mDC-T-130-24-KIT Thermoelectric Plate-To-Air Cooling Kit

mini Liquid Cooling Evaluation Kit; Cooling Capacity 1200 W @+25°C; Power Supply 24 VDC Key Features: Up to 1200 W Cooling Capacity Ideal for Compact Cooling of Lasers or Bio Reagents Compressor Speed Control for Ease of Temperature Control Low Vibration, Low Noise Lightweight, Compact Easy to Integrate Kit to Interface With OEM Water Circuit and Electronics Control Components Carefully Designed to Match Each Other The mLC-C-1200-24-KIT is a sealed vapor compression circuit with a speed controlled miniature rotary BLDC compressor. The evaporator is a brazed plate heat exchanger, the interface to the customer liquid coolant circuit. The mLC-C-1200-24-KIT comes with the separate 24 VDC inverter board. The compressor speed can be set from the upper control system by frequency or analog signal. The mLC-C-1200-24-KIT’s condenser is an aluminum finned copper tube heat exchanger coil and must be cooled by forced convection, i.e. a 200 mm diameter fan or equivalent. The heat exchanger stainless steel plates are nickel brazed suitable for a variety of coolant fluids, such as water, DI water and glycol-water mixtures. The plate heat exchanger has male R ¼” connectors for the customer to connect its water circuit.For lower heat loads, we also carry a mLC-C-450-24-KIT with up to 450 W cooling capacity, or a Peltier-based mini Direct Cooling KIT providing up to 130 W with no liquids or moving parts (except fans). If you are looking for a ready-to-use recirculating chiller that includes the coolant loop, have a look at our family of mini Recirculating Chiller Kits (mRC-KITs) as well as our our other liquid cooling solutions offerings – or browse our large portfolio of liquid to air temperature management assemblies . Your customized liquid cooler: AMS Technologies’ thermal management specialists are happy to develop a liquid cooling solution tailored to your needs – based on Peltier or compressor technology – and offer all services from development and proof-of concept to series production. Get in touch with us now to discuss your customized liquid cooler.Specifications: Cooling Capacity: Approximately 930 W (at 59 rps, Twater = +20°C, Tambient = +40°C) to 1760 W (at 90 rps, Twater = +20°C, Tambient = +20°C) Power Supply Consumption: ≤720 W (30 A @24 VDC) Temperature Range (Ambient, Operating): +15°C to +45°C Hydraulic parameters:    Pressure Drop 40 mbar @6 lpm, 100 mbar @9 lpm Controller/Inverter Board: Operating Range 28 to 100 rps, Speed Command Square Wave Pulse Frequency 56 to 200 Hz, Variable Resistor Input 2.8 to 10 kΩ Dimensions: 250 x 386 x 248 mm (WxHxD) Weight: 10 kg Applications: Compact Cooling of Lasers or Bio Reagents With up to 1200 W Cooling Capacity; Evaluation Kit to Interface With OEM Water Circuit and Electronics Control  

 The AMS-127-1.4-2.5 is a high-performance thermoelectric cooler (TEC) engineered for precision thermal regulation in industrial, scientific, and medical applications. With a Qmax of 37.4W and a maximum temperature differential (dTmax) of 72K, this advanced Peltier module delivers stable and efficient cooling performance for semiconductors, laser systems, medical devices, and industrial electronics.Manufactured using high-quality Al₂O₃ ceramic materials, this 40x40 mm TEC module ensures superior heat dissipation, durability, and long-term operational reliability. The low electrical resistance (Rac 3.2Ω) optimizes power efficiency, making it an ideal choice for critical thermal management applications.Key FeaturesReliable Cooling Performance – Delivers a Qmax of 37.4W, ensuring efficient heat transfer in demanding applications.Optimized Electrical Efficiency – Operates at Umax 16.3V and Imax 3.7A, ensuring stable and energy-efficient cooling.Wide Temperature Differential – With a dTmax of 72K, this TEC module offers excellent thermal control in diverse environments.Durable and Compact Design – Features a 40x40 mm rectangular form factor with a 4.8 mm height, allowing easy integration into compact cooling assemblies.High-Quality Ceramic Construction – Built with Al₂O₃ ceramic, offering superior thermal conductivity and structural stability.Low Electrical Resistance for Maximum Efficiency – With Rac of 3.2Ω, it minimizes power loss while maintaining consistent cooling performance.Reliable Lead Wires – Equipped with 24 AWG wires, with 200mm stripped leads without tinning, ensuring secure electrical connections.ROHS Compliant and Epoxy-Sealed – Designed for long-term durability and environmental safety, ensuring compliance with industry standards.ApplicationsSemiconductor Thermal Management – Provides effective cooling for microprocessors, high-power chips, and sensors, ensuring optimal performance.Medical and Laboratory Equipment – Ensures temperature stability in diagnostic instruments, cryogenic research devices, and laser-based medical systems.Laser and Optoelectronic Systems – Supports efficient heat dissipation for high-power laser diodes, optical sensors, and photonic instruments.Industrial Electronics and Instrumentation – Maintains stable operating temperatures for precision testing equipment, automated systems, and electronic control units.Aerospace and Automotive Thermal Management – Provides reliable cooling solutions for high-performance automotive and aerospace applications.What’s Next?The AMS-127-1.4-2.5 Thermoelectric Cooler is an energy-efficient, reliable, and high-performance TEC module, ideal for critical applications requiring precise thermal regulation. Designed with advanced thermoelectric technology, this module ensures long-term durability and optimal cooling efficiency.For technical support, product availability, or customized thermal solutions, consult a thermal engineering expert to integrate this TEC into your system.

Manufacturer part number: 19030616A. Manufacturer series name: Sprint DC. DC Fan. Need this device customised? Please call us.

Flat, Bent, Finned or Embedded; Thermal Conductivity 5,000-200,000 W/m•K; Heat Transfer Over Relatively Long Distances; Long Life; No Maintenance Noren’s unique technology and design process allow to create customized heat pipe systems with intricate bends, angles and flatness. Long life and no maintenance are added benefits of Noren’s heat pipe designs and assemblies Heat pipes can be implemented for a wide variety of applications and can be designed in any combination of bends, planes, angles and dimensions. Whether flat, bent, finned or embedded, Noren’s custom heat pipes and heat sinks are designed to optimize the thermal management capabilities of virtually any application. Heat pipes are the most common passive, capillary-driven of the two-phase systems. Two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. As the heat pipe technology industry leader, Noren products has specialized in the design and development and manufacturing of passive, two-phase heat transfer devices since 1968. Heat pipes have an extremely effective high thermal conductivity. While solid conductors such as aluminium, copper, graphite and diamond have thermal conductivities ranging from 250 W/m•K to 1,500 W/m•K, heat pipes have effective thermal conductivities that range from 5,000 W/m•K to 200,000 W/m•K. Heat pipes transfer heat from the heat source (evaporator) to the heat sink (condenser) over relatively long distances through the latent heat of vaporization of a working fluid. Heat pipes typically have 3 sections: an evaporator section (heat input/source), adiabatic (or transport) section and a condenser section (heat output/sink). To better solve your thermal removal requirements, Noren’s heat pipes offer the unique ability to achieve different bends, planes and dimensions within designs. Noren is able to create solutions with multiple angles and planes, all while maintaining the heat transfer needed for your custom application. Standard Bend Radiuses for Heat Pipes:   Round Bent Pipe Center-line Bending Radius [mm Round Bent-Flattened Pipe Center-line Bending Radius [mm] Flattened-Bent Pipe Inside Bending Radius [mm] Tube Diameter [mm] Standard Minimum Standard Minimum Standard Minimum Ø 3,18 9,53 4,78 9,53 4,78 6,35 3,18 Ø 4,75 11,13 5,54 11,13 5,54 6,35 3,18 Ø 6,35 14,30 9,53 14,30 9,53 9,53 4,75 Ø 7,92 17,48 13,49 17,48 13,49 9,53 4,75 Ø 9,53 23,83 14,27 23,83 14,27 12,70 6,35 Ø 12,70 38,10 22,23 38,10 22,23 19,05 9,53 Ø 15,88 38,10 30,18 38,10 30,18 25,40 12,70 Noren also offers and delivers custom bending solutions. Noren’s experienced engineers and production team consistently produce exceptional heat transfer in various configurations. Get in touch with the AMS Technologies thermal management experts today to discuss your customized heat pipe solution tailored to your project’s challenges. Key Features: Any Combination of Bends, Planes, Angles and Dimensions Flat, Bent, Finned or Embedded Extremely High Thermal Conductivity: 5,000 to 200,000 W/m•K Heat Transfer From Heat Source to Heat Sink Over Relatively Long Distances Long Life No Maintenance Flat, Bent, Finned or Embedded Applications: Optimize the Thermal Management Capabilities of Virtually Any Application

Compressor Refrigerant Circuit and TEC Cascaded; Cooling Capacity 4W @-50°C; Ultra Wide Temperature Range -50-+150°C Key Features: Cascading of Compressor Refrigerant Circuit and Peltier Element Refrigerant Directly Cooling the Peltier Element’s Hot Side Ultra Wide Temperature Range -50°C to +150°C in a Compact System Very precise temperature control Stable Operation @-50°C With 4 W Cooling Capacity No Need for Coolant (Water) Loop No Corrosion/Erosion Low Vibration, Low Noise AMS Technologies’ mDC-CT-4-KIT direct cooling system cascades a thermoelectric (Peltier) element and a compressor-based refrigerant circuit. Based on the "direct evaporation" technology, the compressed refrigerant evaporates directly on the hot side of the thermoelectric (Peltier) module and thus dissipates the heat very effectively and with high heat flux. The Compressor/ Peltier cascade significantly expands the temperature range of the capabilities of the individual technologies, enabling a very wide operating temperature range from -50°C to +150°C in a compact device. Utilizing suitable insulation, constant operation at -50°C is possible, while still providing about 4 W cooling power at this extreme temperature point. The mDC-CT-4-KIT mini compressor/thermoelectric plate-to-air cooling kit does not require a water circuit, is very quiet, low-vibration and maintenance-free. Possible applications are in the fields of analytics, molecular reactors, rheology, or viscosity measurement – or wherever very low temperatures have to be maintained with moderate heat loads. Direct evaporation technology is also very suitable for cooling and temperature stabilization of laser diodes or laser diode stacks at temperatures of around +25°C – an application area covered by AMS Technologies’ mDC-T-130-24-KIT thermoelectric plate-to-air cooling kit. For customer requirements that cannot be covered by our mDC-T-130-24-KIT or mDC-CT-4-KIT, AMS Technologies’ thermal management specialists are happy to develop a direct cooling solution tailored to your needs – based on Peltier or compressor technology, or both – and offer all services from development and proof-of concept to series production. Get in touch with us now to discuss your customized direct cooler. Specifications: Set Temperature Range: -50°C to +150°C Cooling Capacity at Tambient 25°C and Tplate 25°C: 40 W Cooling Capacity at Tambient 25°C and Tplate -50°C: 4 W Applications: Analytics; Molecular Reactors; Rheology; Viscosity Measurement; Wherever Very Low Temperatures Have to be Maintained With Moderate Heat Loads