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TAPI Fiber-to-Fiber Isolators

Product information "TAPI Fiber-to-Fiber Isolators"

Single Stage and Dual Stage Versions; Fiber Type Corning SMF-28e; 1310, 1550 nm; Return Loss ≥50 dB; Power Handling ≤500 mW

Tap/Isolator device is made by special packaging technology, which combines Tap and isolator into a compact package. It has Tap and isolator function at the same time. It is widely used in EDFA and other fields.

Key Features:

  • Compact size
  • Low insertion loss
  • High channel isolation
  • Low cost
Manufacturer "LightComm Technology"
LightComm Technology, CO. Ltd, founded in 2000 by a team of optical component engineers with more than 20 years experience, is a leading, innovative company of fiber optical components. LightComm provides cost effective solutions based on Fused Fiber Couplers, PLC, CWDM/DWDM Filters, EDFA, Pump Combiners, Isolators, PM Fiber Components, Connectors and Integrated Modules technologies. High level research, development and design work enable LightComms products extremely flexible in meeting client requirements.
Related links of the manufacturer
Information on the manufacturer (information obligations under the GPSR Product Safety Regulation)
Lightcomm Technology Co., Ltd
2F, Building A&D, Gao xinqi Science and Technology Park, No.2, Liuxian 1st Road of Bao'an District
Shenzhen, China

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>1300 nm; Mode Field Dia. 9.2, 10.4 µm; Cladding Dia. 80 µm; Dual Acrylate Coating; Cutoff Wavelength ≤1290 nm Manufactured with Corning’s patented Outside Vapor Deposition (OVD) process and based on decades of experience in specialty fiber development, Corning® RC SMF specialty single mode (SM) fiber sets the industry standard for consistent geometric properties, high mechanical reliability and efficient splicing. This low-loss fused fiber with a cladding diameter of 80 µm is well suited for EDFA and small bend radius applications. AMS Technologies and Corning provide technical support for splicing the RC SMF special single mode fiber to fiber products with 125 µm cladding diameter. Key Features: Outstanding Consistency and Uniformity Using Patented Outside Vapor Deposition (OVD) Process Dual Acrylate Coating System Provides Excellent Protection and Superior Mechanical Robustness Ultra-tight Specifications World-class Reliability Support for Handling and Deployment Technical Support for Splicing to 125 µm Fiber Products Ultra-low Splice Loss to SMF-28e+® 80 μm Diameter for Miniature Packaging Low Bending Loss Excellent Geometry Control Applications: Low-loss Miniature Fused Devices for C-band and L-band; Ultra-compact Components Requiring Small Bend Radii; Pigtails in Bend Insensitive Applications; Sensors
Product number: SW11006

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