mDC-CT-4-KIT mini Compressor/Thermoelectric Plate-to-Air Cooling Kit

Multi-Stage Thermoelectric ModulesImax 2.8-9.5 A; Qmax 10-59 A; Vmax 5.27-15.8 V; ΔTmax 83-86 KMulti-stage thermoelectric modules from S&PF MODUL are engineered for solid-state cooling applications that require significantly higher temperature differentials than single-stage solutions can provide. By stacking multiple Peltier stages in a cascaded architecture, these modules enable deep cooling while retaining the inherent advantages of thermoelectric technology, including precise control, mechanical robustness, and maintenance-free operation. With more than 30 years of experience in thermoelectric design and production, S&PF MODUL delivers multi-stage modules with predictable performance and long-term reliability for scientific and industrial use.The multi-stage design allows each thermoelectric layer to contribute incrementally to the overall temperature drop, making these modules suitable for applications that demand low cold-side temperatures under controlled heat loads. High-quality semiconductor materials, durable ceramic substrates, and stable internal interconnections ensure consistent electrical and thermal characteristics, even during continuous operation or repeated thermal cycling. The portfolio includes a wide range of stage counts, form factors, and power ratings to support flexible system design. Key features• Cascaded multi-stage Peltier architecture for high temperature differentials• Designed for deep cooling beyond the limits of single-stage thermoelectric modules• Wide selection of standard configurations with varying stage counts and cooling capacities• High-grade thermoelectric semiconductor materials with stable performance• Robust ceramic substrates and metallization for long-term mechanical and thermal reliability• Customization options for dimensions, electrical parameters, and lead layouts• Low thermal resistance interfaces for efficient coupling to heat sinks or liquid cooling systems• Controlled manufacturing processes for reproducible unit-to-unit performance• Suitable for continuous operation in precision cooling environments ApplicationsS&PF MODUL multi-stage thermoelectric modules are used in applications where extended temperature differentials and precise thermal control are essential. Typical use cases include cooling of infrared detectors, CCD and CMOS sensors, and other highly sensitive components in analytical and imaging systems. They are also employed in spectroscopy, laser diode stabilization, and scientific instrumentation that operates at reduced temperatures to improve signal quality and measurement accuracy.Additional applications include cryogenic pre-cooling stages, compact laboratory refrigeration units, environmental simulation equipment, and advanced test systems in aerospace, telecommunications, and automotive development. In these contexts, multi-stage thermoelectric modules provide a compact and reliable alternative to compressor-based cooling technologies, particularly where vibration-free operation and fine temperature control are required. What’s next?Achieving optimal performance with a multi-stage Peltier module requires careful consideration of heat load, target temperature differential, electrical supply, and heat rejection design. Our sales and application experts support you in selecting and specifying the appropriate S&PF MODUL multi-stage thermoelectric module for your system. Contact our sales team to request detailed technical data, discuss custom configurations, or receive a quotation tailored to your application requirements.

0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square Our high performance cold plates made from friction stir welded aluminium are the ideal solution for cooling demanding power semiconductors and modules. Within our range, a variety of models are available from a 1.4 kg cold plate dedicated to one press pack disk semiconductor all the way to a large and powerful 22.6 kg version capable of dissipating the heat of six 140 mm x 190 mm IGBT modules. In addition to various standard configurations, our thermal management experts are happy to customize solutions regarding thermodynamics and fluid dynamics as well as the configuration of power modules. The use of friction stir welding technology (FSW) makes the production of our cold plates both safe and economical. Friction stir welding technology permits particularly homogeneous joints without additional welding material. Due to this homogeneity of the material, FSW joints are particularly corrosion-resistant and can withstand high loads. With their high heat dissipation capacity, the cold plates are suitable for the following applications, among others: 62 mm Power Semiconductor Modules 150 x 166 mm Cold Plates 140 x 190 mm Power Semiconductor Modules PrimePACK 3 Power Semiconductor Modules EconoPack Power Semiconductor Modules Press-Pack Discs Aluminium water cold plates for IGBT modules are available in standard configurations, suitable for 130x140, 140x190, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Infineon PrimePACK2 and PrimePACK3, EconoDual3, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. When cooling press pack power semiconductor discs, even and uniform pressure distribution is very important. Our FSW cold plates, specially designed for cooling press packs, are suitable for 4", 5" and 6" discs, offering a solid construction, perfectly flat surfaces for an optimal contact to the power semiconductor as well as very good thermal performance. For optimum handling, we offer different options for centering the Press Pack discs as well as tools for replacement.  

Vapor Compression Chiller; 1000 W @+35°C (amb)/+25°C (water); Flow Rate 5.5 lpm @ 0.5 bar, Temperature Stability ≥±0.05 K at constant load; Power Supply 90-264 VAC Key Features: Recirculating Water Chiller Easy to be Integrated in Customer Application User-Definable PID Parameters and Fan Velocity Silent Operation with Low Vibration and Noise Ideal for Water Cooling Tasks up to 1000 W Customizable booster cooling capacity IoT Ready as an Option: Remote Operation, Monitoring and Service over Integrated Ethernet Interface Depending on the temperatures of coolant (water) and ambient, AMS Technologies’ mRC-C-1000-100/240 recirculating chiller provides approximately 1000 W (Twater = +25°C, Tambient = +35°C) in silent mode boostable to higher cooling capacities with higher fan speeds. The chiller contains a compressor-based refrigerant circuit as well as a closed, recirculating coolant (water) circuit. Due to its speed-controlled compressor, the mRC-C-1000-100/240 recirculating chiller offers low vibration and noise throughout the compressor’s BLDC speed range. The system’s features include global operability due to a universal 90 to 264 VAC power supply, as well as an optional integrated Ethernet interface allowing remote operation, monitoring and service. Further options are a gear pump providing 5 bar @5 l/min, CPC inlet and/or outlet fittings, external coolant filters or dust filters, and a hardware set for 19” rack mount (6U). For lower heat loads, we also carry a mRC-C-450-100/240 mini Recirculating Chiller with up to 450 W cooling capacity. Specifications: Cooling Capacity: nominal 1 kW (Twater = +25 °C, Tambient = +35 °C) Temperature Stability: +-0.05°C at constant load Available Pressure Head: 0.5 bar @ 5.5 lpm (standard), 5 bar @ 5 lpm (optional) Control: Local, RS232, IoT Ready, Interlock Power Supply: 90 to 264 VAC, 24 VDC Derivative for OEM integrations available on Demand Power Consumption: <750 W Options: 19” Rack Mount (6U); Ethernet / IoT Ready; Optional Pumps; CPC Inlet/Outlet Fittings; External Coolant Filters; External Dust Filters; Green Version Based on Propane (R290) as Refrigerant Dimensions: 443 x 283 x 675 mm, Main Body Without Filter Approval: CE (in process) Applications: Water Cooling of Lasers and Other Applications with up to 1000 W Heat Load