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CP20G03 Aluminum Cold Plate with Z shaped Aluminum tube, straight fittings

Product information "CP20G03 Aluminum Cold Plate with Z shaped Aluminum tube, straight fittings"

51 mm x 51 mm, 0.044 °C/W, Flat Tube Cold Plate.
The CP20™ aluminum flat tube cold plate is a very thin, compact and lightweight cold plate, consisting of header tubes welded to a unique micro-channel aluminum extrusion. This cold plate offers extremely low thermal resistance, achieved by thin mounting surfaces and internal fin, which create a large surface. It provides excellent thermal uniformity as coolant flows below the entire surface. Its high performance and small size makes it ideal for cooling small, high watt-density components such as thermoelectric modules. The CP20™ is only 3.3 mm (0.13”) thick and 0.05 kg (0.1 lbs), making it ideal for applications where space is limited. Its large internal surface area combined with its low pressure drop makes the CP20™ ideal for use with viscous and poor heat transfer fluids such as EGW, oils, Fluorinert® and Polyalphaolefin (PAO).

Manufacturer "Boyd (former Lytron and Aavid)"
Boyd is the world’s leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Boyd is also the successor of Lytron and Aavid, continuing their thermal solutions portfolio.
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0.003 K/W to 0.055 K/W; 4 l/min to 80 l/min; Power Semiconductors; square Our high performance cold plates made from friction stir welded aluminium are the ideal solution for cooling demanding power semiconductors and modules. Within our range, a variety of models are available from a 1.4 kg cold plate dedicated to one press pack disk semiconductor all the way to a large and powerful 22.6 kg version capable of dissipating the heat of six 140 mm x 190 mm IGBT modules. In addition to various standard configurations, our thermal management experts are happy to customize solutions regarding thermodynamics and fluid dynamics as well as the configuration of power modules. The use of friction stir welding technology (FSW) makes the production of our cold plates both safe and economical. Friction stir welding technology permits particularly homogeneous joints without additional welding material. Due to this homogeneity of the material, FSW joints are particularly corrosion-resistant and can withstand high loads. With their high heat dissipation capacity, the cold plates are suitable for the following applications, among others: 62 mm Power Semiconductor Modules 150 x 166 mm Cold Plates 140 x 190 mm Power Semiconductor Modules PrimePACK 3 Power Semiconductor Modules EconoPack Power Semiconductor Modules Press-Pack Discs Aluminium water cold plates for IGBT modules are available in standard configurations, suitable for 130x140, 140x190, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Infineon PrimePACK2 and PrimePACK3, EconoDual3, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. When cooling press pack power semiconductor discs, even and uniform pressure distribution is very important. Our FSW cold plates, specially designed for cooling press packs, are suitable for 4", 5" and 6" discs, offering a solid construction, perfectly flat surfaces for an optimal contact to the power semiconductor as well as very good thermal performance. For optimum handling, we offer different options for centering the Press Pack discs as well as tools for replacement.  
Product number: SW10269
Manufacturer:

IXF1.0tss M Mirror Mount
Flexure; Stainless Steel; 25.4 mm (1.0 inch); M3 (4-40), M4 (8-32)     
Product number: C006337-6
Manufacturer:

€356.50*