LDPA 0003R PINFET Optical Receiver Module

Product number: SW11576

Manufacturer: OSI LaserDiode

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LDPA 0003R PINFET Optical Receiver Module OSI LaserDiode Datasheet

Product information "LDPA 0003R PINFET Optical Receiver Module"

1310, 1550 nm; Sensitivity -54 dBm Max.; Min. Responsivity 0.9 A/W; Min. Bandwidth 3.0 MHz; Output Impedance 10 Ω

OSI LaserDiode’s LDPA 0003R PINFET optical receiver module provides an excellent solution for optical receiver systems that require both high sensitivity and wide dynamic range. Applications include telecommunications line-terminating equipment or repeaters and optical sensor systems where a user adjustable gain may be desirable for optimizing system performance.

Key Features:

High Sensitivity
Wide Dynamic Range
User-adjustable Gain
1310 nm, 1550 nm Operation
850 nm Option Available
Control Voltage: -4.5 V to 0.0 V
Minimum Bandwidth (3 dB): 3.0 MHz
Vo Limit: 0.5 Vpp to 1.0 Vpp
Minimum Optical Input Overload: -6 dBm
Supply Voltage: 5 VDC (4.5 to 5.5 VDC)
Minimum Transimpedance: 1,100.0 kΩ
Minimum Responsivity (@1550 nm): 0.9 A/W
Maximum Optical Sensitivity (@1550 nm): -54 dBm
Output Impedance: 10 Ω Typical
Load Impedance: 1,000 Ω Typical
Hermetic Package – Industry Standard 14-pin DIP Package
Custom MIL or IEC Screening
RoHS Compliant
Operating Temperature: -40 °C to +70 °C
Dimensions: 20.8 x 12.7 x 4.7 mm (w/o Fiber Pigtail)

Applications: Telecommunications Line-terminating Equipment; Repeaters; Optical Sensor Systems

Manufacturer "OSI LaserDiode"

OSI LaserDiode’s (LDI) comprehensive optoelectronic manufacturing facility utilizes the supplier’s core competencies and capabilities. Customers are provided with a diverse and extensive offering of dependable, quality detector and emitter products. OSI LaserDiode’s knowledgeable engineering and applications teams enable various manufacturing capabilities including but not limited to die and device fabrication, device packaging capabilities like TO-based, 14-pin DIL or butterfly packages, laser-welded fiber pigtails and hermetic packaging, fiber metallization as well as device characterization, test and qualification.