QCL500 OEM(+) Quantum Cascade Laser Driver

2-64,000 µF; 1-100 kV; ESL 35-1200 nH General Atomics provides leading-edge technology, extensive design expertise, quality manufacturing services, and comprehensive testing to deliver the highest quality metal case capacitors to meet your requirements. This series of metal case capacitors features a wide range of capabilities from high-peak-current microsecond discharges to high energy density, self-healing, long-life designs. If you would like more information or would like to find out more about General Atomics’ design and customization services (including custom high-voltage, very-high-voltage, high-energy-density and MIL-spec capacitors) to meet your specific voltage and capacitance requirements, please contact AMS Technologies.   Series Type Voltage Capacitance & ESL Key Features CMX Self-Healing Energy Storage Capacitors 2.8 to 13.2 kV 575 to 64,000 µF; 150 to 1,200 nH Self-healing Metalized Film Capacitors in Welded Metal Cans; Up to 3.0 J/cc; Designed for Millisecond Discharge; Standard Ratings up to 13 kV and 255 kJ CMF Self-Healing Energy Storage Capacitors 5.6 to 26 kV 255 to 9,500 µF; 150 to 800 nH Self-healing Metalized Film Capacitors in Welded Metal Cans; Designed for Millisecond Discharge; Standard Ratings to 26 kV and 200 kJ C Energy Storage High-voltage Capacitors 10 to 100 kV 3 to 830 µF; 35 to 100 nH Extended Foil Capacitors in Welded Metal Cans; Standard Ratings up to 100 kV; Low Inductance, High Peak Current; Low-profile Bushings DM Metalized Capacitors 1 to 3 kV 25 to 750 µF; 75 to 200 nH Self-healing Metalized Film Capacitors in Drawn Metal Cans; Designed for Industrial Rep-rate Applications; Peak Currents up to 11.6 kA DP General-purpose Pulse Capacitors 2 to 15 kV 2 to 185 µF; 50 to 200 nH Extended Foil Capacitors in Drawn Metal Cans; For Pulsed Applications Such as Lasers, Flash Lamps and Other Circuits Where Moderate to Long Life is Required   Applications: High-voltage, Low-inductance, Pulsed Applications; Particle Accelerators; Pulsed High-field Magnets; Excimer Lasers; High-power Microwave Sources; Pulse Shaping or Peaking in Large Pulse-power Systems; Military Research Projects and Fielded Systems

OFDR Technology; Spatial Resolution 20 µm; Max. Device Length 20, 40 m; Center Wavelength 1546.69 nm; Wavelength Range 40 nm; Dynamic Range 15, 70 dB The Luna 6415 lightwave component analyzer is a fast and simple-to-use analyzer for passive optical components and modules, extending Luna’s industry-leading optical frequency domain reflectometry (OFDR) platform to manufacturing test and quality control applications. Unlike traditional passive component testers, Luna 6415 measures and analyzes the insertion loss (IL) and return loss (RL) distribution as well as length with a single instrument, working in either reflection or transmission. The Luna 6415 lightwave component analyzer utilizes optical frequency domain reflectometry (OFDR) technology to measure backscattered or transmitted light as a function of distance. The system features extremely high sensitivity, 20 μm spatial sampling resolution and very fast scanning for high test throughput, making it an ideal testing tool for photonic integrated circuits (PICs) and silicon photonics. By integrating both reflection and transmission measurements, Luna 6415 reduces the cost and complexity of test while increasing throughput and provides more complete test coverage of your component. The Luna 6415 lightwave component analyzer further simplifies your manufacturing test with an integrated tunable laser source , automated IL and RL calculations, self-calibration and very high scanning speeds for greater test throughput. Key Features: Return Loss (RL) and Insertion Loss (IL) Analysis Trace Distributed Return Loss (RL) Over Length of Optical Path – Easily Measure Waveguide Scattering Spectral Analysis of Return Loss (RL) and Insertion Loss (IL) Detect and Precisely Locate Reflective Events and Measure Path Length Speed, Resolution and Accuracy for Optimizing Production Test High Spatial Sampling Resolution: 20 μm Measurement Range: 20 m Scan/Acquisition Rate: 6 Hz Maximum Device Length: 20 m (Reflection), 40 m (Transmission) Wavelength Range: 40 nm Center Wavelength: 1546.69 nm Maximum Optical Power: 5 mW Dynamic Range: 70 dB (RL Measurement), 15, 70 dB (IL Measurement, Reflection / Transmission Mode) Return Loss Measurement Sensitivity: -135 dB Measurement Resolution: ±0.1 dB Applications: Spatial RL Testing; Automated Insertion Loss (IL) Test and Analysis; Skew Measurement With Sub-picosecond Resolution; PLCs, Waveguide Devices, AWGs, ROADMs, etc.; Couplers, Switches, Beamsplitters

Fiber Type Single Mode, Multi Mode, Polarization Maintaining (PM/PZ); Number of Fibers ≤128 (V-Grooves), ≤4096 (2D Arrays); Fiber Cladding Outer Ø 125 µm (V-Grooves), 125 to 220 µm (2D Arrays); Connector Options SMA, FC, ST, SC, LC, MTP, etc.Fiberguide produces extremely tight tolerance one-dimensional (V-Grooves) and two-dimensional arrays using the supplier’s patented manufacturing techniques. These arrays range from a few fibers to thousands of fibers depending on the application. Optical Arrays are used in optical switching and in sensing applications where spatial optical data is necessary, such as DNA sequencing, astronomy and nuclear research. For high temperature applications, some fiber types can be aluminium or gold coated on request. Additionally, all fiber types can be equipped on demand with Fiberguide’s patented RARe Motheye anti-reflective technology that enhances fiber transmission performance and significantly increases the damage threshold for your application over a large wavelength range. Key Features: Fiber Type: Single Mode, Multi Mode Array End: Precision Machined Housings, Silica V-Grooves or Custom Silicon Wafers Connector Options: SMA, FC, ST, SC, LC, MTP, etc. Packaging: Design and Production of Custom Array Housings and Sheathing Arrangements Available to Protect the Fiber Depending on the Application Standard Temperature Range: -40 to + 100 °C Applications: Fiber Optic Switch; Signal Processing; Astronomical Analysis; Military Mapping; DNA Micro-array Technology; Optical Tomography