfer to the ambient air. The highly efficient, solid state mini direct cooling system reaches a cooling capacity of 130 W for 24 VDC supply voltage and +25°C on laser mounting plate and +25 °C ambient temperature. The mDC-T-130-24-KIT Peltier cooling assembly kit comes with a 108 mm x 108 mm mounting plate that can be removed without the need to dismantle the Peltier assembly and can be worked on, i.e. individual mounting patterns can be drilled by the customer. The kit comes with graphite foil and screws pre-mounted. The Peltier modules can be configured for either 12 or 24 VDC. Depending on cooling requirements, the 60 x 60 mm fans' speed can be reduced for quiet operation. We also carry a large range of suitable temperature controllers that can be found here. If your application requires higher cooling capacities, take a look at our mRC-C-450-100/240 mini Recirculating Chiller and our liquid cooling solutions offerings – or browse our large portfolio of liquid to air temperature management assemblies. Your customized direct cooler: AMS Technologies’ thermal management specialists are happy to develop a direct cooling solution tailored to your needs – based on Peltier or compressor technology – and offer all services from development and proof-of concept to series production. Get in touch with us now to discuss your customized direct cooler.  Specifications: Nominal Cooling Capacity: 130 W (@+25°C Ambient, +25°C Mounting Plate (Bottom)) Power Consumption per Fan (Manufacturer’s Data): 6 W Max. Noise (Manufacturer’s Data): 49 dB(A) Coefficient of Performance (COP): 0.57  Applications: Direct Cooling and Precise Temperature Control of Laser Diode Modules With Power Dissipation of up to 130 W  

mini Liquid Cooling Evaluation Kit; Cooling Capacity 450 W @+25°C; Power Supply 24 VDC Key Features: Up to 450 W Cooling Capacity Ideal for Compact Cooling of Lasers or Bio Reagents Ideal for Mobile Cooling Applications Compressor Speed Control for Ease of Temperature Control Low Vibration, Low Noise Lightweight, Compact Easy to Integrate Kit to Interface With OEM Water Circuit and Electronics Control Components Carefully Designed to Match Each Other The mLC-C-450-24-KIT is a sealed vapor compression circuit with a speed controlled miniature rotary BLDC compressor. The evaporator is a brazed plate heat exchanger, the interface to the customer liquid coolant circuit.  The mLC-C-450-24-KIT comes with the separate 24 VDC inverter board. The compressor speed can be set from the upper control system by frequency or analog signal. The condenser is an aluminum finned copper tube heat exchanger coil and must be cooled by forced convection, i.e. a 120x120 mm fan or equivalent. The heat exchanger stainless steel plates are nickel brazed suitable for a variety of coolant fluids, such as water, DI water and glycol-water mixtures. The plate heat exchanger has male R ¼” connectors for the customer to connect its water circuit. The mLC-C-450-24-KIT’s condenser is an aluminum finned copper tube heat exchanger coil and must be cooled by forced convection, i.e. a 120x120 mm fan or equivalent. The heat exchanger stainless steel plates are nickel brazed suitable for a variety of coolant fluids, such as water, DI water and glycol-water mixtures. The plate heat exchanger has male R ¼” connectors for the customer to connect its water circuit. If you are looking for a ready-to-use recirculating chiller based on this mLC-Kit that includes the coolant loop, have a look at our mRC-C-450-100/240 mini Recirculating Chiller as well as our other liquid cooling solutions offerings – or browse our large portfolio of liquid to air temperature management assemblies. For lower cooling capacities, we also carry a Peltier-based mini Direct Cooling KIT providing up to 130 W with no liquids or moving parts (except fans). Your customized liquid cooler: AMS Technologies’ thermal management specialists are happy to develop a liquid cooling solution tailored to your needs – based on Peltier or compressor technology – and offer all services from development and proof-of concept to series production. Get in touch with us now to discuss your customized liquid cooler. Specifications: Cooling Capacity: Approximately 450 W (at 100 rps, Twater = +25°C, Tambient = +25°C) Power Supply Consumption: < 150 W (6 A @24 VDC, 80 rps) Temperature Range (Ambient, Operating): -10°C to +45°C Hydraulic Parameters: Pressure Drop 30 kPa @4 lpm Controller/Inverter Board: Operating Range 20 to 100 rps, Speed Command Square Wave Pulse Frequency 40 to 200 Hz, Variable Resistor Input 2 kΩ to 10 kΩ Dimensions: 200 x 172 x 180 mm (WxHxD) Weight: 3.4 kg Applications: Compact Cooling of Lasers or Bio Reagents With up to 450 W Cooling Capacity; Mobile Cooling Application; Evaluation Kit to Interface With OEM Water Circuit and Electronics Control

Cooling Capacity 270 W @+20°C; Process Fluid Flow Rate 0.75 lpm @10 psig; 1/8" Female Valved CPC Fittings; Magnetically-coupled Gear Pump; Wetted Materials Aluminium High Reliability in a Compact Size: Solid State Cooling’s TCube mini 270 ultra compact thermoelectric recirculating chiller is built upon the foundation of the supplier’s UC160-190 family, with a larger fluid tank (~180 ml) and 1.4 to 1.6 times more cooling capacity. This new product line uses the same highly reliable thermoelectric technology and precise control algorithms as the UC160-190 family. TCube mini 270 responds instantly to changes in load, holding to ±0.1°C, even when controlling near ambient. As the world’s smallest recirculating chiller, TCube mini 270 integrates easily either inside or next to the system being controlled. Using universal input power, these units are very energy efficient, using power only when needed. Key Features: Ultra Compact, Reliable and Efficient Built upon the Legacy of UC160-190, Same 13 x 19 cm Footprint With 40-60% More Cooling Capacity Cooling Capacity: ~270 W @+20°C (+20°C Ambient) Weighs Less Than 4.5 kg Larger, Screw-top Fluid Reservoir: 180 ml With Level Sensor ±0.1°C Temperature Stability/Repeatability With Constant Load (Even Near Ambient) Responds Quickly to Change in Load Designed for Ease of Use and Long-life Reliability, With no Compressor and no Freon Magnetically-coupled Long Life Gear Pump Set-up for 750 ml Per Minute Flow Separate 24 VDC Power Supply With Universal 100-240 VAC Input Consumes Less Than 300 W of Power RS232 Communications Interface Can Be Easily Integrated Inside Your System Operating Range: +2°C to +45°C Ambient Temperature Range: +10°C to +40°C Non-condensing Noise (@1 m): <63 dBA Coolant/Process Fluid: Koolance (27% Propylene Glycol / Water Mix) or 27-50% Ethylene Glycol / Water Mix Process Fluid Fittings: 1/8" Female CPC Quick Connect With Shut-off Valve Flow Rate: ~750 ml/min @10 psig (0.7 bar) Wetted Materials: Aluminium Cold Plate With Compatible Wetted Materials (Copper or Stainless Steel Cold Plates Planned) Communications: Keypad or RS232 Interface Alarms: Temperature, Fluid Level, System or Component Failure (Display, RS232 and Dry Contact) Standards: TUV, Listed to UL, CAN/CSA, and EN 61010-1, CE 61010-1, RoHS compliant Dimensions (L x W x H): 19 cm x 13 cm x 23 cm Applications: Ideal for Laboratory Use, Low-light CCD Cameras, Analytical Instruments, Lab Automation, and Many Other Applications

Refractive Index 1.56; 250 cps Viscosity at 25°C Norland Optical Adhesive 88 ("NOA 88") is an optically clear, liquid adhesive that will cure when exposed to long wavelength ultraviolet light. The adhesive is a one-part, 100% solids material that offers advantages in optical bonding applications. The use of NOA 88 eliminates premixing, drying, or heat curing operations common to other adhesive systems. Curing time can be regulated by the end user by varying the intensity of the curing source.NOA 88 was formulated as a low outgassing (CVCM) and low Total Mass Loss (TML) adhesive. The ideal applications for this adhesive is for coating of parts destined for space exploration, bonding of high tech computer components,adhering parts in very sensitive instruments and coating sensitive components.NOA 88 is cured by ultraviolet light (315 nm to 395nm) with maximum sensitivity at 365 nanometers. The adhesive requires 5 Joules/sq.cm of energy to fully cure a 25 to 50 micron bond. The material has low oxygen inhibition, so adhesive exposed to air will cure tack-free with sufficient exposure to UV light.Typical Properties of NOA 88 Solids 100% Refractive Index of Monomer 1.52 Elongation at Failure 41% Modulus of Elasticity (psi) 131,000 Tensile Strength (psi) 2,000 Hardness - Shore D 90 Total Mass Loss (TML) 1.07% Collected Volatile Condensable Material (CVCM) <0.01% Dielectric Constant (1 MHz) 4.06 Dielectric Strength (V/mil) 457 Dissipation Factor (1 MHz) 0.0341 Volume Resistivity (ohm-cm) 6.85 x 10 to the 14 power Surface Resistivity (MEgohms) 3.71 x 10 to the 12 power The shelf life of the liquid material is at least four months from the shipment date if kept in a cool (5-22° C) dark place in the original container. If refrigerated, allow the adhesive to come to room temperature prior to use.