Low Refractive Index Optical Adhesives

CLETOP;Lever Cassette;Multi-Core;MTRJ

Viscosity 36,000, 180,000 mPas; Bending Adhesion Strength >114, >128 kgf/cm²; UV Curing Conditions 100 mW/cm², 2 min; Curing Shrinkage Rate 0.5%, 0.9%; Tg +195, +233 °C; Thermal Expansion Coefficient 18, 20 ppm/°CNTT Advanced Technology Corporation’s high-precision optical adhesives allow easy fixation of optical components with sub-micron accuracy. Based on epoxy, these high-precision optical adhesives are available with low viscosity of 36,000 mPas (AT3916P) or with high viscosity of 180,000 mPas (AT3862P). Both adhesives show minimal position changes due to curing time and temperature.Shrinkage rate during curing is very low for this series of high-precision optical adhesives, and the thermal expansion coefficient is small. Using ultraviolet (UV) ray curing makes alignment easy.NTT Advanced Technology Corporation’s series of high-precision adhesives show excellent durability: Even after a high-temperature process at +260 °C, the adhesives’ bonding strength does not change. And no peeling occurred after 200 cycles in a simplified heat cycle test.In order to achieve high reliability, a product must clear the tests conducted by the users themselves. If you have had even just a bit of dissatisfaction in precision or durability results in the past, please put NTT Advanced Technology Corporation’s high-precision adhesives to the test.In case you need any consulting regarding issues related to adhesion, please contact the AMS Technologies optical adhesives experts to discuss the detailed challenges of your application.Key Features:Low Shrinkage Rate During Curing: 0.5% (AT3862P), 0.9% (AT3916P)Low Thermal Expansion Coefficient: <20 ppm/°CUltraviolet (UV) Curing for Easy AlignmentExcellent Durability: No Change in Bonding Strength After +260 °C High-temperature Process, No Peeling After 200 Heat Test CyclesViscosity: 36,000, 180,000 mPasBending Adhesion Strength: >114, >128 kgf/cm²UV Curing Conditions: 100 mW/cm², 2 minGlass Transition Temperature Tg: +195, +233 °CApplications: High-precision Fixation of Optical Components With Sub-micron Accuracy

Refractive Index 1.458-1.567; Viscosity 145-2,000 mPas; Optical Transmittance (@1 mm, 1.3 µm) 82%-94%; Bond Strength 99->247 kgf/cm²; UV Curing Conditions 10, 30 mW/cm², 5, 10 minYou are looking for PLC and fiber array adhesion with high reliability? Try NTT Advanced Technology Corporation’s series of adhesives for optical waveguides!Within this series you find acrylate-based adhesives (AT6001, AT8224)with excellent durability that have cleared a large number of reliability tests. Epoxy adhesives are also part of this series, with a refractive index that can be accurately controlled within a range of 1.456 to 1.567 (±0.005, Na-D) – or with a fixed refractive index that is the same as quartz to deliver low reflectance (GA700L, GA700H).UV curing of the adhesives for optical waveguides allows for adhesion in a short time frame and makes alignment easy. The adhesives withstand a solder reflow process for Si Photonics (+260 °C).In order to achieve high reliability, a product must clear the tests conducted by the users themselves. If you have had even just a bit of dissatisfaction in reliability test results in the past, please put NTT Advanced Technology Corporation’s adhesives for optical waveguides to the test.In case you need any consulting regarding issues related to adhesion, please contact the AMS Technologies optical adhesives experts to discuss the detailed challenges of your application.Key Features:Optical Adhesive Used for PLC to Fiber Link-upPrecision Refraction Index of 1.458 to 1.567 (±0.005, Na-D) Provides ControllabilityUltraviolet (UV) Curing Conditions: 10, 30 mW/cm², 5, 10 minVery Little Adhesion Loss Due to Heat or Moisture, Providing High DurabilityViscosity: 145 to 2,000 mPasOptical Transmittance: 82% to 94% (@1 mm Thickness, Wavelength 1.3 µm)Bond Strength: 99 to >247 kgf/cm²Applications: Gluing of Optical Waveguides; PLC to Fiber Link-up; Silicon Waveguide to Fiber Link-up

5.5 x 5.5 inch Sheet; Grit 1, 9 µm; Silica, WA, Diamond; SC/UPC, FC/UPC, LC/UPC ConnectorsNTT Advanced Technology Corporation’s MC series are polishing films that can do batch processing from the resin removal up until the final polishing by utilizing the ATP-3000 polishing machine’s unique linear motion polishing method that doesn’t require conventional multi-stage polishing processes. The MC series enables everything from adhesive removal to the finish polishing to be done in one step by putting together all the necessary films for all polishing in one polishing film. By placing a buff film between each of the polishing films, the polishing and inter-process cleaning are done at one time as a batch. Customizing is available for various types of ferrule.In conventional automated polishing lines, the same number of polishing machines as the polishing processes was needed. However, by combining the unique polishing trajectory of the ATP-3000 and the MC-Film placed in a direct line from adhesive removal until final finishing, NTT Advanced Technology Corporation has realized the whole process in a single polishing machine.Since changing polishing film and cleaning operations between processes are not needed, there is a measured shortening in polishing time. Also, because automation can be done with a single polishing machine, space is also saved. The cleaning work and attaching and detaching of polishing films normally required between processes that can easily affect the polish shape and cause end face scratching are no longer needed, achieving a workability with no special skills required.Key Features:Automated Polishing with One Film on One MachineSaves Time and Space“Skill-less” OperationSheet Type 5.5 x 5.5 inch (140 x 140 mm)100 Sheets per SetCompatible with SC/UPC, FC/UPC and LC/UPC ConnectorsApplications: Batch Polishing of SC/UPC, FC/UPC and LC/UPC Fiber Connector End Faces