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Solderable Chip Si Photodiodes

Product information "Solderable Chip Si Photodiodes"

970 nm Band Optimized; Active Area 4.7 to 189.0 mm2; AA Dimensions 1.7 x 2.8 to 9.2 x 20.7 mm; Responsivity 0.60, 0.65 A/W; Capacitance 15 to 17,000 pF; Package Solderable Chip

OSI Optoelectronics’ solderable silicon photodiode chip series offer a low-cost approach to applications requiring large active area photo detectors with or without flying leads for ease of assembly and/or situations where the detector is considered "disposable".

They have low capacitance, moderate dark currents, wide dynamic ranges and high open circuit voltages. These detectors are available with two 76 mm long leads soldered to the front (anode) and back (cathode).

The photoconductive solderable series (SXXCL) is used for low-capacitance and fast-response applications, while the photovoltaic solderable series (SXXVL) is used for low-noise applications.

All devices are also available in chip form without any leads. For ordering subtract suffix 'L' from the model number, e.g. “S-100C”.

For large signal outputs, the detectors can be connected directly to a current meter or across a resistor for voltage measurements. Alternately, the output can be measured directly with an oscilloscope or with an amplifier. For further details please refer to the application note “Photodiode Characteristics and Applications” available under “Downloads”.

Key Features:

  • Large Active Area
  • Various Sizes
  • High Shunt Resistance
  • With or Without Leads


Applications: Solar Cells; Low-cost Light Monitoring; Diode Laser Monitoring; Low Capacitance

Information on the manufacturer (information obligations under the GPSR Product Safety Regulation)
OSI Optoelectronics
12525 Chadron Ave
CA 90250 Hawthorne, United States
Manufacturer "OSI Optoelectronics"
OSI Optoelectronics is a leading provider of advanced optoelectronics and electronic assemblies. These technical elements are key to enabling critical functions such as analytics and monitoring, test and measurement, communication and tracking, and imaging in a wide variety of industries, including: Aerospace & Defense, Medical & Life Sciences, Automation & Industrial Production and Automotive & Consumer Electronics.
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