FCI-InGaAs-36C InGaAs Photodiodes

The INX 760 Probe Microscope by Viavi is a next-generation fiber inspection solution engineered for high-speed, high-density optical networks. Designed to meet the evolving demands of AI, hyperscale data centers, and telecom infrastructure, the INX 760 delivers fully automated inspection for single, duplex, and multifiber connectors. With its intuitive operation, rugged design, and Test Process Automation (TPA) capabilities, it ensures consistent, repeatable results in seconds—minimizing human error and maximizing operational efficiency.This field-optimized microscope is built to simplify complex inspection workflows while maintaining compliance with IEC 61300-3-35 standards. Whether you're deploying ultra-high fiber count (UHFC) networks or maintaining legacy infrastructure, the INX 760 provides the speed, accuracy, and reliability required for modern optical environments.Key FeaturesTrue Automated InspectionThe INX 760 automates every step of the inspection process—from test setup and tip configuration to image panning, focusing, and end-face analysis. This dramatically reduces inspection time and eliminates variability caused by manual operation.PanOptic Imaging EngineViavi’s proprietary PanOptic Imaging Engine delivers edge-to-edge clarity without compromising magnification or resolution. This ensures that even the smallest defects are detected across the entire field of view.AutoID Inspection TipsEliminate configuration errors with AutoID-enabled tips that automatically identify connector types and adjust settings accordingly. This feature enhances accuracy and speeds up connector changes in the field.TPA-Enabled Workflow IntegrationThe INX 760 is fully compatible with Viavi’s Test Process Automation (TPA) framework, enabling seamless integration into automated test environments. This ensures alignment, repeatability, and traceability across inspection tasks.Rugged and Field-ReadyEngineered for durability, the INX 760 is optimized for field use with a robust design that withstands harsh environments while delivering lab-grade performance.ApplicationsThe INX 760 is ideal for:AI and hyperscale data centers: Supports rapid deployment and maintenance of ultra-high fiber count (UHFC) networks.Telecommunications infrastructure: Ensures clean, compliant connections in high-bandwidth environments.Field service and installation: Reduces inspection time and training requirements for technicians in the field.Manufacturing and QA: Enables automated, repeatable inspection processes for connector production lines.

900 to 1700 nm; Active Area 0.07 mm2; AA Dia. 0.3 mm, Pitch 0.5 mm; Responsivity 0.80 to 0.85 A/W; Capacitance 8 to 10 pF; Package Flip Chip Mountable OSI Optoelectronics’ FCI-InGaAs-300B1XX series are multifunctional backside illuminated photodiode/arrays. They are available as single element diodes or 4 - or 8- element arrays with an active area of 300 µm each. These back-illuminated InGaAs photodiodes/arrays are designed to be flip chip mounted (active area facing up), or assembled face down minimizing the overall dimensions. These low inductance, low dark current, and low capacitance back illuminated photodiodes/arrays come with or without ceramic substrates. Key Features: Back Illumination High Responsivity on Both Front and Back Low Noise Spectral Range 900 to 1700 nm Applications: High Speed Optical Communications; Multichannel Fiber Optic Receiver; Power Monitoring; Single Mode (SM) Multi Mode (MM) Fiber Optic Receiver; Fast Ethernet, SONET/SDH OC-3/STM-1 ATM; Instrumentation and Analog Receivers