LE-600-L-24 LED Light

9.3, 10.6 µm; Energy 0.15-5 J; Max. Rep-rate 12-500 Hz; Max. Average Power 60, 75 W; Beam Size 8x9-25x25 mm LightMachinery’s IMPACT-2000 series of pulsed CO2 lasers are optimized for 24/7 precision processing and drilling of non-metallic materials. The material interaction of the short, high-power pulses from TEA (Transversely Excited Atmospheric) CO2 lasers is quite different from that of long pulse and continuous CO2 lasers. High-definition processing with excellent edge quality can be obtained. Plastic materials can be selectively removed from a metal backing, leaving the metal layer untouched. For many applications, IMPACT-2000 lasers offer a lower cost alternative to excimer lasers. The IMPACT-2000 series of lasers all incorporate high reliability SSM (solid state modulator) switch technology as well gas filtering systems to ensure very high uptimes and low maintenance even at continuous 75 W power delivery 24/7. Impact-2000 series lasers are ideally suited for the selective removal or machining of non-metallic layers deposited on a metallic under-layer. Unlike conventional CO2 lasers, the short pulses and high peak powers of TEA CO2 lasers enable the surface layer to be removed (“ablated”) with little or no effect on the underlying metal substrate, and with minimal thermal damage (“heat-affected zone” or “HAZ”) to the surrounding polymer material. Key Features: Pulse Energy: 0.15 to 5 J Maximum Average Power: 60, 75 W Maximum Repetition Rate: 12 to 500 Hz Beam Size (Horizontal x Vertical) at Laser: 8x9 to 25x25 mm Megawatt Peak Powers Give Excellent Edge Definition in Non-metallic Materials Greatly Reduced Heat-affected Zone (HAZ) Compared to Conventional CO2 Lasers High-reliability SSM (Solid State Modulator) Switch Technology Internal Real-time Gas Filtering Systems High Up-times and Low Maintenance Even at Continuous 75 W Power Delivery 24/7 Operation at 10.6 or 9.3 µm Variety of Pulse Energy and Repetition Rate Models Cost-effective Alternative to Excimer Lasers in Many Processes Simple to Operate Low Cost of Ownership Applications: Drilling, Patterning and Ablation of Non-metallic Materials; Selective Removal of Polymer Materials Fom a Metal Substrate With no Damage to the Metallic Backing; Wire Stripping; Medical Device Components; Drilling of Controlled-release and Rapid-release Pharmaceutical Tablets and Capsules; Microvia-hole Drilling in Printed Circuits; Flex-circuit Processing; Laser Ultrasound Non-destructive Testing