Broad variety of profile geometries; Width 15 mm to 473 mm; Height 11 mm to 135 mm; Rth 0.019 °C/W to 3.347 °C/W; Weight 0.249 kg/m to 30.80 kg/m  Extruded aluminium heat sink profiles are safe for a lifetime, as fins and base plate are a single piece extrusion. The aluminium extrusion process can be used to produce a large number of different profile shapes. With modifying the profile shape, the surface that comes into contact with the air is also changed, and thus the ability to dissipate heat. Extruded heat sinks are mainly used in systems with medium electrical power, both with natural and forced convection by fans. The heat sinks utilise different surface enlargement geometries to match pressure head and flow rate of fans and blowers. For detailed information on extruded heat sinks and the many options for defining a custom solution, please contact us.

0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square Our high performance cold plates made from friction stir welded aluminium are the ideal solution for cooling demanding power semiconductors and modules. Within our range, a variety of models are available from a 1.4 kg cold plate dedicated to one press pack disk semiconductor all the way to a large and powerful 22.6 kg version capable of dissipating the heat of six 140 mm x 190 mm IGBT modules. In addition to various standard configurations, our thermal management experts are happy to customize solutions regarding thermodynamics and fluid dynamics as well as the configuration of power modules. The use of friction stir welding technology (FSW) makes the production of our cold plates both safe and economical. Friction stir welding technology permits particularly homogeneous joints without additional welding material. Due to this homogeneity of the material, FSW joints are particularly corrosion-resistant and can withstand high loads. With their high heat dissipation capacity, the cold plates are suitable for the following applications, among others: 62 mm Power Semiconductor Modules 150 x 166 mm Cold Plates 140 x 190 mm Power Semiconductor Modules PrimePACK 3 Power Semiconductor Modules EconoPack Power Semiconductor Modules Press-Pack Discs Aluminium water cold plates for IGBT modules are available in standard configurations, suitable for 130x140, 140x190, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Infineon PrimePACK2 and PrimePACK3, EconoDual3, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. When cooling press pack power semiconductor discs, even and uniform pressure distribution is very important. Our FSW cold plates, specially designed for cooling press packs, are suitable for 4", 5" and 6" discs, offering a solid construction, perfectly flat surfaces for an optimal contact to the power semiconductor as well as very good thermal performance. For optimum handling, we offer different options for centering the Press Pack discs as well as tools for replacement.  

Profiles can carry power semiconductors on two opposite sides; Width 64 mm to 180 mm; Height 45 mm to 105 mm; max Length 300 mm; Rth 0.020 °C/W to 0.2 °C/W; Weight 2.6 kg/pc. to 5.25 kg/pc. Some extruded aluminum heat sink profiles are designed in a way that heat sources can be mounted on both heat sink bases while forced air from a fan or blower flows through the hollow heat sink with internal fins. A narrow fin spacing provides the necessary very large cooling surfaces. This kind of heat sink profiles for double-sided mounting is available in lengths up to 300 mm. For detailed information on heat sinks for double-sided mounting and the many options for defining a custom solution, please contact us.