mDC-T-130-24-KIT Thermoelectric Plate-To-Air Cooling Kit

Flat, Bent, Finned or Embedded; Thermal Conductivity 5,000-200,000 W/m•K; Heat Transfer Over Relatively Long Distances; Long Life; No Maintenance Noren’s unique technology and design process allow to create customized heat pipe systems with intricate bends, angles and flatness. Long life and no maintenance are added benefits of Noren’s heat pipe designs and assemblies Heat pipes can be implemented for a wide variety of applications and can be designed in any combination of bends, planes, angles and dimensions. Whether flat, bent, finned or embedded, Noren’s custom heat pipes and heat sinks are designed to optimize the thermal management capabilities of virtually any application. Heat pipes are the most common passive, capillary-driven of the two-phase systems. Two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. As the heat pipe technology industry leader, Noren products has specialized in the design and development and manufacturing of passive, two-phase heat transfer devices since 1968. Heat pipes have an extremely effective high thermal conductivity. While solid conductors such as aluminium, copper, graphite and diamond have thermal conductivities ranging from 250 W/m•K to 1,500 W/m•K, heat pipes have effective thermal conductivities that range from 5,000 W/m•K to 200,000 W/m•K. Heat pipes transfer heat from the heat source (evaporator) to the heat sink (condenser) over relatively long distances through the latent heat of vaporization of a working fluid. Heat pipes typically have 3 sections: an evaporator section (heat input/source), adiabatic (or transport) section and a condenser section (heat output/sink). To better solve your thermal removal requirements, Noren’s heat pipes offer the unique ability to achieve different bends, planes and dimensions within designs. Noren is able to create solutions with multiple angles and planes, all while maintaining the heat transfer needed for your custom application. Standard Bend Radiuses for Heat Pipes:   Round Bent Pipe Center-line Bending Radius [mm Round Bent-Flattened Pipe Center-line Bending Radius [mm] Flattened-Bent Pipe Inside Bending Radius [mm] Tube Diameter [mm] Standard Minimum Standard Minimum Standard Minimum Ø 3,18 9,53 4,78 9,53 4,78 6,35 3,18 Ø 4,75 11,13 5,54 11,13 5,54 6,35 3,18 Ø 6,35 14,30 9,53 14,30 9,53 9,53 4,75 Ø 7,92 17,48 13,49 17,48 13,49 9,53 4,75 Ø 9,53 23,83 14,27 23,83 14,27 12,70 6,35 Ø 12,70 38,10 22,23 38,10 22,23 19,05 9,53 Ø 15,88 38,10 30,18 38,10 30,18 25,40 12,70 Noren also offers and delivers custom bending solutions. Noren’s experienced engineers and production team consistently produce exceptional heat transfer in various configurations. Get in touch with the AMS Technologies thermal management experts today to discuss your customized heat pipe solution tailored to your project’s challenges. Key Features: Any Combination of Bends, Planes, Angles and Dimensions Flat, Bent, Finned or Embedded Extremely High Thermal Conductivity: 5,000 to 200,000 W/m•K Heat Transfer From Heat Source to Heat Sink Over Relatively Long Distances Long Life No Maintenance Flat, Bent, Finned or Embedded Applications: Optimize the Thermal Management Capabilities of Virtually Any Application

Compressor Refrigerant Circuit and TEC Cascaded; Cooling Capacity 4W @-50°C; Ultra Wide Temperature Range -50-+150°C Key Features: Cascading of Compressor Refrigerant Circuit and Peltier Element Refrigerant Directly Cooling the Peltier Element’s Hot Side Ultra Wide Temperature Range -50°C to +150°C in a Compact System Very precise temperature control Stable Operation @-50°C With 4 W Cooling Capacity No Need for Coolant (Water) Loop No Corrosion/Erosion Low Vibration, Low Noise AMS Technologies’ mDC-CT-4-KIT direct cooling system cascades a thermoelectric (Peltier) element and a compressor-based refrigerant circuit. Based on the "direct evaporation" technology, the compressed refrigerant evaporates directly on the hot side of the thermoelectric (Peltier) module and thus dissipates the heat very effectively and with high heat flux. The Compressor/ Peltier cascade significantly expands the temperature range of the capabilities of the individual technologies, enabling a very wide operating temperature range from -50°C to +150°C in a compact device. Utilizing suitable insulation, constant operation at -50°C is possible, while still providing about 4 W cooling power at this extreme temperature point. The mDC-CT-4-KIT mini compressor/thermoelectric plate-to-air cooling kit does not require a water circuit, is very quiet, low-vibration and maintenance-free. Possible applications are in the fields of analytics, molecular reactors, rheology, or viscosity measurement – or wherever very low temperatures have to be maintained with moderate heat loads. Direct evaporation technology is also very suitable for cooling and temperature stabilization of laser diodes or laser diode stacks at temperatures of around +25°C – an application area covered by AMS Technologies’ mDC-T-130-24-KIT thermoelectric plate-to-air cooling kit. For customer requirements that cannot be covered by our mDC-T-130-24-KIT or mDC-CT-4-KIT, AMS Technologies’ thermal management specialists are happy to develop a direct cooling solution tailored to your needs – based on Peltier or compressor technology, or both – and offer all services from development and proof-of concept to series production. Get in touch with us now to discuss your customized direct cooler. Specifications: Set Temperature Range: -50°C to +150°C Cooling Capacity at Tambient 25°C and Tplate 25°C: 40 W Cooling Capacity at Tambient 25°C and Tplate -50°C: 4 W Applications: Analytics; Molecular Reactors; Rheology; Viscosity Measurement; Wherever Very Low Temperatures Have to be Maintained With Moderate Heat Loads

Ultra-compact, Adjustable Output; Input Voltage 12, 15, 24 VDC; Output Voltage 0 to 1,500 VDC; Output Power 0.5 to 1 W  The MTM series of PCB mount, ultra compact, regulated, high voltage DC/DC converters for flat mounting is the ideal solution for PMTs and other devices that need a bias voltage ranging from 0 to 1,500V, with very low current. Key Features: Miniature and Lightweight Tight Line/Load Regulation Low Ripple (0.003% p. to p.) Arc and Continuous Short Circuit Protection Flat or Raised PCB Mounting Voltage Monitoring Applications: Photomultiplier Tubes (PMT); Avalanche Photo Diodes (APD); Photodiodes (PD)

 The AMS-127-1.4-2.5 is a high-performance thermoelectric cooler (TEC) engineered for precision thermal regulation in industrial, scientific, and medical applications. With a Qmax of 37.4W and a maximum temperature differential (dTmax) of 72K, this advanced Peltier module delivers stable and efficient cooling performance for semiconductors, laser systems, medical devices, and industrial electronics.Manufactured using high-quality Al₂O₃ ceramic materials, this 40x40 mm TEC module ensures superior heat dissipation, durability, and long-term operational reliability. The low electrical resistance (Rac 3.2Ω) optimizes power efficiency, making it an ideal choice for critical thermal management applications.Key FeaturesReliable Cooling Performance – Delivers a Qmax of 37.4W, ensuring efficient heat transfer in demanding applications.Optimized Electrical Efficiency – Operates at Umax 16.3V and Imax 3.7A, ensuring stable and energy-efficient cooling.Wide Temperature Differential – With a dTmax of 72K, this TEC module offers excellent thermal control in diverse environments.Durable and Compact Design – Features a 40x40 mm rectangular form factor with a 4.8 mm height, allowing easy integration into compact cooling assemblies.High-Quality Ceramic Construction – Built with Al₂O₃ ceramic, offering superior thermal conductivity and structural stability.Low Electrical Resistance for Maximum Efficiency – With Rac of 3.2Ω, it minimizes power loss while maintaining consistent cooling performance.Reliable Lead Wires – Equipped with 24 AWG wires, with 200mm stripped leads without tinning, ensuring secure electrical connections.ROHS Compliant and Epoxy-Sealed – Designed for long-term durability and environmental safety, ensuring compliance with industry standards.ApplicationsSemiconductor Thermal Management – Provides effective cooling for microprocessors, high-power chips, and sensors, ensuring optimal performance.Medical and Laboratory Equipment – Ensures temperature stability in diagnostic instruments, cryogenic research devices, and laser-based medical systems.Laser and Optoelectronic Systems – Supports efficient heat dissipation for high-power laser diodes, optical sensors, and photonic instruments.Industrial Electronics and Instrumentation – Maintains stable operating temperatures for precision testing equipment, automated systems, and electronic control units.Aerospace and Automotive Thermal Management – Provides reliable cooling solutions for high-performance automotive and aerospace applications.What’s Next?The AMS-127-1.4-2.5 Thermoelectric Cooler is an energy-efficient, reliable, and high-performance TEC module, ideal for critical applications requiring precise thermal regulation. Designed with advanced thermoelectric technology, this module ensures long-term durability and optimal cooling efficiency.For technical support, product availability, or customized thermal solutions, consult a thermal engineering expert to integrate this TEC into your system.

Cooling Capacities 350 - >600W @ 20°C; Noise @ 1 m < 48 dBA ;Tank Volume 300 ml; Gear or Centrifugal Pump; Process Wetted Materials Aluminium; Facility Wetted Materials Stainless SteelThe ThermoCube II Liquid-to-Liquid Recirculating Chiller by Solid State Cooling Systems is a high-performance thermoelectric solution designed for environments where facility water or process chilled water (PCW) is available. This next-generation chiller offers precise temperature control, whisper-quiet operation, and exceptional configurability, making it ideal for demanding laboratory, semiconductor, and OEM applications.Unlike conventional air-cooled systems, the ThermoCube II Liquid-to-Liquid removes heat using PCW, eliminating the need for fans and heat sinks. This design significantly reduces noise and vibration while enhancing thermal efficiency. With a cooling capacity of up to 600 watts at 20°C and a temperature stability of ±0.05°C, the unit ensures consistent performance even near ambient conditions. Its compact footprint—13 x 11 x 13 inches (32 x 28 x 32 cm)—and lightweight build (28 lbs / 13 kg) allow easy integration into space-constrained setups.Key FeaturesLiquid-to-Liquid Heat Removal: Uses facility water or PCW to dissipate heat, ideal for installations with existing chilled water infrastructure.Thermoelectric Technology: Solid-state cooling with no refrigerants or compressors, ensuring long life and low maintenance.High Precision Control: Digital PID controller maintains ±0.05°C stability across a standard operating range of 5°C to 50°C (extendable to -10°C or 65°C).Quiet and Vibration-Free: Operates below 48 dBA, making it suitable for sensitive environments.Flexible Configuration: Offers 6 pump types (centrifugal or gear) and 8 fitting options including John Guest, CPC, and Swagelok.Universal Power Input: 100–240 VAC, 50/60 Hz, plug-and-play compatibility worldwide.Advanced Communication: RS232, RS485, Ethernet, and TTL interfaces for seamless system integration.Robust Construction: Stainless steel cold plate and facility wetted materials for corrosion resistance and long-term reliability.Safety and Compliance: Equipped with alarms for temperature, fluid level, and system faults; certified to UL, CE, CAN/CSA, and RoHS standards.ApplicationsSemiconductor Equipment: Maintains precise thermal conditions for wafer processing and lithography systems.Life Sciences and Biotech: Supports temperature-sensitive assays, microfluidics, and sample preparation.Laser Cooling: Provides stable cooling for diode lasers and photonics systems requiring high-pressure fluid delivery.Electron Microscopy: Ensures consistent thermal control for scanning electron microscopes and imaging platforms.OEM Integration: Easily embedded into diagnostic, analytical, and industrial systems with existing PCW infrastructure.What's Next?If your facility has access to process chilled water and requires compact, reliable, and precise thermal control, the ThermoCube II Liquid-to-Liquid Recirculating Chiller is the ideal solution. With its modular design, solid-state reliability, and global compatibility, it delivers performance tailored to your application.Contact our sales team today to discuss your configuration needs, request a quote, or explore integration options for your system.