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LPAD PINAMP Mini-DIL Optical Receivers

Product information "LPAD PINAMP Mini-DIL Optical Receivers"

1310, 1550 nm; Data Rate 4-1,024 Mb/s; Sensitivity -50—31 dBm; Responsivity 0.85, 0.9 A/W; Transfer Gain 4,000-40,000 V/W; Output Impedance 30-60 Ω

With the LPAD PINAMP series, OSI LaserDiode provides a low-cost, high-performance miniature optical receiver module which integrates a high-speed, high-responsivity, low-leakage-current InGaAs photodiode with a GaAs transimpedance amplifier.

LPAD series’ transimpedance amplifier incorporates automatic gain control providing high optical overload performance. The receiver package offers high reliability which satisfies Telcordia GR-468-CORE specifications.

OSI LaserDiode’s LPAD PINAMP series pigtailed receivers are available with industry standard FC, LC, SC, and ST connectors. Custom connectors are also available on request.

Key Features:

  • Data Rates: 4 Mb/s, 52 Mb/s, 155 Mb/s, 622 Mb/s, 1 Gb/s
  • High Responsivity and Low Dark Current InGaAs PIN Detector
  • High Sensitivity @10-9 (BER): -50 to -31 dBm
  • Overload @-5 VDC: -4, 0 dBm
  • Transfer Gain @1310 nm: 4,000 to 40,000 V/W
  • Output Impedance: 30 Ω to 60 Ω
  • Wide Dynamic Range
  • Single Supply Operation: 5 VDC (4.75 to 5.25 VDC)
  • Hermetic Package
  • Single Ended
  • Differential Output (1 Gb/s only)
  • GR-468-CORE Telcordia Qualified
  • Operating Temperature: -40 °C to +85 °C

Applications: Supervisory Channel; Long-haul Transmission Networks; Short-haul Transmission Networks; DWDM Transponders; SDH/SONET Single Mode (SM) Applications; Instrumentation and Testing; Data Communications; Gigabit Ethernet

Manufacturer "OSI LaserDiode"
OSI LaserDiode’s (LDI) comprehensive optoelectronic manufacturing facility utilizes the supplier’s core competencies and capabilities. Customers are provided with a diverse and extensive offering of dependable, quality detector and emitter products. OSI LaserDiode’s knowledgeable engineering and applications teams enable various manufacturing capabilities including but not limited to die and device fabrication, device packaging capabilities like TO-based, 14-pin DIL or butterfly packages, laser-welded fiber pigtails and hermetic packaging, fiber metallization as well as device characterization, test and qualification.
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